1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y. Update boilerplate to add device class N. Editorial changes throughout. - ro 98-10-28 R. MONNIN B Drawing updated to reflect current requirements. gt 03-04-11 R. MONNIN REV SHET REV B B B B B B B B SHEET 15 16 17 18 19 20 21 2
2、2 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DAN WONNELL DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPAR
3、TMENTS APPROVED BY RAY MONNIN AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-10-15 MICROCIRCUIT, LINEAR, 9-CHANNEL DIFFERENTIAL TRANSCEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96893 SHEET 1 OF 22 DSCC FORM 2233 APR 97 5962-E153-03 DISTRIBUTIO
4、N STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96893 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DS
5、CC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V) and nontraditional performance environment (device class N). A choice of case outlines and lead finishes ar
6、e available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96893 01 N X X Federal stock class designator RHA designator (see 1.2.1
7、) Devicetype (see 1.2.2) Deviceclass designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device c
8、lass M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Slew limit Device type Generic number Driver
9、 Receiver Circuit function 01 55976A1 8 9 9 Channel Differential Transceiver 02 55976A2 4 5 9 Channel Differential Transceiver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentat
10、ion M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-I-38535 with a non-traditional performance environment (encapsulated in plastic) Q or V Certificati
11、on and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Dual flat pack Y See figure 1 56 Plastic small outline package 1.2.5 Lead finish. The lead f
12、inish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96893 DEFENSE SUPPLY CENTER COLUMBUS COLU
13、MBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC). -0.3 V dc to +6.0 V dc Voltage range at any bus terminal -10 V dc to +15 V dc Data I/O and control (A-side) voltage range. -0.3 V dc to VCC+ 0.5 V dc Electrostatic dis
14、charge: B side and GND, Class 3: 12 kV (Human Body Model) B side and GND:. 400 V (Machine Model) All terminals, Class 3:. 4 kV (Human Body Model) 3/ All terminals:. 400 V (Machine Model) Storage temperature range (TSTG) -65C to +150C Lead temperature, soldering 1.6 mm (1/16 inch) from case for 10 se
15、conds . +260C Junction-to-ambient thermal resistance, (JA) 95.4 C/W Junction-to-case thermal resistance, (JC) . 5.67C/W Thermal-shutdown junction temperature, (TJS). 165C Maximum power dissipation at TA= 125C (in still air) (PD) 260mW 1.4 Recommended operating conditions. Supply voltage range (VCC).
16、 +4.75 V dc to +5.25 V dc Minimum high level input voltage (VIH) (except nB+, nB-) +2.0 V Maximum low level input voltage (VIL) (except nB+, nB-) . +0.8 V Voltage at any bus terminal (separately or common mode), (VO, VIor VIC) (nB+ or nB-) -7 V dc min, 12 V dc max High level output current (IOH) (Dr
17、iver) -60 mA (Receiver). -8 mA Low level output current (IOL) (Driver). +60 mA (Receiver) +8 mA Ambient operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
18、 this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL
19、-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. 1/ Stresses above the absolute maximum rating may cause permanent damage
20、 to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ This absolute maximum rating is tested in accordance with MIL-STD-883C, Method 3015.7. Provided by IHSNot for ResaleNo reproducti
21、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96893 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-H
22、DBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following docum
23、ents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the
24、issues of the documents cited in the solicitation. ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Publication 95 - Registered and Standard Outlines for Semiconductor Devices. (Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
25、22201-3834). (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict be
26、tween the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requireme
27、nts for device classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requireme
28、nts for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device cl
29、asses N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth tabl
30、e(s) shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambien
31、t operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
32、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96893 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL
33、-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall
34、 be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Marking for device class N. For PEM packages MIL-PRF-38535 marking is not required. Marking on the device shall include; a traceable date code, country of origin, pin one ind
35、icator, and manufacturers identification. In addition, the QML certification mark and the PIN as shown in 1.2 herein shall be marked on the topside of the package. Manufacturer may at their option place the QML certification mark adjacent to the PIN. In all cases, the purchase order shall reflect th
36、e SMD PIN as shown in 1.2 herein. 3.5.2 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compli
37、ance. For device classes N, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be lis
38、ted as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes N, Q, and V, the requirements of MIL-PRF-
39、38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lo
40、t of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verificati
41、on and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit gr
42、oup assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 77 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9689
43、3 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TA +125C +4.75 V VCC +5.25 V VCCDevice type Group A subgroups Limits 3/ Unit u
44、nless otherwise specified Min Max Driver differential high- level output voltage VODHS1 to A, see figure 3 VT= 5 V 4.75 V to 5.25 V All 1 1.0 V 2, 3 0.7 S1 to B, see figure 3 1 0.8 2, 3 0.7 Driver differential low- level output voltage VODLS1 to B, see figure 3 VT= 5 V 4.75 V to 5.25 V All 1 -1.0 V
45、2, 3 -0.7 S1 to A, see figure 3 1 -0.8 2, 3 -0.7 High level output voltage VOHA side, VID= 200 mV see figure 4 IOH= -8 mA 4.75 V to 5.25 V All 1, 2, 3 4.0 V Low level output voltage VOLA side, VID= -200 mV see figure 4 IOL= 8 mA 4.75 V to 5.25 V All 1, 2, 3 0.8 V Receiver positive differential input
46、 threshold voltage VIT+IOH= -8 mA, see figure 4 4.75 V to 5.25 V All 1, 2, 3 0.2 V Receiver negative differential input threshold voltage VIT-IOL= 8 mA, see figure 4 4.75 V to 5.25 V All 1, 2, 3 -0.2 V Receiver input hysteresis (VIT+- VIT-) VhysTA= 25C 5.0 V All 1 24.0 mV See footnotes at end of tab
47、le. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96893 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristic
48、s - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TA +125C +4.75 V VCC +5.25 V VCCDevice type Group A subgroups Limits 3/ Unit unless otherwise specified Min Max Bus input current IIVIH= 12 V, Other input at 0 V 5.0 V All 1, 2, 3 1.0 mA 0.0 V 1.0 VIH= -7 V, Other inpu
49、t at 0 V 5.0 V -0.8 0.0 V -0.8 High-level input current IIHA, BSR, CRE, and DE/RE VIH= 2.0 V 4.75 V to All 1, 2, 3 -100 A CDE0, CDE1 and CDE2 5.25 V +100 Low-level input current IILA, BSR, CRE, and DE/RE VIH= 0.8 V 4.75 V to All 1, 2, 3 -100 A CDE1, CDE1 and CDE2 5.25 V +100 Short circuit output current IOSnB+ or nB- 4.75 V to 5.2
