1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 07-01-18 Raymond Monnin REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry E. Shaw DEFENSE SUPPLY C
2、ENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tuan D. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond L. Monnin MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, 8-BIT IDENTITY AND AGENCIES OF THE DEPARTM
3、ENT OF DEFENSE DRAWING APPROVAL DATE 97-05-15 COMPARATORS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-97591 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E628-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC
4、IRCUIT DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device
5、 class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97591 01 Q R X
6、 Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
7、 marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as
8、follows: Device type Generic number Circuit function 01 54F521 8-bit identity comparators 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to th
9、e requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive d
10、esignator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or GDFP3-F20 20 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class
11、 M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltag
12、e range (VCC) . -0.5 V to +7.0 V Input voltage range (VIN) . -1.2 V to +7.0 V 2/ Input current range (IIN) . -30 mA and +5 mA Maximum power dissipation (PD) 176 mW Voltage range applied to any output in the high state . -0.5 V to VCCCurrent into any output in the low state . 40 mA Storage temperatur
13、e range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V to 5.5 V High-level input voltage (VIH) . 2 V minimum Low-level input voltage (VIL) 0.8 V maximum Input clamp cur
14、rent (IIK) . -18 mA maximum High-level output current (IOH) . -1 mA maximum Low-level output current (IOL) 20 mA maximum Case operating free-air temperature (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and
15、handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTME
16、NT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these docum
17、ents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the refe
18、rences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at
19、 the maximum levels may degrade performance and affect reliability. 2/ The input voltage ratings may be exceeded provided the input current ratings are observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
20、2-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the d
21、evice manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specif
22、ied herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in
23、 accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and timing wavefor
24、ms. The test circuit and timing waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I
25、 and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed i
26、n 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall
27、 still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required
28、 in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of t
29、his drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
30、 supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as requir
31、ed for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herei
32、n) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documen
33、tation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 11 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleN
34、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC
35、+125C Group A subgroups Limits Unit unless otherwise specified Min Max Input clamp voltage VIKVCC= 4.5 V, II= -18 mA 1,2,3 -1.2 V High-level output voltage VOHVCC= 4.5 V, IOH= -1 mA 1,2,3 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 20 mA 1,2,3 0.5 V Input current IIVCC= 5.5 V, VI= 7 V 1,2,3 0
36、.1 mA High level input current IIHVCC= 5.5 V, VI= 2.7 V 1,2,3 20 A Low level input current IILVCC= 5.5 V, VI= 0.5 V 1,2,3 -0.6 mA Output short circuit 1/ current IOSVCC= 5.5 V, VO= 0 V 1,2,3 -60 -150 mA Supply current ICCVCC= 5.5 V 2/ 1,2,3 32 mA Functional test VIN= VIHMin or VILMax, Verify output
37、VO, VCC= 4.5 V, See 4.4.1b 7, 8 L H VIN= VIHMin or VILMax, Verify output VO, VCC= 5.5 V, See 4.4.1b 7, 8 L H Propagation delay time, low-to high level output, tPLH3/ 9 2.7 10 ns from any P or Q to Q = P 4/ 10,11 2.7 14 Propagation delay time, high-to-low level output, tPHL3/ 9 3.7 10 from any P or Q
38、 to Q = P 4/ 10,11 3.2 12 Propagation delay time, low-to high level output, tPLH3/ 9 2.2 6.5 ns from OE to Q = P 4/ 10,11 2.2 8.5 Propagation delay time, high-to-low level output, tPHL3/ 9 2.7 9 from OE to Q = P 4/ 10,11 2.7 13.5 1/ Not more than one output should be shorted at a time, and the durat
39、ion of the short circuit should not exceed one second. 2/ ICCis measured with all inputs at 4.5 V. 3/ For group A subgroup 9, VCC= 5 V, CL= 50 pF, and RL= 500 . 4/ For group A subgroups 10, 11, VCC= 4.5 V to 5.5 V, CL= 50 pF, and RL= 500 . Provided by IHSNot for ResaleNo reproduction or networking p
40、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, 2 Terminal number Terminal symbol 1 OE 2 P0 3 Q0 4 P1 5 Q1 6 P2 7 Q2 8 P3 9
41、 Q3 10 GND 11 P4 12 Q4 13 P5 14 Q5 15 P6 16 Q6 17 P7 18 Q7 19 Q = P 20 VCCFIGURE 1. Terminal connections. INPUTS OUTPUT P, Q OE Q = P P = Q L L P Q X H X H H FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
42、 DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9759
43、1 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics; PRR 1 MHz, tr= tf 2.5 ns, and duty cycle = 50 %. 3. The outputs are measured one at a time
44、 with one transition per measurement. FIGURE 4. Timing diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97591 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FOR
45、M 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit,
46、 or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification
47、 and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1)
48、Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and
