DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf

上传人:wealthynice100 文档编号:701344 上传时间:2019-01-01 格式:PDF 页数:12 大小:65.46KB
下载 相关 举报
DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf_第1页
第1页 / 共12页
DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf_第2页
第2页 / 共12页
DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf_第3页
第3页 / 共12页
DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf_第4页
第4页 / 共12页
DLA SMD-5962-98659-2001 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《微型电路 混合型 数字线型 12位双通道 模数转换器》.pdf_第5页
第5页 / 共12页
点击查看更多>>
资源描述

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREVSHEETREVSHEETREV STATUS REVOF SHEETS SHET 123456789101PMIC N/A PREPARED BY Gary ZahnDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYMichael C. JonesPOST OFFICE BOX 3990COLUMBUS, OHIO 43216-5000http:/www.dscc.dla.milTHIS DRAWING I

2、SAVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYRaymond MonninMICROCIRCUIT, HYBRID, DIGITAL-LINEAR,12-BIT, DUAL CHANNEL, ANALOG TODIGITAL CONVERTERAND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE01-06-18AMSC N/AREVISION LEVEL SIZEACAGE CODE67268 5962-98659SHEET1 OF 11DSCC FORM 2233APR 97

3、5962-E350-01DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-98659DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LE

4、VEL SHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. Achoice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). Whenavailable, a choice of

5、 radiation hardness assurance levels are reflected in the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 98659 01 H X X G01G01 G01G01 G01G01G01G01 G01G01 G01G01G01 G01 G01 G01 G01 G01 Federal RHA Device Device Case Leadstock class designator type class outline finishdesignato

6、r (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHAlevels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA d

7、evice.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 AD10265BZ Dual channel, 12-bit, 65 MSPS, MCM, analog to digital converter1.2.3 Device class designator. This device class designator shall be a single letter identify

8、ing the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,and E) or QML Listing (Class G and D). The product assurance levels are as follows:Device class Device performance documentationK Highest re

9、liability class available. This level is intended for use in spaceapplications.H Standard military quality class level. This level is intended for use in applicationswhere non-space high reliability devices are required.G Reduced testing version of the standard military quality class. This level use

10、s theClass H screening and In-Process Inspections with a possible limited temperaturerange, manufacturer specified incoming flow, and the manufacturer guarantees (butmay not test) periodic and conformance inspections (Group A, B, C, and D).E Designates devices which are based upon one of the other c

11、lasses (K, H, or G)with exception(s) taken to the requirements of that class. These exception(s) mustbe specified in the device acquisition document; therefore the acquisition documentshould be reviewed to ensure that the exception(s) taken will not adversely affectsystem performance.D Manufacturer

12、specified quality class. Quality level is defined by the manufacturersinternal, QML certified flow. This product may have a limited temperature range.1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package st

13、yleX See figure 1 68 Leaded ceramic chip carrier1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-98659DEFENSE SUPPLY CENTER COLUMBUSCOLUMBU

14、S, OHIO 43216-5000REVISION LEVEL SHEET3DSCC FORM 2234APR 971.3 Absolute maximum ratings. 1/Positive supply voltage (VCC) . 0 V dc to +7.0 V dcNegative supply voltage (VEE) 0 V dc to -7.0 V dcAnalog input voltage -7.0 V dc to +7.0 V dcAnalog input current. -10 mA to +10 mADigital input voltage (ENCOD

15、E). 0 V dc to +7.0 V dcENCODE, ENCODE differential voltage . 4 V dcDigital output current -40 mA to +40 mADigital input voltage range . +0.5 V to VEEPower dissipation (PD) . 2.4 WThermal resistance junction-to-case (G02JC) 2.2G03C/WThermal resistance junction-to-ambient (G02JA). 24.3G03C/WJunction t

16、emperature (TJ) +175G03CStorage temperature -65G03C to +150G03CLead temperature (soldering, 10 seconds) +300G03C1.4 Recommended operating conditions.Positive supply voltage (VCC) . +4.75 V dc to +5.25 V dcNegative supply voltage (VEE) -5.20 V dc to -4.75 V dcCase operating temperature range (TC). -2

17、5G03C to +125G03C2. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed inthe issue of t

18、he Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38534 - Hybrid Microcircuits, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MI

19、L-STD-1835 - Interface Standard Electronic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from t

20、he StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supe

21、rsedes applicable laws and regulations unless aspecific exemption has been obtained.1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduct

22、ion or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-98659DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET4DSCC FORM 2234APR 973. REQUIREMENTS3.1 Item requirements. The individual item performance requirements for device classes D,

23、 E, G, H, and K shall be inaccordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or asdesignated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections here

24、in may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and notperform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the appl

25、icable deviceclass.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifiedin MIL-PRF-38534 and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.3.2.2 Terminal connections. The te

26、rminal connections shall be as specified on figure 2.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics areas specified in table I and shall apply over the full specified operating temperature range.3.4 Electrical test requiremen

27、ts. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be markedwith the PIN listed in 1.2 herein. In ad

28、dition, the manufacturers vendor similar PIN may also be marked in MIL-HDBK-103 andQML-38534.3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device describedherein shall maintain the electrical test data (variables format) from the initial qual

29、ity conformance inspection group A lotsample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and forthose which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturerand be made

30、available to the preparing activity (DSCC-VA) upon request.3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to thisdrawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers produc

31、t meetsthe performance requirements of MIL-PRF-38534 and herein.3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot ofmicrocircuits delivered to this drawing.4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. Sampling and

32、 inspection procedures shall be in accordance with MIL-PRF-38534 or asmodified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect theform, fit, or function as described herein.4.2 Screening. Screening shall be in accordance with MIL-PRF-38534.

33、The following additional criteria shall apply:a. Burn-in test, method 1015 of MIL-STD-883.(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision levelcontrol and shall be made available to either DSCC-VA or the acquiring activity upon reque

34、st. Also, the test circuitshall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intentspecified in test method 1015 of MIL-STD-883.(2) TAas specified in accordance with table I of method 1015 of MIL-STD-883.b. Interim and final electrical test parame

35、ters shall be as specified in table II herein, except interim electrical parametertests prior to burn-in are optional at the discretion of the manufacturer.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-98659DEF

36、ENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET5DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics.Test Symbol Conditions 1/-25G03C G04 TC G04 +125G03CGroup AsubgroupsDevicetypeLimits Unitunless otherwise specifiedMin MaxOffset error OFFERROR 2/ 1,2,3 01 -10

37、 +10 mV1 -1.5 +1.5Gain error AVERROR 3/2,301-2.5 +2.5%FSARIN1 99 101ARIN2 198 202Analog input resistanceARIN32/ 1,2,3 01396 404G05Input capacitance CIN TA= +25G03C 2/ 4/ 4 01 7.0 pFLogic “1“ voltage(analog)VIH 2/ 5/ 6/ 1,2,3 01 2.0 5.0 VLogic “0“ voltage(analog)VIL 2/ 5/ 6/ 1,2,3 01 0 0.8 VLogic “1“

38、 current(analog)IIH VINH = 5 V 2/ 5/ 6/ 1,2,3 01 800 G06ALogic “0“ current(analog)IIL VINL = 0 V 2/ 5/ 6/ 1,2,3 01 -400 G06ALogic “1“ voltage(digital)VOH 7/ 1,2,3 01 2.8 VLogic “0“ voltage(digital)VOL 8/ 1,2,3 01 0.5 VSupply currents ICCTOTAL 1,2,3 01 520 mAENCODE pulse widthhighENCHI 2/ 4,5,6 01 6.

39、5 nsENCODE pulse widthlowENCLO 2/ 4,5,6 01 6.5 nsOutput delay tDD TA= +25G03C 2/ 4 01 7.0 12.5 nsMaximum conversion rateCNVMAX 4,5,6 01 65 MSPSSee footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGS

40、IZEA5962-98659DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET6DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics - Continued.Test Symbol Conditions 1/-25G03C G04 TC G04 +125G03CGroup AsubgroupsDevicetypeLimits Unitunless otherwise specifiedMin Max4 75Anal

41、og input at 1.24 MHz5,6 744 71Spurious free dynamicrange 10/SFDRAnalog input at 17 MHz5,60170dBFS4 62Analog input at 1.24 MHz5,6 60.54 61Analog input at 17 MHz5,6 604 61 Signal-to-noise ratio 11/ SNRAnalog input at 32 MHz5,60159.5dBFS4 61Analog input at 1.24 MHz5,6 604 61Analog input at 17 MHz5,6 59

42、.54 61Signal-to-noise anddistortion 12/SINADAnalog input at 32 MHz5,60159dBFSTwo tone intermodulationdistortion rejection 13/IMD f1 and f2 are -7 dB 4,5,6 01 66 dBcSee footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

43、MICROCIRCUIT DRAWINGSIZEA5962-98659DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET7DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics - Continued.Test Symbol Conditions 1/-25G03C TC G04 +125G03CGroup AsubgroupsDevicetypeLimits Unitunless otherwise specifi

44、edMin MaxChannel to channelisolation 14/ISO TA= +25G03C 2/ 4 01 80 dB+4.75 V G04 VCC G04 +5.25 V 2/ 0.02 %FSR/% VCCPower supply rejectionratioPSRR-5.20 V G04 VEE G04 -4.75 V 2/7,8 010.02 %FSR/% VEE1/ VCC(analog) = +5 V dc, VEE = -5 V dc, and VCC(digital) = +5 V dc, unless otherwise specified.2/ Para

45、meter shall be tested as part of device initial characterization and after design and process changes. Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested.3/ Gain test is preformed on AIN1 over the specified input voltage range. 4/ Input capacitance

46、specifications combines die and package capacitance5/ ENCODE (pins 29 and 51) driven single-ended source: ENCODE (pins 28 and 52) bypassed to ground through0.01 G06F capacitor. 6/ ENCODE (pins 29 and 51) may also be driven differentially in conjunction with ENCODE (pins 28 and 52).7/ Outputs sourcin

47、g 10 G06A or less.8/ Outputs sinking 10 G06A or less.9/ Maximum conversion rate allows for variation in ENCODE DUTY CYCLE of 50%, 5%.10/ Analog input signal equals -1 dBFS; SFDR is the ratio of converter full scale to worst spur.11/ Analog input signal power at -1 dBFS; signal-to-noise ratio (SNR) i

48、s the ratio of signal level to total noise(first 5 harmonics removed). ENCODE = 65 MSPS.12/ Analog input signal power at -1 dBFS; signal-to-noise and distortion (SINAD) is the ratio of signal level to total noiseplus harmonics. ENCODE = 65 MSPS.13/ Both input zones at -7 dBFS; two tone intermodulation distortion (IMD) rejection is the ratio of either tone to the worst thirdorder intermod product. f1 = 17.0 MHz 100 kHz, f2 = 18.0 MHz 100

展开阅读全文
相关资源
猜你喜欢
  • ASTM D5129-1995(2008) Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《使用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5129-1995(2008) Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《使用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5129-1995(2014) Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《采用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5129-1995(2014) Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《采用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5129-1995(2014)e1 Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《采用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5129-1995(2014)e1 Standard Test Method for Open Channel Flow Measurement of Water Indirectly by Using Width Contractions《采用收缩宽度法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5130-1995(2003) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《使用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5130-1995(2003) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《使用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5130-1995(2008) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《使用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5130-1995(2008) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《使用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5130-1995(2014) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《采用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf ASTM D5130-1995(2014) Standard Test Method for Open-Channel Flow Measurement of Water Indirectly by Slope-Area Method《采用比降面积法迂回测量明渠水流流量的标准试验方法》.pdf
  • ASTM D5131-1990(2001) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 逆电渗析体系记录的保管的标准指南》.pdf ASTM D5131-1990(2001) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 逆电渗析体系记录的保管的标准指南》.pdf
  • ASTM D5131-1990(2007) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 反向电渗析系统用记录保存的标准指南》.pdf ASTM D5131-1990(2007) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 反向电渗析系统用记录保存的标准指南》.pdf
  • ASTM D5131-1990(2014) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 逆电渗析体系记录的保管的标准指南》.pdf ASTM D5131-1990(2014) Standard Guide for Record Keeping for Electrodialysis Electrodialysis Reversal Systems《电渗析 逆电渗析体系记录的保管的标准指南》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1