ECA EIA-971-2014 4 mm Embossed Carrier Taping of Micro-Sized Surface Mount Components for Automatic Handling.pdf

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1、 EIA STANDARD 4 mm Embossed Carrier Taping of Micro-Sized Surface Mount Components for Automatic Handling EIA-971 April 2014 EIA-971 ANSI/EIA-971 Approved: April 15, 2014 NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings

2、 between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any

3、 member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or i

4、nternationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Pub

5、lication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport t

6、o address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Pro

7、posal No. 5237, formulated under the cognizance of the Committee on EIA National Automatic Component Handling Standards). Published by Electronic Components Industry Association 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document i

8、s copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-41

9、3-5184), International (303-397-7956) i 4 mm EMBOSSED CARRIER TAPING OF MICRO-SIZED SURFACE MOUNT COMPONENTS FOR AUTOMATIC HANDLING CONTENTS Page 1 SCOPE 1 2 INTRODUCTION 1 3 APPLICABLE DOCUMENTS 1 4 REQUIREMENTS 1-3 5 ACKNOWLEDGEMENTS 9 6 ADDENDUM 10 Figures Figure 1 4 mm carrier tape dimensions 4

10、Figure 2 Maximum pocket offset 4 Figure 3 Maximum Component Tilt, Rotation and Lateral Movement 6 Figure 4 Bar Code Label Area 6 Figure 5 Bending Radius for 4 mm Carrier Tape 7 Figure 6 Maximum Camber for 4 mm Carrier Tape 7 Figure 7 Leader and Trailer Dimensions for 4 mm Carrier Tape 7 Figure 8 Ree

11、l dimensions for 4 mm Carrier Tape 8 Tables Table 1 4 mm Carrier Tape Dimensions (mm) 5 Table 2 Reel Dimensions for 4mm Carrier Tape 8 Left intentionally blank. EIA-971 Page 1 4 mm EMBOSSED CARRIER TAPING OF MICRO-SIZED SURFACE MOUNT COMPONENTS FOR AUTOMATIC HANDLING Adopted from IEC 60286-3 for Typ

12、e 2B embossed carrier tapes. (From Standards Proposal Number 5237, formulated under the cognizance of the EIA Automated Component Handling Committee (ACH).) 1 Scope This Standard covers requirements for taping micro-sized surface mount components onto embossed carrier tape 4 mm wide and with 1 mm po

13、cket pitch. 2 Introduction This Standard was formulated to provide dimensions and tolerances necessary to tape micro-sized surface mount components such that they may be automatically handled. 3 Applicable Documents Unless otherwise specified the following documents form a part of this standard to t

14、he extent specified herein: EIA-383 “Preparation for the Delivery of Electrical and Electronic Components” EIA-481 “8 mm Through 200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling” ANSI/ESD S541 “Packaging Material Standards for

15、ESD Sensitive Items” EIA-556 “Electronic Industries Association Outer Shipping Container Bar Code Label Standard” EIA-583 “Packaging Material Standards for Moisture Sensitive Items” EIA-624 “Product Package Bar Code Label Standard for Non-Retail Applications” JEP95 “JEDEC Registered and Standard Out

16、lines for Solid State and Related Products” IPC 7351 “Generic Requirements for Surface Mount Design and Land Pattern Standard” 4 Requirements 4.1 Carrier tapes, cover tapes, reels, and taped components must meet the requirements defined in the Figures and Tables presented herein. 4.2 Procurement doc

17、uments and quotation requests shall include the following information: EIA-971 Page 2 (a) Reference to this Standard by Title and Number. (b) Taping quality requirements including maximum number of missing components. (c) Container and reel marking requirements (including bar code labeling if requir

18、ed), and reel diameter (refer to 4.12 and Figure 4). (d) Shipping conditions, storage conditions and storage time. (e) Weight of the reel containing components. 4.3 Several conditions exist that may cause functional problems with carrier tapes and/or tape feeding systems even though the dimensions a

19、re within the parameters specified in the tables and figures of this document: a) Users may experience problems feeding low mass components due to electrostatic effects (attraction and/or repulsion) associated with the separation of the cover tape and carrier tape during the feeding operation. The r

20、esult of this phenomenon could cause devices to migrate, or be propelled away from the user pick up point, resulting in a mis-pick or non-pick situation during placement. To minimize this phenomenon, it is recommended that the packaging materials, component placement equipment, and controlled enviro

21、nmental conditions be optimized to effectively dissipate any charge buildup. This charge, commonly referred to as tribo-electric charge, should be controlled per the guidelines in ANSI/ESD S541. b) Carrier tapes may experience feeding problems when passed through tracks with lengths in excess of 250

22、 mm. c) Camber in excess of 1 mm over 250 mm may be generated when empty carrier tape is supplied on level-wound reels. d) For micro-sized components (0603 Metric/0201 Imperial and smaller), the mass is so light that components may run off from the component compartment when the cover tape is peeled

23、. For these component sizes it is recommended to use a peel force of 0.2 N (20 grams force) 0.1 N (10 grams force) and, as aging may affect the peel force, this peel force should be valid for at least 7 days after sealing. 4.4 Components are to be prevented from falling out of the cavity of the carr

24、ier tape, and shall remain in position for automatic handling after removal of the top cover tape (see Note 1, Table 1). 4.5 The cover tape(s) may not extend over the edge of the carrier tape or cover any part of the sprocket holes. 4.6 Tape in adjacent layers shall not stick together when wound on

25、the carrier reel. EIA-971 Page 3 4.7 The packaging, materials and processes shall not adversely affect the mechanical and electrical characteristics or marking of the components. For intermediate and final packaging, refer to EIA-383 “Preparation for the Delivery of Electrical and Electronic Compone

26、nts,” ANSI/ESD S541 “Packaging Material Standards for ESD Sensitive Items,” and EIA-583 “Packaging Material Standards for Moisture Sensitive Items,” and EIA-624 “Product Package Bar Code Label Standard for Non-Retail Applications.“ 4.8 The tapes shall be suitable to withstand storage of the taped co

27、mponents without danger of migration of contaminants onto the terminations, or the emission of vapors which would make soldering difficult or deteriorate the component properties or terminations by chemical action. In addition, the cover tape shall not become detached, such that the components do no

28、t remain in position after storage. 4.9 Components may be removed from the cavity by incising at or below the cavity depth midpoint (K0/2). In no case shall the incising affect the package functionality. 4.10 There shall not be consecutive components missing from any reel for any reason. 4.11 The co

29、ver tape shall have a total peel strength of from 0.1 N to 0.7 N (10 grams to 70 grams calibrated scale reading). Peel is defined as the separation of the full width of the cover tape from the carrier tape or the removal of the center portion of the cover tape from the carrier tape to enable compone

30、nt removal from the cavity. The direction of pull shall be opposite the direction of carrier tape travel such that the cover tape makes an angle of between 165 and 180 degrees with the top of the carrier tape. The cover tape, during peel force testing, shall be pulled with a velocity of 300 mm +/- 1

31、0 mm/minute, relative to the carrier tape, during peeling, which results in the cover/carrier tape seal being separated at a rate of 150 mm/minute. 4.12 Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes (refer to 4.2(c) and Figure 4). Refer to EIA-556

32、 and EIA-624. 4.13 Reels as defined by Figure 8 shall be permanently marked with visible recycling symbology. 4.14 The following component orientation rules apply: a) The longer axis of the component shall be oriented perpendicular to the length of the tape (B0 A0). b) Polarized components shall be

33、oriented in one direction. For components with two terminations, the cathode side shall be adjacent to the sprocket holes. EIA-971 Page 4 Figure 1. 4 mm Carrier Tape Dimensions. See Section 4.0 and Table 1 for Requirements. T T1T2S1K0D0A0B0P0P2P1E1E2F W Pocket off-set: 0.03mm max. Direction of unree

34、ling Cover tape B1Figure 2. Maximum Pocket Offset. Origin EIA-971 Page 5 Table 1. 4 mm Carrier Tape Dimensions (mm) Dimension Length, mm Other Requirements A0, B0, K0 See notes following this Table B1 max 1.48 Reference dimension D0 0.80 0.04 E1 0.90 0.05 E2 min 3.07 F 1.8 0.03 P0 2.00 0.04 0.1 cumu

35、lative tolerance/20 pitches P1 1.0 0.03 P2 1.0 0.03 S1 min 0.50 T min 0.15 T max 0.40 T1 max 0.08 T2 max 1.1 W 4.0 0.08 Component Tilt 20 max Component Planar Rtti20 max Lateral Movement (see Figure 3) 0.10 max Component size = 0402 Metric (01005 Imperial) 0.12 max Component size = 0603 Metric (0201

36、 Imperial) 0.20 max Component size 0603 Metric (0201 Imperial) Notes 1. The cavity defined by A0, B0, and K0shall surround the component with sufficient clearance that: a) The component does not protrude above the top surface of the carrier tape. b) The component can be removed from the cavity in a

37、vertical direction without mechanical restriction, after the top cover tape has been removed. c) Rotational and tilt limits of the component in the pocket are limited to 20 max as illustrated in Figure 3. d) Lateral movement of the component is restricted to the limits prescribed in this table and a

38、s illustrated in Figure 3. 2. The tape with or without components shall pass around radius R min= 20 mm without damage as illustrated in Figure 5.EIA-971 Page 6 Figure 3. Maximum Component Tilt, Rotation and Lateral Movement (Refer to Table 1) See Section 4.0 for Requirements. Component Tilt Compone

39、nt Planar Rotation Lateral Movement Side or Front Top View Top View Sectional View Figure 4. Bar Code Label Area See Section 4.0 for Requirements. Bar Code LabelDirection of unreeling for reels filled with componentsTape bottom sideReelTape upper sideRound sprocket holeComponent planar rotation Refe

40、r to Table 1 A0Typical component center line B0Typical cavity center line EIA-971 Page 7 Figure 5. Bending Radius for 4 mm Carrier Tape See Section 4.0 for Requirements. Figure 6. Maximum Camber for 4 mm Carrier Tape See Section 4.0 for Requirements. Figure 7. Leader and Trailer Dimensions for 4 mm

41、Carrier Tape. See Section 4.0 for Requirements. Leader Trailer Minimum 400 mm Minimum 160 mm Minimum 100 mm Notes 1. There shall be a leader of 400 mm minimum of cover tape, which includes at least 100 mm of carrier tape with empty compartments and sealed by the cover tape. All of the leader may con

42、sist of the carrier tape with empty compartments sealed by cover tape. 2. There shall be a trailer of 160 mm minimum of empty carrier tape sealed with cover tape. The entire carrier tape must release from the reel hub as the last portion of the tape unwinds from the reel without damage to the carrie

43、r tape and the remaining components in the cavities. R Tape with components shall pass around radius R min= 20 mm without damage 250 mm 1 mm max. in either direction EIA-971 Page 8 Table 2. Reel Dimensions for 4mm Carrier Tape See Section 4.0 for requirements (all dimensions in millimeters) Dimensio

44、n Length, mm A max - Reel Diameter 180 N min Hub Diameter 40 W1- Reel Inner Width 4.2 + 0.75/-0 W2max Reel Overall Width 7.95 W3min Reel Inner Width 3.9 W3max Reel Inner Width 5.95 B min Drive Slot Width 1.5 D min Drive Slot Diameter 20.2 C Arbor Hole Diameter 13.0 +0.5/-0.2 Notes 1 The most widely

45、used reel diameters are 88 mm 2 mm, 120 mm 2 mm and 178 mm 2 mm. 2 Tape with components must wrap around hub without damage. Figure 8. Reel dimensions for 4 mm Carrier Tape See Section 4.0 for requirements (all dimensions in millimeters) EIA-971 Page 9 Acknowledgments The following team members cont

46、ributed to the realization of the latest document revision: Bill Aldeen (Nu-Way Electronics) James Adams (3M) Ken Ball (Knowledge Based Technical Consultancy Ltd.) Ed Bishop (Tayloreel) Ray Bloom (Advantek) Scott Carter (Tek Pak)Chair Darin Glenn (Vishay) Charles Gutentag (Tempo Electronics) Lanney

47、McHarque (Murata Electronics) Scott Wischoffer (Fuji America) The following team members are part of the Automated Component Handling Committee: Joseph Biernacki (Stackpole Electronics) Christine Blair (STMicroelectronics) Michael Cannon (TDK Corporation of America) Jaron Christoph (Rockwell Collins

48、) Albert Escusa (Texas Instruments) William Hall (Tayloreel) Steven Kummerl (Texas Instruments) Henry Sipes (Samtec, Inc.) . EIA-971 Page 10 Addendum Complementary Taping Standards: EIA-726 8 mm Punched & Embossed Carrier Taping of Surface Mount Components for Automatic Handling of Devices Smaller T

49、han 2.0 mm x 1.2 mm EIA-747 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick EIA-763 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling Other Reference Documents: ESD TR20.20 ESD Association Standard - ESD Handbook ESD ADV1.0 ESD Association Glossary Glossary of Terms SEMI E78 Semiconductor Equipment and Materials International Standard El

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