1、BRITISH STANDARDBS EN 60679-1:2007Quartz crystal controlled oscillators of assessed quality Part 1: Generic specificationThe European Standard EN 60679-1:2007 has the status of a British StandardICS 31.140g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49
2、g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 60679-1:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007ISBN 978 0 580 55252 6National forewordThis Britis
3、h Standard was published by BSI. It is the UK implementation of EN 60679-1:2007. It is identical with IEC 60679-1:2007. It supersedes BS EN 60679-1:1998 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/49, Piezoelectric devices for frequency contro
4、l and selection.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confe
5、r immunity from legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 60679-1 NORME EUROPENNE EUROPISCHE NORM June 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Ele
6、ktrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60679-1:2007 E ICS 31.140 Supersedes EN 60679-1:1998 + A1:2002 + A2:2003English version Quartz
7、crystal controlled oscillators of assessed quality - Part 1: Generic specification (IEC 60679-1:2007) Oscillateurs pilots par quartz sous assurance de la qualit - Partie 1: Spcification gnrique (CEI 60679-1:2007) Quarzoszillatoren mit bewerteter Qualitt - Teil 1: Fachgrundspezifikation (IEC 60679-1:
8、2007) This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliograp
9、hical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in two official versions (English and German). A version in any other language made by translation under the responsibility of a CENEL
10、EC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, I
11、celand, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 49/769/FDIS, future edition 3 of IEC 60679-1, prepared by IEC TC 49, Piezoelectric an
12、d dielectric devices for frequency control and selection, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60679-1 on 2007-05-01. This European Standard supersedes EN 60679-1:1998 + A1:2002 + A2:2003. It represents a step in a revision of all parts of the EN 60679 ser
13、ies to include the test requirements of the IECQ system. EN 60679-1:2007 is based on the relevant standards of that system. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 200
14、8-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-05-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60679-1:2007 was approved by CENELEC as a European Standard without any modification.
15、_ 2 EN 60679-1:2007CONTENTS 1 2 3 3.1 3.2 3.3 3.4 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 3 EN 60679-1:2007Annex ZA (normative) Normative references to international publications with their Scope.6 Normative references .6 Terms, definitions and general information .8Gener
16、al .8 Definitions .8 Preferred values for ratings and characteristics.18 Marking .20 Quality assessment procedures20 Primary stage of manufacture20 Structurally similar components.20 Subcontracting 21 Incorporated components 21 Manufacturers approval 21 Approval procedures .21 Procedures for capabil
17、ity approval 22 Procedures for qualification approval.22 Test procedures 23 4.10 Screening requirements 23 4.11 Rework and repair work.23 4.12 Certified test records .23 4.13 Validity of release23 4.14 Release for delivery 23 4.15 Unchecked parameters24 Test and measurement procedures.24 General .24
18、 Test and measurement conditions .24 Visual inspection .25 Dimensions and gauging procedures.26 Electrical test procedures 26 Mechanical and environmental test procedures .69 Endurance test procedure .75 Annex A (normative) Load circuit for logic drive 77 Annex B (normative) Latch-up test80 Annex C
19、(normative) Electrostatic discharge sensitivity classification .81 corresponding European publications 83Bibliography82 Figure 1 Example of the use of frequency offset 10 Figure 2 Typical frequency fluctuation characteristics 13 Figure 3 Characteristics of an output waveform15 Figure 4 Clock signal
20、with phase jitter16 Figure 5 Phase jitter measures 16 Figure 8 Jitter tolerance according to ITU-T G.825, ANSI T1.105.03, Telcordia Figure 21 Supply voltage waveform for periodical tSU 4 EN 60679-1:2007Figure 6 Gaussian distribution of jitter17 Figure 7 Jitter amplitude and period of jitter frequenc
21、y.17 GR-253 and ETSI EN 300462 .18 Figure 9 Test circuits for insulation resistance measurements26 Figure 10 Test circuit for voltage proof test 27 Figure 11 Test circuit for oscillator input power measurement 27 Figure 12 Test circuit for oven and oscillator input power measurement.28 Figure 13 Tes
22、t circuit for measurement of output frequency, method129 Figure 14 Test circuit for measurement of output frequency, method 2.29 Figure 15 Test circuit for measurement of frequency/temperature characteristics.30 Figure 16 Thermal transient behaviour of typical oscillator.32 Figure 17 Generalized osc
23、illator circuit 33 Figure 18 Test circuit for start-up behaviour and start-up time measurement .34 Figure 19 Typical start-up behaviour with slow supply voltage ramp.34 Figure 20 Definition of start-up time .36 measurement 36 Figure 22 Typical oscillator stabilization characteristic .37 Figure 23 Ex
24、ample of retrace characteristic .38 Figure 24 Test circuit for the measurement of output voltage .38 Figure 25 Test circuit for the measurement of pulse outputs 39 Figure 26 Test circuit for harmonic distortion measurement .39 Figure 27a Symmetrical .39 Figure 27b Large odd harmonic content .39 Figu
25、re 27c Large even harmonic content .40 Figure 27 Quasi-sinusoidal output waveforms 40 Figure 28a Ideal spectrum .40 Figure 28b Spectrum showing severe harmonic distortion40 Figure 28 Frequency spectrum for harmonic distortion .40 Figure 29 Test circuit for the determination of isolation between outp
26、ut ports.43 Figure 30 Test circuit for measuring suppression of gated oscillators.43 Figure 31 Test circuit for tri-state disable mode output current.44 Figure 32 Test circuit for output gating time tri-state .45 Figure 33 Test circuit for modulation index measurement.45 Figure 34 Modulation wavefor
27、m for index calculation .46 Figure 35 Logarithmic signal amplitude scale.46 Figure 36 Test circuit to determine amplitude modulation sensitivity 48 Figure 37 Frequency spectrum of amplitude modulation distortion .48 Figure 38 Test circuit to determine pulse amplitude modulation .49 Figure 39 Pulse m
28、odulation characteristic49 Figure 40 Test circuit for the determination of modulation input impedance50 Figure 41 Test circuit for the measurement of f.m. deviation 51 Figure 42 Test circuit for the measurement of f.m. sensitivity.53 Figure 50 Time-domain short-term frequency stability of a typical
29、5 MHz precision Table A.1 Value to be using when calculating R1and R2 5 EN 60679-1:2007Figure 43a Static test.53 Figure 43b Dynamic test 54 Figure 43 Test circuit for the measurement of frequency modulation distortion.54 Figure 44 Test circuit for the measurement of single-sideband phase noise .55 F
30、igure 45 Typical noise pedestal spectrum 56 Figure 46 Test circuit for the measurement of incidental frequency modulation 58 Figure 47 Test circuit for method 1.59 Figure 48 Test circuit for method 2.60 Figure 49 Circuit modifications for methods 1 and 2.61 oscillator.62 Figure 51a Typical arrangeme
31、nt for radiated interference tests, 30 MHz and above.63 Figure 51b Typical arrangement for radiated interference tests, below 30 MHz 63 Figure 51 Radiated interference tests 63 Figure 52 Characteristics of line impedance of stabilizing network .64 Figure 53 Circuit diagram of line impedance of stabi
32、lizing network.65 Figure 54 Phase jitter measurement with sampling oscilloscope 66 Figure 55 Block diagram of a jitter and wander analyzer according to ITU-T O.172 68 Figure A.1 Circuit for TTL.77 Figure A.2 Circuit for schottky logic77 Table 1 Measuring sets bandwidth .65 Table 2 Fourier frequency
33、range for phase noise test.67 Table 3 Standard bit rates for various applications.69 Table 4 Tensile force .69 Table 5 Thrust force.70 Table 6 Bending force70 Table 7 Torque force71 .78 QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY Part 1: Generic specification 1 Scope This part of IEC 6
34、0679 specifies the methods of test and general requirements for quartz crystal controlled oscillators of assessed quality using either capability approval or qualification approval procedures. 2 Normative references The following referenced documents are indispensable for the application of this doc
35、ument. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in electrical technology IEC 60050-561, International Electrotechnical Vocabulary (I
36、EV) Part 561: Piezoelectric devices for frequency control and selection IEC 60068-1:1988, Environmental testing Part 1: General and guidance Amendment 1 (1992) IEC 60068-2-1, Environmental testing Part 2: Tests Tests A: Cold IEC 60068-2-2, Environmental testing Part 2: Tests Tests B: Dry heat IEC 60
37、068-2-6, Environmental testing Part 2: Tests Test Fc: Vibration (sinusoidal) IEC 60068-2-7, Environmental testing Part 2: Tests Test Ga and guidance: Acceleration, steady state IEC 60068-2-10, Environmental testing Part 2-10: Tests Test J and guidance: Mould growth IEC 60068-2-13, Environmental test
38、ing Part 2: Tests Test M: Low air pressure IEC 60068-2-14, Environmental testing Part 2: Tests Test N: Change of temperature IEC 60068-2-17, Environmental testing Part 2: Tests Test Q: Sealing IEC 60068-2-20, Environmental testing Part 2: Tests Test T: Soldering IEC 60068-2-21, Environmental testing
39、 Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-27, Environmental testing Part 2: Tests Test Ea and guidance: Shock IEC 60068-2-29, Environmental testing Part 2: Tests Test Eb and guidance: Bump 6 EN 60679-1:2007IEC 60068-2-30, Environmental testing Par
40、t 2-30: Tests Test Db: Damp heat, cyclic (12h + 12 h cycle) IEC 60068-2-32, Environmental testing Part 2: Tests Test Ed: Free fall IEC 60068-2-45, Environmental testing Part 2: Tests Test XA and guidance: Immersion in cleaning solvents IEC 60068-2-52, Environmental testing Part 2: Tests Test Kb: Sal
41、t mist, cyclic (sodium chloride solution) IEC 60068-2-58, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-64, Environmental testing Part 2: Test methods Test
42、 Fh: Vibration, broad-band random (digital control) and guidance IEC 60068-2-78:2001, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 60469-1:1987, Pulse techniques and apparatus Part 1: Pulse terms and definitions IEC 60617-DB: 20011, Graphical symbols for diagrams IEC
43、60679-5, Quartz crystal controlled oscillators of assessed quality Part 5: Sectional specification Qualification approval IEC 61000-4-2, Electromagnetic compatibility (EMC) Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test IECQ 01, IEC Quality Assessment System for
44、 Electronic Components (IECQ) Basic Rules IEC QC 001002-2:1998, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 2: Documentation IEC QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures
45、ISO 1000, SI units and recommendations for the use of their multiples and of certain other units ITU-T G.810, Definitions and terminology for synchronization networks ITU-T G.811: Timing characteristics of primary reference clocks ITU-T G.812, Timing requirements of slave clocks suitable for use as
46、node clocks in synchronization networks ITU-T G.813, Timing characteristics of SDH equipment slave clocks (SEC) ITU-T G.825, The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH) _ 1“DB” refers to the IEC on-line database. 7 EN 60679-1:20
47、07ANSI T1.101, Synchronization Interface Standard ANSI T1.105.03, Synchronous Optical Network (SONET) Jitter and Wander at Network Equipment Interfaces ETSI EN 300 462 (all parts), Transmission and Multiplexing (TM); Generic requirements for synchronization networks Telcordia GR-253, Synchronous Opt
48、ical Network (SONET) Transport Systems: Common Generic Criteria Order of precedence Where any discrepancies occur for any reason, documents shall rank in the following order of precedence: detail specification; sectional specification; generic specification; any other international documents (for example of the IEC) to which reference is made. The same order of precedence shall apply to equivalent national documents. 3 Terms, definitions and general information 3.1 General Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
