1、e SMD-5962-70833 59 e 7779996 0004545 4 BI I PMIC NA STAN DARD I ZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPAFITMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA I PREPAREDBY , AI - DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 dislrlbullon Is unlimlled. Provided
2、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ ! SMD-5962-70833 59 m 9999996 000454b b M 1, SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein), This drawing describes device requirements for hyb
3、rid microcircuits to be processed in accordance with MIL-H-38534. and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the complete Part or Identifying Number (PIN). When available, a choice of radiation hardness essurance levels a
4、re reflected in the complete PIN. The PIN shall be as shown in the following example: Two product assurance classes, military high reliabi lity (device class H) 1.2 a. - 90833 - o1 - H X X I 1 I 1 5962 I” I l I I I I I I Lead Case Devi ce Devi ce RHA Federal ctmk class designator type c Lass outline
5、. finish designator (see 1.2.1) (See 1.2.2) designator (See 1.2.4) (See 1.2.5) / (See 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHAI desiqnator. Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA de
6、signator. A dash (-1 indicates a non-RHA device. 1.2.2 Device type(s). The device typeCs) shall identify the circuit function as follows: Device type Generic number Circuit function o1 CLCE01 A High speed, wideband, operational amplifier 1,2,3 Device class designator. This device class designator sh
7、all be a single letter identifying the product aesurance level as follows: Device class Device requirements documentation H or K Certificat ion and qua Lif i cat ion to MIL-H-38534 1,2,4 Case outline(s), The case outline(c) shall be as designated in appendix C of MIL-M-38510 and as f o 1 l0HS : Outl
8、ine letter Case outline X See figure 1, (12-lead, .605” x ,18I1l), can package The leed finish shall be as specified in MIL-H-38534 for classes H and K. Finish designation is for use in 1.2.5 Lead finich. letter “XII shall not be marked on the microcircuit or its packaging. specifications when lead
9、finishes A, 6, and C are considered acceptable and interchangeable without preference. The Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-70833 57 I 9979996 0004547 B I 1.3 Absoute maximum ratings. Supply voltage (*Vcc) - - - - - - - - - -
10、- - - - - Storage temperature range - - - - - - - - - - - - - Lead temperature (soldering, 10 seconds) - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - Power dissipation (PD) - - - - - - - - - - - - - - - Thermal resistance, case-to-ambient - - - - - Thermal resistance, junction-to-ca
11、se: output current - - - - - - - - - - - - - - - - - - - (circuit) - - - _ - - - - - - _ _ _ - - _ _ _ _ JC JC(OUtput) - - - - - - - - - - - - - - - - - - - 120 V dc *IO0 mA t300“ C t175“C 65“CIW 21 -65C to t15O“C - II 32“CIW 31 loooc/w $1 1.4 Recommended operating conditions. Supply voltage range -
12、 - - - - - - - - - - - - - - - Ambient operating temperature range (TA) - - - - - - *5 V dc to *I5 V dc *I to 150 -55C to t125“C Gain range - - - - - - - - - - - - - - - - - - - - - 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified,
13、the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MI L-M-3851 O MIL-H-
14、38534 STANDARDS MI LITARY MIL-STD-480 MIL-STD-883 HANDBOOK MILITARY MIL-HDBK-780 - Microcircuits, General Specification for. - Hybrid Microcircuits, General Specification for. - Configuration Control-Engineering Changes, Deviations and Waivers. - Test Methods and Procedures for Microelectronics. Sta
15、ndardized Military Drawings. (Copies of the specifications, standards, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) - 11 The power dissipation can be determined b
16、ased on the application and the junction temperature verified to be (T t175“C) and using the thermal resistance values given. - 2/ Still air, no heatsink. 31 ThermaC resistance of circuit; Pcircuit = 2(Vcc) Icc. - 41 Thermal resistance of output transistors; Poutput = VCE(IE) x (% duty cycle). J: 59
17、62-90833 STAN DARDI ZED SIZE MILITARY DRAWING A REvIsK)# LEVU SHEET DEFENSE EiECTRO1JICS SUPPLY CE#iuI DAnON, OHK) 45144 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2.2 Order-of precedence. In the event of a conflict between the text of this dr
18、awing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-H-38534 and as specified herein. shall be as specified in MIL-H-38534 and herein. 3,2 Design, construction, a
19、nd physical dimensions. The design, construction, and physical dimensions 3.2.1 3.2.2 Terminal connections. 3.3 E lectri caL performance character ist i cs. Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. The terminal connections shall be as specified on f
20、igure 2. Unless otherwise specif i ed herein, the elect r i ca 1 performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I
21、I. with the PIN listed in 1.2 herein. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shatl be in accordance with MIL-H-38534. The part shall be marked In addition, the manufacturers PIN may also be marked as listed in QML-38534. 3.6 Manufacturer eligibility. In
22、 addition to the general requirements of MIL-H-38534, the manufacturer of the part described herein shall submit for DESC-ECC review and approval electrical test data (variables format) on 22 devices from the initial quality conformance inspection group A lot sample, produced on the certified line,
23、for each device type listed herein. summary of all parameters manually tested, and for those which, if any, are guaranteed. The data should also include a 3.7 Certificate of compliance. order to supply to this drawing. the manufacturers product meets the requirements of MIL-H-38534 and the requireme
24、nts herein. A certificate of compliance shall be required from a manufacturer in The certificate of compliance submitted to DESC-ECC shall affirm that 3.8 Certificate of conformance. A certificate of conformance as required in MIL-H-38534 shall be provided with each lot of microcircuits delivered to
25、 this drawing. SlZE 5962-90833 A STANDARDIZED MILITARY DRAWING Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. SMD-59b2-90833 59 9799996 0004549 L W Conditions I/ 1 Group A I Limits I Unit -55OC 5 TA. +125”C Isubgroups 1 I I unless otherwise specif
26、ied I I Min 1 Max I Gain flatness peaking Gain flatness peaking 1 0.6 1 d Gain f latness rolloff IGFR I f = 50 MHz, I I l I I l I I 1 15 1 I 5,6 1 resistance Output impedance 2/ 14, 5, 6 I I 0.1 I n L - 3/ Noise floor z/ I I l I Integrated noise z/ I 70 I PV See footnotes at end of table. 5962-90833
27、 SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- CSMD-5962-70833 59 I 9999996 0004550 B I TABLE I. Electrical Derformance characteristics - Continued. Test Input offset voltage Input offset voltage temperature caeff icient E/ + Input bias cur
28、rent t Input bias current temperature coefficient - 2/ - Input bias current - Input bias current temperature coeff cient - 2/ Power supply rejection common mode rejection g/ Supply current ratio ratio I Symbol i Conditions I/ -55OC 5 TA 5 t125OC unless otherwise specified I I VIO I I i I I *VIO I -1
29、 I i I Input resistance is 100 W. I I I I I AT I -IIB I Input resistance is 100 ks2. *-IS ! -I I PSRR 1 AV, f 0.5 v CMRR I AV, = 1 V I Ice I No load I I I Group A 1 Limits 1 Unit subgroups I I I I Min I Max I I I I 1 I 1.0 1 mv I I 2.5 1 I I I I 2.2 I I I I I I I I I 15 I pV/“C I 2, 3 I I I I 2 3 %
30、I I I 1, 2 I I 20 I PA a I I I 31 I 36 I l I I I I 2,. 3 I I I I I 125 1 nA/“C i I I I I VA I -10 I I I I I I 1 2 I -30 I 3 I -26 I I I I 2, 3 I I I I I 200 I nA/OC i i i I I l 1, 2, 3 I 45 I 1 dB l I I dB I 4, 5, 6 I 40 I I I 34 L l I I I I mA l I 36 I 2, 3 I - I/ Unless otherwise specified, RL = 2
31、00.M1, RF = 200M1, fVCC = 115 V, AV = t20. - 2/ Parameter shall be tested as part of device initial characterization and after design and process changes which will affect this parameter. Parameter shall be guaranteed to the limits specified in table i for all lots not specifically tested. - 3/ Symb
32、ol dBc is the standard reference for a signal referenced to a signal level. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-70833 59 I 9999996 0004553 T I + REFERENCE PLANE ?-T 1 D Di li -A+ t- BASE AND SEATING PLANE t e I ? + I O00 321 a FI
33、GURE I. Case outline X. 5962-90833 STANDARDIZED M I L ITARY DRAWING DEFENSE UEC“ICS SUPPLY CENE DAYIDN. OHIO 45444 I I I , QU c OOVEMNUEW mwtw WWE IW-$LQ.MI DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-90833 59 I 999
34、9996 0004552 L I r s. I I I I I J L I I I I I I ilin I I I I I I 4.60 I I I I I I I A 1.142 1.iai I 3.61 I I I I I I I I I I I I I I I I I I I I 114.10 I I I I I I J I I 131 I e I .400 ESC 1 10.16 ESC I 131 1 5.08 BSC I el J I I I I 131 I I I e2 I .loo ESC J I I I I I I I I I I l I I I I I I I I I I
35、 I J L I I I I I I I I I I I 45“ ESC 131 I I J Inches I Millimeters I Notes I Isymbol I I Max I I Max I Min I 0.48 I 115.37 I I 0.41 (15.11 I .O19 I .605 I .O16 dD 1.595 I $Dl 1.543 1.555 113.79 I .ZOO BSC 2.54 ESC I 0.76 I I 0.91 I I 0.91 I 2 I I 0.41 J F 1.016 I 0.66 J k 1.026 I kl 1.026 1.036 I 0
36、.66 J L 1.310 I a I 45“ ESC I .O30 I .O36 I 8.64 I I 7.87 I .340 NOTES: 1. Che product may be measured by direct methods or by gauge. 2. Measured from the maximum diameter of the product. 3. Leads having a maximum diameter .O19 inch (0.48 mm) measured in gauging the plane .O54 inch (1.37 mm) 1.001 i
37、nch (0.03 mm), -.O00 (0.00 mm)below the base plane of the product shall be within .O07 inch (.18mm) of their true position relative to a maximum width tab. FIGURE 1. Case outline X - Continued. STANDARDIZED 5962-90833 MILITARY BRAWING *u i mvcwuwi wrffii im-asow jC FORM 193A :P 87 Provided by IHSNot
38、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-90B33 59 I 9999996 0004553 3 W Device type Case outline Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 1TE: Pin 8 provides i o1 X Terminal symbol +Vcc (supply voltage) No connection GND (case) No connection -IN “IN
39、GND (case) Rf (internal feedback) -Vcc (supply voltage) -Vcc (collector supply) OUT +Vcc (collector supply) cess to a 2 161 feedback resistor which can be connected to the output or left open if an external feedback resistor is desired. FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo
40、 reproduction or networking permitted without license from IHS-,-,-: SMD-59b2-90833 59 9999996 0004554 5 I 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-H-38534. 4.2 Screening. Screening shall be in accordance with MIL
41、-H-38534. The following additional criteria shall apply: a, Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, 6, C, or D using the circuit submitted with the certificate of compliance (see 3,7 herein). TA as specified in accordance with table I of method 1015 of MIL-STD-883, (2) Interi
42、m and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. b. TABLE II. Electrical test requirements. I I I Subgroups I I (per method 1 I 5008, group A 1 I test table)
43、 I I I I I I I I interim electrical parameters l I MIL-STD-883 test requirements 1 I 1 I i Final electrical test parameters 1 I L I I I 1,2,3/4/5, I I J 1 6,7,8A,8B I 1 I I I I Group C end-point electrical I J parameters I l I I Group A test requirements i Group E end-point electrical I parameters f
44、or RHA devices I I i Subgroups* i I (per method I I 5005, group A I I test table) I 1 I *PDA applies to subgroup 1. *When applicable to this standardized military drawing, the subgroup shall be defined. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with MI
45、L-H-38534 and as specified herein. 4,3.1 Group A inspection. Group A inspection shall be in accordance with MIL-ti-38534 and as follows: a. b. Tests shall be as specified in table II herein. Subgroups 9, IO, and 11 in table X, method 5008 of MIL-STO-883 shall be omitted. SIZE 5962-90833 A STANDARDIZ
46、ED MILITARY DRAWING I DEFENSE ELECtRoFoIGS SUPPLY CWTW RE- LEVEL DAYTON, OHIO 45444 I o u s wmum miw WCL iw-sso. SC FORM 193A EP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. c SMD-5762-70833 57 W 7977776 0004555 7 W 4.3.2 Group B inspection.
47、4.3.3 Group C inspection. Group E inspection shall be in accordance with MIL-H-38534. Group C inspection shall be in accordance with MIL-H-38534 and as f 01 lows: a. b. Steady-state life test conditions, method 1005 of MIL-STD-883. End-point electrical parameters shall be as specified in table II he
48、rein. (1) Test condition A, E, C, or D using the circuit submitted with the certificate of compliance (see 3.7 herein). (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspe
49、ction. 4.3.5 Group E inspection. Group D inspection shall be in accordance with MIL-H-38534. Group E inspection is required only for parts intended to be marked RHA levels for device classes H and K shall be M, as radiation hardness assured (see 3.5 herein). D, R, and H. specified in the acquisition document. RHA quality conformance inspection samp
