1、BSI Standards PublicationLiquid crystal display devicesPart 10-1: Environmental, endurance and mechanical test methods MechanicalBS EN 61747-10-1:2013National forewordThis British Standard is the UK implementation of EN 61747-10-1:2013. It isidentical to IEC 61747-10-1:2013. It partially supersedes
2、BS EN61747-5:1998.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract
3、. Users are responsible for its correct application. The British Standards Institution 2013.Published by BSI Standards Limited 2013ISBN 978 0 580 76653 4ICS 31.120Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority o
4、f theStandards Policy and Strategy Committee on 31 October 2013.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61747-10-1:2013EUROPEAN STANDARD EN 61747-10-1 NORME EUROPENNE EUROPISCHE NORM October 2013 CENELEC European Committee for Electrotechnical Standardiz
5、ation Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61747-1
6、0-1:2013 E ICS 31.120 Supersedes EN 61747-5:1998 (partially) English version Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical (IEC 61747-10-1:2013) Dispositifs daffichage cristaux liquides - Partie 10-1: Mthodes dessais denvironnement, den
7、durance et mcaniques - Essais mcaniques (CEI 61747-10-1:2013) Flssigkristall-Anzeige-Bauelemente - Teil 10-1: Umwelt-, Lebensdauer- und mechanische Prfverfahren - Mechanisch (IEC 61747-10-1:2013) This European Standard was approved by CENELEC on 2013-08-14. CENELEC members are bound to comply with t
8、he CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Manageme
9、nt Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the sam
10、e status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lit
11、huania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61747-10-1:2013EN 61747-10-1:2013 - 2 - Foreword The text of document 110/395/CDV, future edition 1 of IEC 61747-10-1, prepared by IEC T
12、C 110, “Electronic display devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61747-10-1:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsemen
13、t (dop) 2014-05-14 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-08-14 This document partially supersedes EN 61747-5:1998. EN 61747-10-1:2013 supersedes Clauses 1 and 2 of EN 61747-5:1998. NOTE It is intended that the other clauses of EN 61
14、747-5:1998 will be replaced by new parts in the EN 61747 series. The details of the intended changes are given in Annex D of EN 61747-30-1:2012. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held
15、responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61747-10-1:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the st
16、andards indicated: IEC 60068-1 NOTE Harmonised as EN 60068-1. IEC 61747 series NOTE Harmonised in EN 61747 series. IEC 61747-5-3 NOTE Harmonised as EN 61747-5-3. BS EN 61747-10-1:2013- 3 - EN 61747-10-1:2013 Annex ZA (normative) Normative references to international publications with their correspon
17、ding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any a
18、mendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068 Series Environmental testing EN 60068 Series IEC 60068-2-6 - Environmental testing - Part 2-6: Tests - Tes
19、t Fc: Vibration (sinusoidal) EN 60068-2-6 - IEC 60068-2-7 - Environmental testing - Part 2: Tests. Test Ga: Acceleration, steady state EN 60068-2-7 - IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with le
20、ads EN 60068-2-20 - IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices EN 60068-2-21 - IEC 60068-2-27 - Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock EN 60068-2-27 - IEC 60747 Series Semiconductor devi
21、ces - - IEC 60748 Series Semiconductor devices - Integrated circuits - - IEC 60749-14 - Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) EN 60749-14 - IEC 61747-1 - Liquid crystal and solid-state display devices - Part 1: Generic spe
22、cification EN 61747-1 - BS EN 61747-10-1:2013 2 61747-10-1 IEC:2013 CONTENTS 1 Scope . 5 2 Normative references 5 3 Terms, definitions and letter symbols 6 4 Standard atmospheric conditions for measurements and tests: 6 5 Test methods 6 5.1 General . 6 5.2 Robustness of terminations 6 5.2.1 Wire ter
23、minations, pins or connectors with pins 6 5.2.2 Flexible terminations 7 5.3 Soldering . 7 5.4 Vibration (sinusoidal) . 7 5.4.1 Test Fc 7 5.4.2 Transverse motion . 7 5.4.3 Distortion . 7 5.4.4 Vibration amplitude tolerance . 7 5.4.5 Severities 7 5.4.6 Vibration amplitude 8 5.4.7 Duration of endurance
24、 8 5.5 Shock 9 5.6 Acceleration, steady state 9 5.7 Bond strength test . 10 5.7.1 General . 10 5.7.2 General description of the test . 10 5.7.3 Preconditioning 10 5.7.4 Initial measurements 10 5.7.5 Test method (see Figure 1) 10 5.7.6 Information required in the relevant specification 11 Bibliograph
25、y 12 Figure 1 Example of bond strength . 11 Table 1 Frequency range Lower end 7 Table 2 Frequency range Upper end 7 Table 3 Recommended frequency ranges . 8 Table 4 Recommended vibration amplitudes . 8 Table 5 Conditions for shock test 9 Table 6 Acceleration conditions 10 BS EN 61747-10-1:201361747-
26、10-1 IEC:2013 5 LIQUID CRYSTAL DISPLAY DEVICES Part 10-1: Environmental, endurance and mechanical test methods Mechanical 1 Scope This part of IEC 61747 lists test methods applicable to liquid crystal display devices. It takes into account, wherever possible, the mechanical robustness test methods a
27、s outlined in IEC 60068. NOTE Devices include cells and modules. The object of this standard is to establish uniform preferred test methods with preferred values for stress levels for judging the mechanical properties of liquid crystal display devices. In case of contradiction between this standard
28、and a relevant specification, it is the latter that should govern. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references,
29、 the latest edition of the referenced document (including any amendments) applies. IEC 60068 (all parts), Environmental testing IEC 60068-2-6, Environmental testing Part 2-6: Tests Test Fc: Vibration (sinusoidal) IEC 60068-2-7, Basic environmental testing procedures Part 2-7: Tests Test Ga and guida
30、nce: Acceleration, steady state IEC 60068-2-20, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-21, Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices
31、 IEC 60068-2-27, Environmental testing Part 2-27: Tests Test Ea and guidance: Shock IEC 60747 (all parts), Semiconductor devices IEC 60748 (all parts), Semiconductor devices Integrated circuits IEC 60749-14, Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminatio
32、ns (lead integrity) IEC 61747-1, Liquid crystal and solid-state display devices Part 1: Generic specification BS EN 61747-10-1:2013 6 61747-10-1 IEC:2013 3 Terms, definitions and letter symbols For the purposes of this document, the terms, definitions and letter symbols given in IEC 60068, IEC 60747
33、, IEC 60748 and IEC 61747-1 apply. 4 Standard atmospheric conditions for measurements and tests: Unless otherwise specified, all tests and measurements shall be carried out under standard atmospheric conditions for testing: Temperature: 15 C to 35 C Relative humidity: 25 % to 85 % RH, where appropri
34、ate Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar) The absolute humidity of the atmosphere shall not exceed 22 g/m3. 5 Test methods 5.1 General Choice of the appropriate tests depends on the type of devices. The relevant specification shall state which tests are applicable. 5.2 Robustness
35、of terminations 5.2.1 Wire terminations, pins or connectors with pins 5.2.1.1 Test U Test U, specified in IEC 60068-2-21, is applicable. 5.2.1.2 Tensile This test shall be in accordance with test Ua1 of IEC 60068-2-21, with the following specific requirements. After the test, examine under 3 to 10 m
36、agnification. The device shall be rejected if there is breakage, loosening or relative motion between the lead or termination and the device body. 5.2.1.3 Bending This test shall be in accordance with test Ub of IEC 60068-2-21. 5.2.1.4 Torsion See IEC 60749-14. Applied only for cells with pin. 5.2.1
37、.5 Torque See IEC 60749-14. Applied only for cells with pin. BS EN 61747-10-1:201361747-10-1 IEC:2013 7 5.2.2 Flexible terminations Under consideration. 5.3 Soldering Test T, specified in IEC 60068-2-20, is applicable. This test shall be in accordance with test Ta (methods 1, 2) (only methods 1 and
38、2 are referenced, these methods are solder bath and soldering iron). 5.4 Vibration (sinusoidal) 5.4.1 Test Fc Test Fc, specified in IEC 60068-2-6, is applicable, with the following specific requirements. 5.4.2 Transverse motion The maximum vibration amplitude at the check points in any perpendicular
39、 to the specified axis shall not exceed 25 %. 5.4.3 Distortion Not exceeding 25 %. 5.4.4 Vibration amplitude tolerance Reference point: 15 % Check point: 25 % 5.4.5 Severities The frequency range shall be given in the relevant specification by selecting a lower frequency from Table 1 and an upper fr
40、equency from Table 2. Table 1 Frequency range Lower end Lower frequency f1Hz 1 5 10 55 Table 2 Frequency range Upper end Upper frequency f2Hz 55 100 150 300 500 BS EN 61747-10-1:2013 8 61747-10-1 IEC:2013 The recommended ranges are shown in Table 3. Table 3 Recommended frequency ranges Recommended f
41、requency ranges, from f1to f2Hz 1 to 55 10 to 55 10 to 300 10 to 500 55 to 500 5.4.6 Vibration amplitude The recommended vibration amplitudes with cross-over frequency are shown in Table 4. Table 4 Recommended vibration amplitudes Displacement amplitude below the cross-over frequency Acceleration am
42、plitude above the cross-over frequency mm m/s2gn0,035 4,9 0,5 0,075 9,8 1,0 0,15 19,6 2,0 0,35 49,0 5,0 0,75 98,0 10,0 NOTE The values listed apply in Table 4 for cross-over frequencies between 57 Hz and 62 Hz. 5.4.7 Duration of endurance 5.4.7.1 Endurance by sweeping The duration of the endurance i
43、n each axis shall be given as a number of sweep cycles given preference by the relevant specification from the list given below: 1, 2, 5, 10, 20. 5.4.7.2 Endurance at critical frequencies The duration of the endurance in each appropriate axis at each critical frequency found during the vibration res
44、ponse investigation shall be given preference in the relevant specification from the list given below: 10 min 0,5 min 30 min 1 min 90 min 1 min 10 h 5 min The body of the device shall be securely clamped during the test. If the device has a specified method of installation, it shall be used to clamp
45、 the device. BS EN 61747-10-1:201361747-10-1 IEC:2013 9 5.5 Shock Test Ea, specified in IEC 60068-2-27, is applicable, with the following specific requirements. The conditions shall be selected from Table 5, taking into consideration the mass of the device and its internal construction. Table 5 Cond
46、itions for shock test Peak amplitude A Corresponding duration D of the nominal pulse Corresponding velocity change V Half-sine Final-peak saw-tooth m/s2 (gn) ms m/s m/s 50 (5) 30 1,0 150 (15) 11 1,0 0,8 150 (15) 6 0,6 0,4 300 (30) 18 3,4 2,6 300 (30) 11 2,1 1,6 300 (30) 6 1,1 0,9 500 (50) 20 6,2 4,9
47、 500 (50) 11 3,4 2,7 500 (50) 3 0,9 0,7 700 (70) 11 4,8 3,8 1 000 (100) 11 6,9 5,4 1 000 (100) 6 3,7 2,9 2 000 (200) 6 7,5 5,9 2 000 (200) 3 3,7 2,9 NOTE The preferred values are underlined. The relevant specification shall state the wave form utilized. The device shall be subjected to three success
48、ive shocks, in both directions of three mutually-perpendicular axes chosen so that faults are most likely to be revealed, i.e. a total of 18 shocks (see IEC 60068-2-27.) The preferred combinations are underlined. The body of the device shall be securely clamped during the test. If the device has a s
49、pecified method of installation, it shall be used to clamp the device. 5.6 Acceleration, steady state Test Ga, specified in IEC 60068-2-7, is applicable, with the following specific requirements. The acceleration conditions shall be selected from Table 6. BS EN 61747-10-1:2013 10 61747-10-1 IEC:2013 Table 6 Acceleration conditions Acceleration m/s230 50 100 200 500 1 000 2 000 Procedure: The acceleration shall be applied for at leas
