1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Surface mounting technology Environmental and endurancetest methods for surface mountsolder joints Part 1-5: Mech
2、anical shear fatigue testBS EN 62137-1-5:2009National forewordThis British Standard is the UK implementation of EN 62137-1-5:2009. It isidentical to IEC 62137-1-5:2009.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organi
3、zations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 59253 9ICS 31.190Compliance with a British Standard canno
4、t confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 July 2009Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62137-1-5:2009EUROPEAN STANDARD EN 62137-1-5 NORME EUROPENN
5、E EUROPISCHE NORM May 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form a
6、nd by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-5:2009 E ICS 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) Technologie du montage
7、 en surface - Mthodes dessais denvironnement et dendurance des joints brass monts en surface - Partie 1-5: Essai de fatigue par cisaillement mcanique (CEI 62137-1-5:2009) Oberflchenmontage-Technik - Verfahren zur Prfung auf Umgebungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindung
8、en - Teil 1-5: Prfung der Ermdung durch mechanische Scherbeanspruchung (IEC 62137-1-5:2009) This European Standard was approved by CENELEC on 2009-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the
9、 status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, Ger
10、man). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgari
11、a, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 62137-1-5:2009 2 Fo
12、reword The text of document 91/826/FDIS, future edition 1 of IEC 62137-1-5, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-5 on 2009-04-01. The following dates were fixed: latest date by which the EN ha
13、s to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-04-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the
14、 International Standard IEC 62137-1-5:2009 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21:2006 (not modified). IEC 61
15、188-5-8 NOTE Harmonized as EN 61188-5-8:2008 (not modified). _ BS EN 62137-1-5:2009 3 EN 62137-1-5:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of t
16、his document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD appli
17、es. Publication Year Title EN/HD Year IEC 60068-1 - 1)Environmental testing - Part 1: General and guidance EN 60068-1 1994 2)IEC 60194 - 1)Printed board design, manufacture and assembly - Terms and definitions EN 60194 2006 2)IEC 61188-5 Series Printed boards and printed board assemblies - Design an
18、d use - Part 5: Attachment (land/joint) considerations EN 61188-5 Series IEC 61190-1-2 2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly EN 61190-1-2 2007 IEC 61190-1-3 - 1)Attachment materials for e
19、lectronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 2007 2)IEC 61249-2-7 2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials,
20、 clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 2002 2005 IEC 61760-1 - 1)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1
21、2006 2)1)Undated reference. 2) Valid edition at date of issue. BS EN 62137-1-5:2009 2 62137-1-5 IEC:2009 CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .7 3 Terms and definitions .8 4 Test equipment and materials.8 4.1 Test equipment for mechanical shear fatigue testing .8 4.2 T
22、est substrate .8 4.3 Solder alloy .9 4.4 Solder paste9 4.5 Reflow soldering equipment 9 5 Mounting 9 6 Test conditions .10 6.1 Pre-treatment 10 6.2 Test procedures 10 6.3 Judging criteria10 7 Items to be included in the test report.11 8 Items to be given in the product specification .11 Annex A (nor
23、mative) Mechanical shear fatigue test equipment.12 Annex B (normative) Mechanical shear fatigue test procedure .15 Annex C (informative) Evaluation of mechanical properties of a single solder joint by mechanical shear fatigue test .17 Bibliography21 Figure 1 Image drawing on evaluation area of joint
24、 strength.6 Figure 2 Schematic illustrations of thermomechanical and mechanical fatigue for solder joints 7 Figure 3 A typical temperature profile taken by reflow soldering equipment10 Figure A.1 Sample structures of shear fatigue jig .13 Figure B.1 Example of set-up for electrical resistance measur
25、ing.16 Figure C.1 Schematic illustration of the single solder joint for mechanical fatigue testing 18 Figure C.2 Schematic illustration of fixing jig for soldering of the single solder joint .18 Figure C.3 Schematic illustration of the shear fatigue jig19 Figure C.4 Relationship between reaction for
26、ces and the number of cycles during a fatigue test20 Figure C.5 Relationship between the displacement range and fatigue life 20 BS EN 62137-1-5:200962137-1-5 IEC:2009 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT
27、SOLDER JOINTS Part 1-5: Mechanical shear fatigue test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operat
28、ion on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “
29、IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this prepar
30、ation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consen
31、sus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts ar
32、e made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications tr
33、ansparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot
34、 be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and memb
35、ers of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication o
36、r any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication m
37、ay be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-5 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: F
38、DIS Report on voting 91/826/FDIS 91/841/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 62137-1-5:2009 4 62137-1-5 IEC:20
39、09 A list of all parts of the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder joints, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until t
40、he maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 62137-1-5:200962137-1-5 IEC:2009 5 INTRODUCTION The m
41、echanical properties of lead-free solder joints between leads and lands on a printed wiring board are not the same with tin-lead-containing solder joints, due to their solder compositions. Thus, it becomes important to test the mechanical properties of solder joints of different alloys. BS EN 62137-
42、1-5:2009 6 62137-1-5 IEC:2009 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS Part 1-5: Mechanical shear fatigue test 1 Scope The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is desi
43、gned to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing
44、 time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of t
45、he temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by re
46、flow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the sold
47、er joints. NOTE This test, however, does not measure the strength of the electronic components. The test method to evaluate the robustness of the joint to a board is described in IEC 60068-2-21. Component Enlarge Evaluation areaPlated layers Substrate land Intermetallic compound layers SolderSubstra
48、teComponentland Substrate IEC 232/09 Figure 1 Image drawing on evaluation area of joint strength BS EN 62137-1-5:200962137-1-5 IEC:2009 7 SolderThermomechanical fatigue PackageSolderMechanical fatigue PackageMechanical loading Mechanical loading d/2 d/2 L + dd = L (substrate package) T d/2 d/2 L + d
49、 LLIEC 233/09 IEC 234/09 Key d Relative displacement T Temperature range Coefficient of thermal expansion Figure 2 Schematic illustrations of thermomechanical and mechanical fatigue for solder joints 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of
