1、Electronic components Long-term storage of electronic semiconductor devicesPart 2: Deterioration mechanismsBS EN 624352:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62435-2 April 2017 ICS 31.020 English Vers
2、ion Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms (IEC 62435-2:2017) Composants lectroniques - Stockage de longue dure des dispositifs lectroniques semiconducteurs - Partie 2: Mcanismes de dtrioration (IEC 62435-2:2017) Elektronische
3、 Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 2: Schdigungsmechanismen (IEC 62435-2:2017) This European Standard was approved by CENELEC on 2017-02-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving t
4、his European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three offi
5、cial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotech
6、nical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania,
7、Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brus
8、sels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62435-2:2017 E National forewordThis British Standard is the UK implementation of EN 624352:2017. It is identical to IEC 624352:2017.The UK participation in its preparation w
9、as entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The
10、 British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 83549 0ICS 31.020Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 Jul
11、y 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 624352:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62435-2 April 2017 ICS 31.020 English Version Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deteriora
12、tion mechanisms (IEC 62435-2:2017) Composants lectroniques - Stockage de longue dure des dispositifs lectroniques semiconducteurs - Partie 2: Mcanismes de dtrioration (IEC 62435-2:2017) Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 2: Schdigungsmechanismen (IE
13、C 62435-2:2017) This European Standard was approved by CENELEC on 2017-02-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and
14、bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under th
15、e responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia
16、, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Commi
17、ttee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENE
18、LEC Members. Ref. No. EN 62435-2:2017 E BS EN 624352:2017EN 62435-2:2017 2 European foreword The text of document 47/2327/FDIS, future edition 1 of IEC 62435-2, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62435-2:2017. Th
19、e following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-11-28 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-02-28 A
20、ttention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62435-2:2017 was approved
21、 by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-17:1994 NOTE Harmonized as EN 60068-2-17:1994 (not modified). IEC 60068-2-20:2008 NOTE Harmonized as EN 60068-2-20:200
22、8 (not modified). IEC 60721-3-1 NOTE Harmonized as EN 60721-3-1. IEC 60721-3-3 NOTE Harmonized as EN 60721-3-3. IEC 60749-21 NOTE Harmonized as EN 60749-21. IEC 61340-5-1:2007 NOTE Harmonized as EN 61340-5-1:2007 (not modified). IEC/TR 61340-5-2:2007 NOTE Harmonized as CLC/TR 61340-5-2:2008 (not mod
23、ified). IEC 61760-4 NOTE Harmonized as EN 61760-4. IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3. IEC 62435-1 NOTE Harmonized as EN 62435-1. IEC 62435-4 1)NOTE Harmonized as EN 62435-4 1). IEC 62435-5 NOTE Harmonized as EN 62435-5. 1) At draft stage. BS EN 624352:2017EN 62435-2:2017 2 European fo
24、reword The text of document 47/2327/FDIS, future edition 1 of IEC 62435-2, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62435-2:2017. The following dates are fixed: latest date by which the document has to be implemented a
25、t national level by publication of an identical national standard or by endorsement (dop) 2017-11-28 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-02-28 Attention is drawn to the possibility that some of the elements of this document may be
26、 the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62435-2:2017 was approved by CENELEC as a European Standard without any modification. In the official version,
27、for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-17:1994 NOTE Harmonized as EN 60068-2-17:1994 (not modified). IEC 60068-2-20:2008 NOTE Harmonized as EN 60068-2-20:2008 (not modified). IEC 60721-3-1 NOTE Harmonized as EN 60721-3-1. IEC 60721-3-3 NOTE Ha
28、rmonized as EN 60721-3-3. IEC 60749-21 NOTE Harmonized as EN 60749-21. IEC 61340-5-1:2007 NOTE Harmonized as EN 61340-5-1:2007 (not modified). IEC/TR 61340-5-2:2007 NOTE Harmonized as CLC/TR 61340-5-2:2008 (not modified). IEC 61760-4 NOTE Harmonized as EN 61760-4. IEC/TR 62258-3 NOTE Harmonized as C
29、LC/TR 62258-3. IEC 62435-1 NOTE Harmonized as EN 62435-1. IEC 62435-4 1)NOTE Harmonized as EN 62435-4 1). IEC 62435-5 NOTE Harmonized as EN 62435-5. 1) At draft stage. EN 62435-2:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publicat
30、ions The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NO
31、TE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year I
32、EC 60749-20-1 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat EN 60749-20-1 - BS EN 624352:2017This page deliberately left blank 2 IEC 62435-
33、2:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviated terms 7 3.1 Terms and definitions 7 3.2 Abbreviated terms . 8 4 Principles of deterioration 8 4.1 General . 8 4.2 Solderability and oxidisation of lead finishes . 8 4.3 Popc
34、orning . 8 4.4 Delamination . 8 4.5 Corrosion and tarnishing . 8 4.6 Electrical effects . 9 4.7 High-energy ionizing radiation damage . 9 4.8 Storage temperature risks to semiconductor devices . 9 4.9 Noble metal finishes . 9 4.10 Matte tin and other finishes . 9 4.11 Solder ball and solder bump 9 4
35、.12 Devices containing programmable memory flash, programmable logic and other devices containing non-volatile memory cells . 10 5 Technical validation of the components . 10 5.1 Purpose 10 5.2 Test selection criteria 10 5.3 Measurements and tests . 11 5.3.1 Assessment of the supplied batch reliabil
36、ity . 11 5.3.2 List of test methods . 11 5.4 Periodic assessment . 12 Annex A (normative) Failure mechanisms Encapsulated and non-encapsulated active components 14 Bibliography 17 Table 1 List of tests . 11 Table A.1 Failure mechanisms: encapsulated and non-encapsulated active components 14 2 IEC 62
37、435-2:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviated terms 7 3.1 Terms and definitions 7 3.2 Abbreviated terms . 8 4 Principles of deterioration 8 4.1 General . 8 4.2 Solderability and oxidisation of lead finishes . 8 4.3
38、Popcorning . 8 4.4 Delamination . 8 4.5 Corrosion and tarnishing . 8 4.6 Electrical effects . 9 4.7 High-energy ionizing radiation damage . 9 4.8 Storage temperature risks to semiconductor devices . 9 4.9 Noble metal finishes . 9 4.10 Matte tin and other finishes . 9 4.11 Solder ball and solder bump
39、 9 4.12 Devices containing programmable memory flash, programmable logic and other devices containing non-volatile memory cells . 10 5 Technical validation of the components . 10 5.1 Purpose 10 5.2 Test selection criteria 10 5.3 Measurements and tests . 11 5.3.1 Assessment of the supplied batch reli
40、ability . 11 5.3.2 List of test methods . 11 5.4 Periodic assessment . 12 Annex A (normative) Failure mechanisms Encapsulated and non-encapsulated active components 14 Bibliography 17 Table 1 List of tests . 11 Table A.1 Failure mechanisms: encapsulated and non-encapsulated active components 14 BS E
41、N 624352:2017IEC 62435-2:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC COMPONENTS LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES Part 2: Deterioration mechanisms FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardiz
42、ation comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Internat
43、ional Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in
44、 this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
45、two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have
46、the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misint
47、erpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding nationa
48、l or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services car
49、ried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the
