1、 ETSI TS 102 613 V14.0.0 (2018-08) Smart Cards; UICC - Contactless Front-end (CLF) Interface; Physical and data link layer characteristics (Release 14) TECHNICAL SPECIFICATION ETSI ETSI TS 102 613 V14.0.0 (2018-08)2Release 14Reference RTS/SCP-T070138ve00 Keywords smart card ETSI 650 Route des Luciol
2、es F-06921 Sophia Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Important notice The present document can be downloaded from: http:/www.etsi.org/standard
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6、 Notification No part may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified without the written authorization of ETSI. The copy
7、right and the foregoing restriction extend to reproduction in all media. ETSI 2018. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are trademarks of ETSI registered for the benefit of its Members. 3GPPTM and LTETMare trademarks of ETSI registered for the benefit of its Members and
8、 of the 3GPP Organizational Partners. oneM2M logo is protected for the benefit of its Members. GSMand the GSM logo are trademarks registered and owned by the GSM Association. ETSI ETSI TS 102 613 V14.0.0 (2018-08)3Release 14Contents Intellectual Property Rights 6g3Foreword . 6g3Modal verbs terminolo
9、gy 6g3Introduction 7g31 Scope 8g32 References 8g32.1 Normative references . 8g32.2 Informative references 9g33 Definitions, symbols and abbreviations . 9g33.1 Definitions 9g33.2 Symbols 10g33.3 Abbreviations . 10g33.4 Void 11g33A Coding conventions 11g34 Principle of the Single Wire Protocol . 11g35
10、 System architecture 12g35.1 General overview . 12g35.2 ETSI TS 102 221 support . 13g35.3 Configurations 13g35.4 Interaction with other interfaces . 13g36 Physical characteristics. 13g36.1 Temperature range for card operation 13g36.2 Contacts 14g36.2.1 Provision of contacts . 14g36.2.2 Contact activ
11、ation and deactivation 14g36.2.2.0 Terminal behaviour . 14g36.2.2.1 SWIO contact activation . 14g36.2.2.2 SWIO contact deactivation 14g36.2.2.3 Deactivation of the UICC 14g36.2.3 Interface activation . 14g36.2.3.1 Initial interface activation . 14g36.2.3.2 Subsequent interface activation . 16g36.2.3
12、.3 Timing parameters 16g36.2.3.4 Impact on other interfaces . 18g36.2.4 Behaviour of a UICC in a terminal not supporting SWP 19g36.2.5 Behaviour of terminal connected to a UICC not supporting SWP 19g36.2.6 Inactive contacts . 19g37 Electrical characteristics . 19g37.1 Operating conditions 19g37.1.0
13、Voltage and current definitions . 19g37.1.1 Supply voltage classes 20g37.1.2 Vcc(C1) low power mode definition . 20g37.1.3 Signal S1 . 21g37.1.4 Signal S2. 21g37.1.4.0 Definition 21g37.1.4.1 Operating current for S2 21g38 Physical transmission layer 22g38.1 S1 Bit coding and sampling time (Self-sync
14、hronizing code) . 22g38.2 S2 switching management 23g38.3 SWP interface states management 24g38.3.1 SWP states 24g3ETSI ETSI TS 102 613 V14.0.0 (2018-08)4Release 148.3.2 SWP states transitions rules 24g38.4 Power mode states/transitions and Power saving mode . 26g39 Data link layer 27g39.1 Overview
15、27g39.2 Medium Access Control (MAC) layer . 27g39.2.1 Bit order 27g39.2.2 Structure 27g39.2.3 Bit Stuffing . 28g39.2.4 Error detection 28g39.3 Supported LLC layers 29g39.3.0 LPDU structures . 29g39.3.1 Interworking of the LLC layers 30g39.4 ACT LLC definition . 31g39.4.0 ACT LPDU structure 31g39.4.1
16、 SYNC_ID verification process . 33g310 SHDLC LLC definition 33g310.1 SHDLC overview . 33g310.2 Endpoints 33g310.3 SHDLC frame types . 34g310.4 Control Field 34g310.4.0 Coding 34g310.4.1 I-Frames coding 34g310.4.2 S-Frames coding . 35g310.4.3 U-Frames coding 35g310.5 Changing sliding window size and
17、endpoint capabilities . 35g310.5.0 Capabilities negotiation 35g310.5.1 RSET frame payload . 36g310.5.2 UA frame payload . 36g310.6 SHDLC context 36g310.6.0 Definition 36g310.6.1 Constants 36g310.6.2 Variables . 37g310.6.3 Initial Reset State 37g310.7 SHDLC sequence of frames . 38g310.7.1 Nomenclatur
18、e 38g310.7.2 Link establishment with default sliding window size . 38g310.7.3 Link establishment with custom sliding window size . 39g310.7.4 Data flow 40g310.7.5 Reject (go N back) 41g310.7.6 Last Frame loss . 41g310.7.7 Receive and not ready . 42g310.7.8 Selective reject 42g310.8 Implementation mo
19、del 42g310.8.0 Sequence number calculation . 42g310.8.1 Information Frame emission . 43g310.8.2 Information Frame reception 44g310.8.3 Reception Ready Frame reception 45g310.8.4 Reject Frame reception . 45g310.8.5 Selective Reject Frame reception 46g310.8.6 Acknowledge timeout . 46g310.8.7 Guarding/
20、transmit timeout 47g311 CLT LLC definition . 47g311.1 System Assumptions 47g311.2 Overview 47g311.2a Supported RF protocols 47g311.3 CLT Frame Format . 48g311.4 CLT Command Set . 49g311.5 CLT Frame Interpretation 49g311.5.1 CLT frames with Type A aligned DATA_FIELD 49g311.5.2 Handling of DATA_FIELD
21、by the CLF . 51g3ETSI ETSI TS 102 613 V14.0.0 (2018-08)5Release 1411.5.3 Handling of ADMIN_FIELD . 51g311.5.3.1 CL_PROTO_INF(A). 51g311.5.3.2 CL_PROTO_INF(F) . 52g311.5.3.3 CL_GOTO_INIT and CL_GOTO_HALT 53g311.6 CLT Protocol Rules 53g311.6.1 Rules for the CLF . 53g311.6.2 Rules for the UICC . 54g312
22、 Timing and performance 54g312.1 SHDLC Data transmission mode . 54g312.1.1 CLF processing delay when receiving data over an RF-link 54g312.1.2 CLF processing delay when sending data over an RF-link . 55g312.2 CLT data transmission mode for ISO/IEC 14443 Type A . 55g312.2.1 CLF processing delay when
23、receiving data from the PCD . 55g312.2.2 CLF processing delay when sending data to the PCD 55g312.2.3 Timing values for the CLF processing delay 56g312.2.4 Timing value for the CLF processing delay (Request Guard Time) . 57g312.3 CLT data transmission mode for ISO/IEC18092 212 kbps/424 kbps passive
24、mode 57g3Annex A (informative): Change history . 58g3History 60g3ETSI ETSI TS 102 613 V14.0.0 (2018-08)6Release 14Intellectual Property Rights Essential patents IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information pertaining to these essen
25、tial IPRs, if any, is publicly available for ETSI members and non-members, and can be found in ETSI SR 000 314: “Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards“, which is available from the ETSI Secretariat. Latest updates
26、 are available on the ETSI Web server (https:/ipr.etsi.org/). Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web server)
27、 which are, or may be, or may become, essential to the present document. Trademarks The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners. ETSI claims no ownership of these except for any which are indicated as being the property of ETSI,
28、and conveys no right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks. Foreword This Technical Specification (TS) has been produce
29、d by ETSI Technical Committee Smart Card Platform (SCP). The contents of the present document are subject to continuing work within TC SCP and may change following formal TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with an identifying
30、 change of release date and an increase in version number as follows: Version x.y.z where: x the first digit: 0 early working draft; 1 presented to TC SCP for information; 2 presented to TC SCP for approval; 3 or greater indicates TC SCP approved document under change control. y the second digit is
31、incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc. z the third digit is incremented when editorial only changes have been incorporated in the document. Modal verbs terminology In the present document “shall“, “shall not“, “should“, “should not“, “may“,
32、“need not“, “will“, “will not“, “can“ and “cannot“ are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “must not“ are NOT allowed in ETSI deliverables except when used in direct citation. ETSI ETSI TS 102 613 V14.0.0
33、 (2018-08)7Release 14Introduction The present document defines a communication interface between the UICC and a contactless frontend (CLF) in the terminal. This interface allows the card emulation mode independent of the power state of the terminal as well as the reader mode when the terminal is bat
34、tery powered. The aim of the present document is to ensure interoperability between a UICC and the CLF in the terminal independently of the respective manufacturer, card issuer or operator. Any internal technical realization of either the UICC or the CLF is only specified where these are reflected o
35、ver the interface. ETSI ETSI TS 102 613 V14.0.0 (2018-08)8Release 141 Scope The present document specifies the Single Wire Protocol (SWP). SWP is the interface between the UICC and the CLF. The present document defines: Layer 1: The physical layer which is responsible for activating, maintaining and
36、 deactivating the physical link between the UICC and the CLF. It defines electrical (voltage and current levels, timing and coding of voltage and current levels), mechanical (physical contacts) and functional (data rates) specifications. It also defines the initial communication establishment and th
37、e end of the connection. Layer 2: The data link layer which is responsible for the physical addressing of the data through frames and Link Protocol Data Units (LPDU). The data link layer is also responsible for error notification, ordered delivery of frames and flow control. This layer can be split
38、into two sub-layers: - The Medium Access Control (MAC) layer which manages frames. - The Logical Link Control layer which manages LPDUs and is responsible for the error-free exchange of data between nodes. Three different Logical Link Control layers are defined in the present document. 2 References
39、2.1 Normative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the referenced document (including any amen
40、dments) applies. In the case of a reference to a TC SCP document, a non specific reference implicitly refers to the latest version of that document in the same Release as the present document. Referenced documents which are not found to be publicly available in the expected location might be found a
41、t https:/docbox.etsi.org/Reference/. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are necessary for the application of the present document. 1 ETSI TS 102 221: “Smart Cards
42、; UICC-Terminal interface; Physical and logical characteristics“. 2 ISO/IEC 14443-2: “Identification cards - Contactless integrated circuit cards - Proximity cards - Part 2: Radio frequency power and signal interface“. 3 ISO/IEC 14443-3: “Identification cards - Contactless integrated circuit(s) card
43、s - Proximity cards - Part 3: Initialization and anticollision“. 4 ISO/IEC 14443-4: “Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 4: Transmission protocol“. 5 ISO/IEC 13239: “Information technology - Telecommunications and information exchange between syste
44、ms - High-level data link control (HDLC) procedures“. 6 ETSI TS 102 600: “Smart Cards; UICC-Terminal interface; Characteristics of the USB interface“. 7 ETSI TS 102 223: “Smart Cards; Card Application Toolkit (CAT)“. 8 ISO/IEC 18092: “Information technology - Telecommunications and information excha
45、nge between systems - Near Field Communication - Interface and Protocol (NFCIP-1)“. ETSI ETSI TS 102 613 V14.0.0 (2018-08)9Release 142.2 Informative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific ref
46、erences, only the cited version applies. For non-specific references, the latest version of the referenced document (including any amendments) applies. In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version of that document in the same Relea
47、se as the present document. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are not necessary for the application of the present document but they assist the user with regard
48、to a particular subject area. Not applicable. 3 Definitions, symbols and abbreviations 3.1 Definitions For the purposes of the present document, the following terms and definitions apply: card emulation mode: mode where the UICC emulates a contactless card through the CLF class A operating condition
49、s: terminal or a smart card operating at 5 V 10 % class B operating conditions: terminal or a smart card operating at 3 V 10 % class C operating conditions: terminal or a smart card operating at 1,8 V 10 % contactless frontend: circuitry in the terminal which: handles the analogue part of the contactless communication; handles communication protocol layers of the contactless transmission link; exchanges data with the UICC. full duplex: simultaneous bidirectional data flow half duplex: sequential bidirectional data flow idle bit
