1、 ETSI TS 102 671 V9.2.0 (2015-06) Smart Cards; Machine to Machine UICC; Physical and logical characteristics (Release 9) TECHNICAL SPECIFICATION ETSI ETSI TS 102 671 V9.2.0 (2015-06)2Release 9 Reference RTS/SCP-T090071v920 Keywords M2M, MFF ETSI 650 Route des Lucioles F-06921 Sophia Antipolis Cedex
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6、tilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified without the written authorization of ETSI. The copyright and the foregoing restriction extend t
7、o reproduction in all media. European Telecommunications Standards Institute 2015. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are Trade Marks of ETSI registered for the benefit of its Members. 3GPPTM and LTE are Trade Marks of ETSI registered for the benefit of its Members and
8、 of the 3GPP Organizational Partners. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association. ETSI ETSI TS 102 671 V9.2.0 (2015-06)3Release 9 Contents Intellectual Property Rights 5g3Foreword . 5g3Modal verbs terminology 5g31 Scope 6g32 References 6g32.1 Normative reference
9、s . 6g32.2 Informative references 7g33 Definitions and abbreviations . 7g33.1 Definitions 7g33.2 Abbreviations . 7g34 Overview 8g35 Definition of Environmental Classes 8g35.1 Environmental condition classification system 8g35.2 Operational and Storage Temperature (TX) . 8g35.2.0 Overview 8g35.2.1 Te
10、mperature (TS) -25 C to +85 C 9g35.2.2 Temperature (TA) -40 C to +85 C . 9g35.2.3 Temperature (TB) -40 C to +105 C . 9g35.2.4 Temperature (TC) -40 C to +125 C . 9g35.3 Moisture/Reflow conditions (MX) . 9g35.3.0 Overview 9g35.3.1 Moisture/Reflow conditions (MA) . 9g35.4 Humidity (HX) . 9g35.4.0 Overv
11、iew 9g35.4.1 Humidity (class HA) - High humidity 9g35.5 Corrosion (CX) . 9g35.5.0 Overview 9g35.5.1 Corrosion (CA to CD) - Salt atmosphere 10g35.6 Vibration (VX) . 10g35.6.0 Overview 10g35.6.1 Vibration (VA) - Automotive vibration 10g35.7 Void 10g35.8 Shock (SX) . 10g35.8.0 Overview 10g35.8.1 Shock
12、(SA) - Automotive shock . 10g35.9 Data Retention Time (RX) . 10g35.9.0 Overview 10g35.9.1 Data Retention Time (RA) - 10 years . 10g35.9.2 Data Retention Time (RB) - 12 years . 10g35.9.3 Data Retention Time (RC) - 15 years . 11g35.10 Minimum Updates (UX) 11g35.10.0 Overview 11g35.10.1 Minimum Updates
13、 (UA) - 100 000 . 11g35.10.2 Minimum Updates (UB) - 500 000 . 11g35.10.3 Minimum Updates (UC) - 1 000 000 11g36 M2M UICC - Physical Characteristics . 11g36.0 Basic requirements . 11g36.1 General M2M UICC physical characteristics . 11g36.1.0 Introduction. 11g36.1.1 Contacts 11g36.2 Specific MFF physi
14、cal characteristics 11g36.2.0 Introduction. 11g36.2.1 MFF1 12g3ETSI ETSI TS 102 671 V9.2.0 (2015-06)4Release 9 6.2.1.0 Dimensions 12g36.2.1.1 Orientation mark for the bottom of the package . 13g36.2.1.2 Orientation mark for top of package . 13g36.2.2 MFF2 14g36.2.2.1 Dimensions 14g36.2.2.1 Orientati
15、on mark for the bottom of the package . 14g36.2.2.2 Orientation mark for top of package . 15g37 Electrical and Logical specifications of the MFF UICC - Terminal interface . 15g37.0 Requirements 15g37.1 Voltage Class support . 15g38 Device Pairing Mechanism 15g38.0 Introduction 15g38.1 Secure Channel
16、 Pairing 15g38.2 CAT application pairing . 16g3Annex A (informative): PCB layout for the MFF 17g3Annex B (informative): Change history . 19g3History 20g3ETSI ETSI TS 102 671 V9.2.0 (2015-06)5Release 9 Intellectual Property Rights IPRs essential or potentially essential to the present document may ha
17、ve been declared to ETSI. The information pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found in ETSI SR 000 314: “Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI stand
18、ards“, which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web server (http:/ipr.etsi.org). Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not refe
19、renced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become, essential to the present document. Foreword This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP). The contents of the present document are subje
20、ct to continuing work within TC SCP and may change following formal TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with an identifying change of release date and an increase in version number as follows: Version x.y.z where: x the first
21、digit: 0 early working draft; 1 presented to TC SCP for information; 2 presented to TC SCP for approval; 3 or greater indicates TC SCP approved document under change control. y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc. z the
22、 third digit is incremented when editorial only changes have been incorporated in the document. Modal verbs terminology In the present document “shall“, “shall not“, “should“, “should not“, “may“, “need not“, “will“, “will not“, “can“ and “cannot“ are to be interpreted as described in clause 3.2 of
23、the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “must not“ are NOT allowed in ETSI deliverables except when used in direct citation. ETSI ETSI TS 102 671 V9.2.0 (2015-06)6Release 9 1 Scope The present document details the technical specifications for M2M UICCs. Sp
24、ecifically, the present document specifies: Physical, logical and electrical specifications for additional machine to machine form factors for the M2M UICC. Environmental specifications of the M2M UICC dedicated to M2M applications for all specified UICC form factors. Device pairing mechanisms that
25、allow the M2M UICC to verify the terminal with which it is operating. 2 References 2.1 Normative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, only the cited version applies. For non-spe
26、cific references, the latest version of the reference document (including any amendments) applies. In the case of a reference to a TC SCP document, a non specific reference implicitly refers to the latest version of that document in the same Release as the present document. Referenced documents whic
27、h are not found to be publicly available in the expected location might be found at http:/docbox.etsi.org/Reference. NOTE: While any hyperlinks included in this clause were valid at the time of publication ETSI cannot guarantee their long term validity. The following referenced documents are necessa
28、ry for the application of the present document. 1 ETSI TS 102 221: “Smart Cards; UICC-Terminal interface; Physical and logical characteristics“. 2 ETSI TS 102 412: “Smart Cards; Smart Card Platform Requirements Stage 1“. 3 ETSI TS 102 613: “Smart Cards; UICC - Contactless Front-end (CLF) Interface;
29、Part 1: Physical and data link layer characteristics“. 4 ETSI TS 102 600: “Smart Cards; UICC-Terminal interface; Characteristics of the USB interface“. 5 ETSI TS 102 484: “Smart Cards; Secure channel between a UICC and an end-point terminal“. 6 ETSI TS 102 223: “Smart Cards; Card Application Toolkit
30、 (CAT)“. 7 IPC/JEDEC J-STD-020D.1: “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices“. 8 JEDEC JESD22-A104D: “Temperature Cycling“. 9 JEDEC JESD22-B103B: “Vibration, Variable Frequency“. 10 JEDEC JESD22-B104C: “Mechanical Shock“. 11 JEDEC JESD22-A107B: “Sa
31、lt Atmosphere“. NOTE: For JEDEC documents see http:/jedec.org/download/. ETSI ETSI TS 102 671 V9.2.0 (2015-06)7Release 9 2.2 Informative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, onl
32、y the cited version applies. For non-specific references, the latest version of the reference document (including any amendments) applies. In the case of a reference to a TC SCP document, a non specific reference implicitly refers to the latest version of that document in the same Release as the pre
33、sent document. Referenced documents which are not found to be publicly available in the expected location might be found at http:/docbox.etsi.org/Reference. NOTE: While any hyperlinks included in this clause were valid at the time of publication ETSI cannot guarantee their long term validity. The fo
34、llowing referenced documents are not necessary for the application of the present document but they assist the user with regard to a particular subject area. Not applicable. 3 Definitions and abbreviations 3.1 Definitions For the purposes of the present document, the following terms and definitions
35、apply: M2M communication module: electronics system including all necessary components to establish wireless communications between machines NOTE: M2M communication modules are usually integrated directly into target devices, such as Automated Meter Readers (AMRs), vending machines, alarm systems, a
36、utomotive equipment or others. M2M UICC: UICC with specific properties for use in M2M environments, this includes existing form factors and the new form factors MFF1 and MFF2 Machine to Machine (Communication): communication between remotely deployed devices with specific responsibilities and requir
37、ing little or no human intervention, which are all connected to an application server via the mobile network data communications MFF (M2M Form Factor): new form factor dedicated to M2M applications 3.2 Abbreviations For the purposes of the present document, the following abbreviations apply: ASCII A
38、merican Standard Code for Information Interchange CAT Card Application Toolkit ESN Electronic Serial Number IMEI International Mobile Equipment Identity IMEISV International Mobile Equipment Identity and Software Version M2M Machine to Machine (Communication) MEID Mobile Equipment IDentifier MFF Mac
39、hine to Machine Form Factor PCB Printed Circuit Board ETSI ETSI TS 102 671 V9.2.0 (2015-06)8Release 9 4 Overview The present document details: The environmental specification of the M2M UICC both for the existing form factors and for the optional form factor MFF. The definition of the environmental
40、classes for the M2M UICC. The physical characteristics of the M2M UICC. The electrical specifications of the M2M UICC. The logical characteristics of the M2M UICC. The definition of device pairing mechanisms between the M2M UICC and the terminal. The requirements and several use cases for the M2M UI
41、CC are detailed in ETSI TS 102 412 2. 5 Definition of Environmental Classes 5.1 Environmental condition classification system The following classification system allows the easy identification of the M2M UICCs environmental performance. The M2M UICC shall be classified with a string representing its
42、 environmental performance. This string has two characters for each environmental property and is separated from each condition by a dash (e.g. TA - FA - - RA). The first letter defines the environmental property as detailed in table 5.1 and the second letter is the level of support for this propert
43、y as defined in each clause. If a M2M UICC does not meet any level specified in the present document for a particular environmental property then this property shall not be present in the string representing its environmental performance. There is no defined order for the environmental properties. T
44、able 5.1: Description of the environmental property indicators Environmental property letter Description of environmental property Property details in clause T Operational and storage temperature 5.2 M Moisture/Reflow conditions 5.3H Humidity 5.4C Corrosion 5.5V Vibration 5.6S Shock 5.8 R Data Reten
45、tion time 5.9 U Minimum Updates 5.105.2 Operational and Storage Temperature (TX) 5.2.0 Overview The TX property defines the M2M UICC performance for operational and storage temperature. Support of a given temperature range for a M2M UICC operation implies that the M2M UICC shall withstand the follow
46、ing conditions: 500 temperature cycles within the full supported range; 2 cycles per hour. Testing temperature cycling shall be in accordance to JESD22-A104 8. ETSI ETSI TS 102 671 V9.2.0 (2015-06)9Release 9 5.2.1 Temperature (TS) -25 C to +85 C M2M UICCs indicating TS as their temperature property
47、shall conform to the storage and operational temperature specifications detailed in ETSI TS 102 221 1 for the standard temperature range. 5.2.2 Temperature (TA) -40 C to +85 C M2M UICCs indicating TA as their temperature property shall conform to the storage and operational temperature specification
48、s detailed in ETSI TS 102 221 1 for class A specific UICC environmental conditions. 5.2.3 Temperature (TB) -40 C to +105 C M2M UICCs indicating TB as their temperature property shall conform to the storage and operational temperature specifications detailed in ETSI TS 102 221 1 for class B specific
49、UICC environmental conditions. 5.2.4 Temperature (TC) -40 C to +125 C M2M UICCs indicating TC as their temperature property shall conform to the storage and operational temperature specifications detailed in ETSI TS 102 221 1 for class C specific UICC environmental conditions. 5.3 Moisture/Reflow conditions (MX) 5.3.0 Overview The MX property defines the M2M UICC performance for moisture/reflow conditions that may be experienced during the manufacturing of the M2M communication module. 5.3.1 Moist
