1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2004 12 16 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.5, 3.7 & 4 1985 03 11 Released C3P1-DR526998 E. Rezendes Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 1 of 3 EPOXY, TWO-COMPONENT - THERMALLY CONDUCTIVE
2、 ESB-M3D139-A WHEN USED WITH SILICA SAND - POTTING COMPOUND 1. SCOPE The material defined by this specification is a two-component epoxy tape casting resin which, when mixed in the proper ratio, cures to a flexible, thermally conductive sealer system. 2. APPLICATION This specification was released o
3、riginally for material used as a potting compound with the ability to adhere and densely encapsulate (without any voids) the wiring and other components of the rear, front and center sensor assemblies of the air bag system. The potting compound is to be used in conjunction with the originally approv
4、ed silica sand to produce a low shrinkage and high shock resistance in the epoxy/sand composite compound. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111
5、-A). 3.3 UNMIXED COMPONENT PROPERTIES Resin Hardener 3.3.1 Color White Black 3.3.2 Solids, % min 99-100 99-100 (ASTM D 2834, except heat at 100 +/- 2 C for 3 h in a mechanical convection oven) 3.3.3 Viscosity at 23 +/- 2 C, mPa.s (ASTM D 2393, Brookfield RVT) Spindle No. 3, 50 rpm 1200-1800 - Spindl
6、e No. 2, 100 rpm - 120-170 3.3.4 Weight Per Volume, 1.12 - 1.14 0.96 - 0.97 kg/L (ASTM D 816) The weight tolerance for any supplier shall be +/- 0.02 kg/L based on the weight of the original approved productions (see para 5.3). ENGINEERING MATERIAL SPECIFICATIONESB-M3D139-A Printed copies are uncont
7、rolled Copyright 2004, Ford Global Technologies, LLC Page 2 of 3 3.4 MIXED COMPONENT PROPERTIES 3.4.1 Mixing Ratio by Weight 5:2 (Resin to Hardener) 3.4.2 Pot Life 30 +/- 5 minutes in 0.225 kg lots at 23 +/- 2 C. 3.4.3 Recommended Cure Cycle 24 h at 23 +/- 2 C. 3.6 FUNCTIONAL APPROVAL Material being
8、 evaluated for initial approval to the specification shall be subjected to a production trial in an area intended for use. This trial will be conducted after all other specification requirements have been met including laboratory evaluation and engineering approval for the trial. The assembly requir
9、ements must be met per specifications ES-E53B-14A685-A and ES-E53B-14A686-A. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 VISCOSITY OF MIXED COMPONENT 500 - 1000 mPas (Spindle No. 2, 20 rpm, 23
10、+/- 2 C) 5.2 VOLUME RESISTIVITY AT 23 +/- 2 C 3 x 1214 cm (ASTM D 257) 5.3 DIELECTRIC STRENGTH, min 12 kV/mm (ASTM D 149, up to 106Hz at 23 +/- 2 C) 5.4 DIELECTRIC CONSTANT 4.4 (ASTM D 150, up to 106Hz at 23 +/- 2 C) 5.5 DISSIPATION FACTOR 0.036 (ASTM D 150, up to 106Hz at 23 +/- 2 C) 5.6 SPECIFIC G
11、RAVITY (ASTM D 792) Resin 1.13 Hardener 0.96 5.7 SHELF LIFE AT 23 +/- 2 C 12 months 5.8 FLASH POINT Resin 213 C Hardener 79 C ENGINEERING MATERIAL SPECIFICATIONESB-M3D139-A Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 3 of 3 5.9 USABLE RANGE -40 to 105 C 5.10 PO
12、TTING CHARACTERISTICS The primary function of this potting compound is to protect the sensor components from any damage due to vibrations, thermal stresses, temperature variations, chemical and moisture attack. The assembly requirements should be referred to the performance specifications ES-E53B-14
13、A685 and ES-E53B-14A686-A. 5.11 CURED MATERIAL PROPERTIES 5.11.1 Tensile Strength 3.4 - 5.5 MPa (ASTM D 412, Die C) 5.11.2 Elongation 125 - 150% (ASTM D 412, Die C) 5.11.3 Hardness, Durometer A 50 - 60 (ASTM D 2240) 5.11.4 Water Absorption, max 2.0% (ASTM D 570, 24 h immersion) 5.11.5 Weight Loss, max 2.0% (24 h at 121 +/- 2 C)
