FORD WSB-M3D174-A-2004 UNSATURATED POLYESTER (UP) 60% GLASS FIBER REINFORCED SHEET MOLDING COMPOUND TO BE USED WITH FORD WSS-M99P1111-A 《60%玻璃纤维增强的不饱和聚酯(UP)片状成型料 与标准FORD WSS-M99.pdf

上传人:livefirmly316 文档编号:749030 上传时间:2019-01-14 格式:PDF 页数:4 大小:126.38KB
下载 相关 举报
FORD WSB-M3D174-A-2004 UNSATURATED POLYESTER (UP) 60% GLASS FIBER REINFORCED SHEET MOLDING COMPOUND  TO BE USED WITH FORD WSS-M99P1111-A  《60%玻璃纤维增强的不饱和聚酯(UP)片状成型料  与标准FORD WSS-M99.pdf_第1页
第1页 / 共4页
FORD WSB-M3D174-A-2004 UNSATURATED POLYESTER (UP) 60% GLASS FIBER REINFORCED SHEET MOLDING COMPOUND  TO BE USED WITH FORD WSS-M99P1111-A  《60%玻璃纤维增强的不饱和聚酯(UP)片状成型料  与标准FORD WSS-M99.pdf_第2页
第2页 / 共4页
FORD WSB-M3D174-A-2004 UNSATURATED POLYESTER (UP) 60% GLASS FIBER REINFORCED SHEET MOLDING COMPOUND  TO BE USED WITH FORD WSS-M99P1111-A  《60%玻璃纤维增强的不饱和聚酯(UP)片状成型料  与标准FORD WSS-M99.pdf_第3页
第3页 / 共4页
FORD WSB-M3D174-A-2004 UNSATURATED POLYESTER (UP) 60% GLASS FIBER REINFORCED SHEET MOLDING COMPOUND  TO BE USED WITH FORD WSS-M99P1111-A  《60%玻璃纤维增强的不饱和聚酯(UP)片状成型料  与标准FORD WSS-M99.pdf_第4页
第4页 / 共4页
亲,该文档总共4页,全部预览完了,如果喜欢就下载吧!
资源描述

1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2004 12 21 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.3, 3.6, 3.7 & 4 1994 07 15 Released NB00I10043054370 T.A. Honey Printed copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 1 of 4 UNSATURATED POLYESTER (UP), 60% GLAS

2、S FIBER WSB-M3D174-A REINFORCED SHEET MOLDING COMPOUND 1. SCOPE The material defined by this specification is 23 mm minimum long glass fiber reinforced unsaturated polyester (UP) sheet molding compound. 2. APPLICATION This specification was released originally for material used for structural 60% gl

3、ass reinforced, dimensionably stable inner panels. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1.1 All requirements of this specification, iden

4、tified by symbol (s), shall be met with data representing 3 sigma values. 3.4 MOLDED TEST SPECIMEN 3.4.1 Preparation of Test Specimens All test specimens shall be prepared from cross-ply molded plaques or equivalent. The plaques are to be manufactured from the same material and under equivalent cond

5、itions as production parts. The plaques shall have the following dimensions. 300 x 300 mm, minimum x 2.5 +/- 0.2 mm Prepared specimens must show no evidence of fiber tear or loose fiber strands protruding from the specimens. No additional annealing of specimens is allowed. 3.4.2 Density 1.79 - 1.85

6、g/cm3(ISO 1183, Method A) (s) 3.4.3 Filler Content 3.4.3.1 Ash Content 68 - 73% (ISO 3451/1, Method A, 1 h at 650 +/- 25 C) ENGINEERING MATERIAL SPECIFICATIONWSB-M3D174-APrinted copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 2 of 4 3.4.3.2 Glass Fiber Content, by Weight 5

7、6 - 63% Test Method: ISO 3451/1, Method B, 1 h at 650 +/- 25 C, except use 5% by volume hydrochloric acid solution for 15 min. Rinse the glass fibers several times with distilled water before drying in an oven for 2 h at 120 +/- 2 C. After cooling, weigh the crucibles and calculate the percent glass

8、 fibers. 3.4.3.3 Glass Fiber Length, min 23 mm (Optical evaluation method) (s) 3.4.4 Tensile Strength at Break, min 135 MPa (ISO R 527, 150 minimum x 10 x 2.5 +/- 0.2 mm specimen, 5 mm/min test speed) (s) 3.4.5 Flexural Modulus, min 12.7 GPa (ISO 178, 60 x 10 x 2.5 +/- 0.2 mm specimen, 40 mm support

9、 span, 2 mm/minute test speed) (s) 3.4.6 Flexural Strength, min 269 MPa (ISO 178, 60 x 10 x 2.5 +/- 0.2 mm specimen, 40 mm support span, 2 mm/minute test speed) 3.4.7 Shear Modulus at 23 C 3120 - 5200 MPa (ASTM D 4065, forced constant amplitude, fixed frequency of 1 Hz +/- 15%, strain level below 1%

10、 Specimen approx. 60 x 10 x 2.5 +/- 0.2 mm cut from the center of specimen A. Specimen length between clamps 35-40 mm. Soak time at each temperature interval - 3 minutes minimum) Additionally, a Shear Modulus vs. Temperature curve shall be plotted for -50 to +280 C temperature range, at 5 C minimum

11、 intervals. The plotted curve must be within tolerance range shown on page 4. (s) 3.4.8 Impact Strength, Izod, min (ISO 180, Method A, 63.5 x 12.7 x 2.5 +/- 0.2 mm specimen, 10 specimens minimum) 3.4.8.1 At 23 +/- 2 C 118 kJ/m23.4.8.2 At -40 +/- 2 C 152 kJ/m2The test specimens must be conditioned fo

12、r minimum of 6 h at the above specified temperature prior to impact test. Low temperature testing shall be done within the cold box. (s) 3.4.9 Heat Deflection Temperature, min 250 C (ISO 75, 120 x 10 x 2.5 +/- 0.2 mm specimen, 0.32 +/- 0.01 mm deflection. At 1.80 MPa) ENGINEERING MATERIAL SPECIFICAT

13、IONWSB-M3D174-APrinted copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 3 of 4 (s) 3.4.10 Water Absorption, max 0.4% (ISO 62, 24 h, 50 x 50 x 2.5 +/- 0.2 mm specimen) 3.4.11 Heat Aging Performance (ISO 188, except 150 +/- 50 air changes/h, 1000 h at 160 +/- 2 C. Unaged prop

14、erty values shall be determined at the time of the aged properties determination) 3.4.11.1 Tensile Strength at Max Load Change +/- 25% (Test Method per para 3.4.4) 3.4.11.2 Flexural Strength Change +/- 25% (Test Method per para 3.4.6) 3.4.11.3 Impact Strength, Izod Change +/- 25% (Test Method per pa

15、ra 3.4.8.1, specimens to be notched before heat aging) 3.5 FLAMMABILITY (ISO 3795) Burn Rate, max 100 mm/minute The specimen size required for material approval is 355 x 100 x 2.5 +/- 0.1 mm with a smooth surface. 5. GENERAL INFORMATION The information given below is provided for clarification and a

16、ssistance in meeting the requirements of this specification. 5.1 COEFFICIENT OF LINEAR THERMAL EXPANSION 1.38-5/ C (ASTM D 696) 5.2 MOLD SHRINKAGE (ISO 2577, approx. 300 x 300 x 2.5 +/- 0.2 mm compression molded specimen) 5.2.1 Molding Shrinkage . After 48 h at 23 +/- 2 C 0.06% 5.2.2 Post Shrinkage . After 48 h at 120 C 0.05% 5.3 RECYCLING CODE UP- (GF+M) 70 ENGINEERING MATERIAL SPECIFICATIONWSB-M3D174-APrinted copies are uncontrolled Copyright 2004, Ford Global Technologies, LLC Page 4 of 4

展开阅读全文
相关资源
猜你喜欢
  • DLA MIL-PRF-19500 428 H-2011 SEMICONDUCTOR DEVICE FIELD-EFFECT TRANSISTOR N-CHANNEL SILICON TYPE 2N4416A AND 2N4416AUB JAN JANTX JANTXV AND JANS.pdf DLA MIL-PRF-19500 428 H-2011 SEMICONDUCTOR DEVICE FIELD-EFFECT TRANSISTOR N-CHANNEL SILICON TYPE 2N4416A AND 2N4416AUB JAN JANTX JANTXV AND JANS.pdf
  • DLA MIL-PRF-19500 430 C-2011 SEMICONDUCTOR DEVICE DUAL FIELD EFFECT TRANSISTORS N-CHANNEL SILICON TYPES 2N5545 2N5546 AND 2N5547 JAN JANTX AND JANTXV.pdf DLA MIL-PRF-19500 430 C-2011 SEMICONDUCTOR DEVICE DUAL FIELD EFFECT TRANSISTORS N-CHANNEL SILICON TYPES 2N5545 2N5546 AND 2N5547 JAN JANTX AND JANTXV.pdf
  • DLA MIL-PRF-19500 431 E-2011 SEMICONDUCTOR DEVICE FIELD EFFECT TRANSISTORS N-CHANNEL SILICON TYPES 2N4091 2N4092 2N4093 2N4091UB 2N4092UB AND 2N4093UB JAN JANTX AND JANTXV.pdf DLA MIL-PRF-19500 431 E-2011 SEMICONDUCTOR DEVICE FIELD EFFECT TRANSISTORS N-CHANNEL SILICON TYPES 2N4091 2N4092 2N4093 2N4091UB 2N4092UB AND 2N4093UB JAN JANTX AND JANTXV.pdf
  • DLA MIL-PRF-19500 433 H VALID NOTICE 1-2011 Semiconductor Device Transistor PNP Silicon High-Power Type 2N4399 and 2N5745 JAN JANTX JANTXV and JANS.pdf DLA MIL-PRF-19500 433 H VALID NOTICE 1-2011 Semiconductor Device Transistor PNP Silicon High-Power Type 2N4399 and 2N5745 JAN JANTX JANTXV and JANS.pdf
  • DLA MIL-PRF-19500 435 L-2012 SEMICONDUCTOR DEVICE DIODE SILICON LOW-NOISE VOLTAGE REGULATOR TYPES 1N4099-1 THROUGH 1N4135-1 1N4614-1 THROUGH 1N4627-1 1N4099UR-1 THROUGH 1N4135UR-1 A.pdf DLA MIL-PRF-19500 435 L-2012 SEMICONDUCTOR DEVICE DIODE SILICON LOW-NOISE VOLTAGE REGULATOR TYPES 1N4099-1 THROUGH 1N4135-1 1N4614-1 THROUGH 1N4627-1 1N4099UR-1 THROUGH 1N4135UR-1 A.pdf
  • DLA MIL-PRF-19500 436 A VALID NOTICE 2-2011 Semiconductor Device Diode Silicon Voltage-Variable Capacitor Types 1N5461B thru 1N5476B and 1N5461C thru 1N5476C JAN JANTX and JANTXV.pdf DLA MIL-PRF-19500 436 A VALID NOTICE 2-2011 Semiconductor Device Diode Silicon Voltage-Variable Capacitor Types 1N5461B thru 1N5476B and 1N5461C thru 1N5476C JAN JANTX and JANTXV.pdf
  • DLA MIL-PRF-19500 439 G-2012 SEMICONDUCTOR DEVICE TRANSISTOR NPN SILICON HIGH-POWER TYPES 2N5038 AND 2N5039 JAN JANTX JANTXV JANS JANHC AND JANKC.pdf DLA MIL-PRF-19500 439 G-2012 SEMICONDUCTOR DEVICE TRANSISTOR NPN SILICON HIGH-POWER TYPES 2N5038 AND 2N5039 JAN JANTX JANTXV JANS JANHC AND JANKC.pdf
  • DLA MIL-PRF-19500 441 K-2010 SEMICONDUCTOR DEVICE TRANSISTOR PNP SILICON POWER TYPES 2N3740 2N3740U4 2N3741 AND 2N3741U4 JAN JANTX JANTXV JANS JANSM JANSD JANSP JANSL JANSR JANSF J .pdf DLA MIL-PRF-19500 441 K-2010 SEMICONDUCTOR DEVICE TRANSISTOR PNP SILICON POWER TYPES 2N3740 2N3740U4 2N3741 AND 2N3741U4 JAN JANTX JANTXV JANS JANSM JANSD JANSP JANSL JANSR JANSF J .pdf
  • DLA MIL-PRF-19500 444 M-2011 SEMICONDUCTOR DEVICE DIODE SILICON SWITCHING SCHOTTKY TYPES 1N5711-1 1N5711UR-1 1N5711UB 1N5711UBCA 1N5711UBD 1N5711UBCC 1N5712-1 1N5712UR-1 1N5712UB 1-.pdf DLA MIL-PRF-19500 444 M-2011 SEMICONDUCTOR DEVICE DIODE SILICON SWITCHING SCHOTTKY TYPES 1N5711-1 1N5711UR-1 1N5711UB 1N5711UBCA 1N5711UBD 1N5711UBCC 1N5712-1 1N5712UR-1 1N5712UB 1-.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1