1、ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions2003 01 21 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.15, 3.16, 4 deleted 1992 01 24 DE00E00107002126 Released Printed copies are uncontrolled Page 1 of 2 Copyright 2002, Ford Global Technologies, Inc.
2、ADHESIVE, EPOXY, THERMAL CURE, SURFACE MOUNTED COMPONENTS WSF-M2G339-A1 WSF-M2G339-A2 1. SCOPEThe materials defined by these specifications are one component, thixotropic, thermosettingepoxy/amine adhesives. These adhesives are suitable for automated pin-transfer and syringedispense equipment.2. APP
3、LICATIONThese specifications were released originally for adhesives used to bond surface mountedcomponents to the bottom or “solder“ side of printed wiring boards prior to wave soldering.3. REQUIREMENTS3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conf
4、orm to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). A1 A2 3.4 COLOR Red Yelow 3.5 APPEARANCE Smooth thixotropic Smooth thixotropic paste paste 3.6 VISCOSITY, mPa.s, range 120,000-260,000 75,000-90,000 (ASTM D 1084, Brookfield Model HAT, TD spindle at 10 rpm) 3.7 THIX
5、OTROPIC INDEX, min 3.5 3.5 (Viscosity measured per para 3.6) Thixotropic Index: viscosity at 1 rpm viscosity at 10 rpm 3.8 LAP SHEAR STRENGTH, MPa, min 7.6 7.6 (ASTM D 1002) Note: Sample cured for 10 minutes at 150 C. NOT TO BE USED FOR NEW DESIGN2015 01 07 N Status No replacement named L. Sinclair,
6、 NAENGINEERING MATERIAL SPECIFICATION WSF-M2G339-A1/A2 Page 2 of 2 Copyright 2002, Ford Global Technologies, Inc. 3.9 HARDNESS, DUROMETER D, min 80 80 (ASTM D 2240) 3.10 VOLUME RESISTIVITY, -cm, min 1 E14 1 E14 (ASTM D 257) 3.11 DIELECTRIC STRENGTH, kV/mm, min 35.4 35.4 (ASTM D 149) 3.12 DIELECTRIC
7、CONSTANT, max 4.0 4.0 (ASTM D 150) Tested at 1 MHz and 1 kHz. 3.13 DISSIPATION FACTOR, max 0.03 0.03 (ASTM D 150) 3.14 PNEUMATIC FLOW TEST, g, range 0.5 - 1.1 N.A. Test Method: Using a timed pneumatic dispense with a 10 cc luer lock syringe pressurized to 310 kPa and fitted with an 18 gauge needle;
8、measure the amount of adhesive dispensed in 3 minutes. 5. GENERAL INFORMATION The information below is provided for clarification and assistance in meeting the requirements of these specifications. 5.1 STORAGE The performance of single component epoxy/amine surface mount adhesives is dependent upon
9、conditions of storage and use. Storage at low temperature (below 0 C) and relative humidity below 60 % is recommended where practical. Moisture exposure will change their rheology which will affect dot geometry and result in formation of voids in the adhesive beneath components which can affect retention. Prolonged storage at room temperature and above results in problems with “tailing“ and “stringing“.
