1、ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions2002 12 18 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.9, 3.10, 4 deleted 1994 01 31 NGA1E10370437001 Released S. White Printed copies are uncontrolled Page 1 of 3 Copyright 2002, Ford Global Technologie
2、s, Inc. ADHESIVE, SILVER FILLED, CYANATE ESTER BASED, THERMOSETTING WSF-M2G371-A 1. SCOPEThe material covered by this specification is a one component, heat curing, thermosettingcyanate ester based, electrically conductive adhesive.2. APPLICATIONThis specification was originally released for use as
3、a silicon and glass die attach medium forhermetic electronic packages.3. REQUIREMENTS3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 COLOR Silver 3.5 UNCURED ADH
4、ESIVE PROPERTIES 3.5.1 Viscosity, range (ASTM D 5018, Model RV20 Viscometer, 1 cone, measured at 25 +/- 0.5 C, 1 h after removal of adhesive from - 40 C storage) Shear Rate 22 s-1 6,000 - 13,000 mPa.s Shear Rate 40 s-1 5,000 - 15,000 mPa.s 3.6 CURED ADHESIVE PROPERTIES 3.6.1 Filler Content, range 79
5、.5 - 80.5 weight % (Primarily silver flake plus surfactants and rheological aids) Test Method: Determine weight loss after heating cured adhesive on an alumina substrate at 850 +/- 20 C for 30 minutes in a muffle furnace in an air atmosphere. NOT TO BE USED FOR NEW DESIGN2015 02 03 N Status No repla
6、cement named L. Sinclair, NAENGINEERING MATERIAL SPECIFICATION WSF-M2G371-A Page 2 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.6.2 Extract Properties Preparation of Extract: Combine 3 grams of adhesive, cured at 200 C for 20 minutes and ground to 60 -100 mesh, with 150 grams of deionized w
7、ater (resistance = 1 Mohm.cm). Reflux the mixture for 20 h. Prepare a blank solution for comparison purposes. Conductivity, max 4.5 mS/m (ASTM D 1125, probe cell constant = 0.01 cm-1) Adhesive Specific Ion Concentration, max (ASTM E 1151, ion chromatography on extract) Na(+) 20 pm KCl(-) 10 pm F3.6.
8、3 Volume Electrical Resistivity, max 0.010 ohm.cm (ASTM D 2739) Sample Preparation: Doctor blade a 0.25 cm wide, 0.005 cm thick, minimum 7.5 cm long, strip of uncured adhesive on a glass slide using pressure sensitive adhesive tape as a shim. Remove shim tape and cure adhesive at 300 +/- 5 C for 30
9、minutes. 3.6.4 Thermal Degradation Temperature, min 345 C Test Method: Measure the weight loss by thermogravimetric analysis (TGA) in nitrogen atmosphere. The thermal degradation temperature is defined as the temperature at which the total weight loss exceeds 0.5 %. The sample shall be dried for 1 h
10、 at 100 C to remove moisture before conducting the test. The temperature ramp rate shall be 40 +/- 2 C/minute. 3.6.5 Die Shear Strength, min (MIL Standard 883, Methods 5011.2 and 2019.5 except with silicon bare-back die bonded to a gold plated alumina substrate) 3.6.5.1 As Cured 15 kg (150 C in air
11、for 20 minutes) 3.6.5.2 After Heat Aging 3 kg (150 C in air for 1000 h) ENGINEERING MATERIAL SPECIFICATION WSF-M2G371-A Page 3 of 3 Copyright 2002, Ford Global Technologies, Inc. 3.7 POT LIFE, min 8 hThe material must have a viscosity of less than 19,000 mPa.s when tested per para 3.5.1 and meet die
12、 shear strength requirements per para 3.6.5.1 when stored in the dispensing container at a temperature of 23 +/- 3 C and 50 +/- 20 % relative humidity for 8 h. 3.8 SHELF LIFE, min 6 months The material must meet the viscosity requirements of para 3.5.1 and must meet the die shear strength requiremen
13、ts of para 3.6.5.1 when stored in original sealed container at a temperature of less than - 40 C. The adhesive should be conditioned at 23 +/- 3 C and 50 +/- 20 % relative humidity for 1 h before use. 3.9 ADDITIONAL REQUIREMENTS Candidate materials shall successfully complete the following testing p
14、rior to approval to this specification. 3.9.1 Production Shop Trial 3.9.2 Component/Module Life Cycle Testing (As specified by the responsible design activity) 5. GENERAL INFORMATION The information below is provided for clarification and assistance in meeting the requirements of this specification.
15、 5.1 CURED ADHESIVE PROPERTIES 5.1.1 Glass Transition Temperature, nominal 240 C (ASTM D 3418) 5.1.2 Youngs Modulus, nominal 10 GPa (ASTM E 111) 5.1.3 Poissons Ratio, nominal 0.3 (ASTM E 132) 5.1.4 Density, range 3.5 - 4.5 g/cm3(ISO 1183, Method A1/ASTM D 792) 5.1.5 Thermal Expansion Coefficient, nominal (ASTM E 831) - 100 to 200 C 35 x 1E-6/ C 240 to 345 C 80 x 1E-6/ C
