FORD WSS-M11G22-A-2003 DECORATIVE WOOD VENEER CHERRY-PRUNUS AVIUM CROWN CUT TO BE USED WITH FORD WSS-M99P1111-A 《装饰性胶合板 弦锯樱桃 西洋樱桃木 (和FORD WSS-M99P1111-A一起使用)》.pdf

上传人:brainfellow396 文档编号:751166 上传时间:2019-01-14 格式:PDF 页数:1 大小:52.97KB
下载 相关 举报
FORD WSS-M11G22-A-2003 DECORATIVE WOOD VENEER CHERRY-PRUNUS AVIUM CROWN CUT  TO BE USED WITH FORD WSS-M99P1111-A  《装饰性胶合板 弦锯樱桃 西洋樱桃木 (和FORD WSS-M99P1111-A一起使用)》.pdf_第1页
第1页 / 共1页
亲,该文档总共1页,全部预览完了,如果喜欢就下载吧!
资源描述

1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2003 10 13 Activated C. Bezant Printed copies are uncontrolled Copyright 2003, Ford Global Technologies, Inc. Page 1 of 1 DECORATIVE WOOD VENEER, CHERRY-PRUNUS AVIUM, CROWN CUT WSS-M11G22-A DECORATIVE WOOD VENEER, CHERRY-PRUNUS AVIUM, QUARTER

2、CUT WSS-M11G22-A2 1. SCOPE These specifications define wood veneers for use as decorative product on interior wood veneer assemblies. A = Cherry-Prunus Avium, Crown Cut A2 = Cherry-Prunus Avium, Quarter Cut 2. APPLICATION The specifications WSS-M1G22A/A2 were released for materials used for wooden d

3、ecorative automotive components. Application of lacquer and other products will need to be considered to provide a suitable finished product. 3. REQUIREMENTS Material specification requirements are to be used for initial qualification of materials. When in the fully assembled form the veneer assembl

4、y must perform to the Material specification requirements of WSS-M15P34-B1 or as specified on the engineering drawing. 3.1 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A)

5、. 3.2 MATERIAL PROPERTIES 3.2.1 Appearance Colour, feature and grain to be as per Master samples 3.2.2 Thickness, nominal thickness 0.6mm 3.2.3 Moisture content 11 - 18% 3.2.4 Density A/A2 540 +/- 50 Kgm-33.3 PERFORMANCE PROPERTIES Veneer selected for its attractive appearance should be uniform in thickness, smooth, flat, free from decay and have face grain suitable for the intended face grade

展开阅读全文
相关资源
猜你喜欢
  • BS EN 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies General test methods for materials and assemblies Guid.pdf BS EN 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies General test methods for materials and assemblies Guid.pdf
  • BS EN 61189-5-2006 Test methods for electrical nmaterials interconnection nstructures and assemblies –– nPart 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法 印制电路板组件.pdf BS EN 61189-5-2006 Test methods for electrical nmaterials interconnection nstructures and assemblies –– nPart 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法 印制电路板组件.pdf
  • BS EN 61189-6-2006 Test methods for electrical materials interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies《电气材料、互连结.pdf BS EN 61189-6-2006 Test methods for electrical materials interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies《电气材料、互连结.pdf
  • BS EN 61190-1-1-2002 Attachment materials for electronic assembly - Requirements for soldering fluxes for high-quality interconnections in electronics assembly《电子组件用的连接材料 电子组件中的优质互.pdf BS EN 61190-1-1-2002 Attachment materials for electronic assembly - Requirements for soldering fluxes for high-quality interconnections in electronics assembly《电子组件用的连接材料 电子组件中的优质互.pdf
  • BS EN 61190-1-2-2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly《电子组装件用附件材料 电子组装件中高质量互联用焊剂.pdf BS EN 61190-1-2-2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly《电子组装件用附件材料 电子组装件中高质量互联用焊剂.pdf
  • BS EN 61191-1-2013 Printed board assemblies Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologi.pdf BS EN 61191-1-2013 Printed board assemblies Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologi.pdf
  • BS EN 61191-2-2013 Printed board assemblies Sectional specification Requirements for surface mount soldered assemblies《印刷电路板组件 分规范 表面安装焊接组件的要求》.pdf BS EN 61191-2-2013 Printed board assemblies Sectional specification Requirements for surface mount soldered assemblies《印刷电路板组件 分规范 表面安装焊接组件的要求》.pdf
  • BS EN 61191-4-1999 Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies《印制电路板组件 分规范 端点焊接组件要求》.pdf BS EN 61191-4-1999 Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies《印制电路板组件 分规范 端点焊接组件要求》.pdf
  • BS EN 61191-6-2010 Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods《印刷电路板组件 球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准》.pdf BS EN 61191-6-2010 Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods《印刷电路板组件 球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1