1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Ver 6 2016 06 08 Revised See Summary of revisions J. Herl, EU 2015 04 15 A Active Move A suffix back to active status J. Herl, EU 1995 07 13 Activated N.E. Lindsay, G. A. Molnar Controlled document at www.MATS Copyright 2016, Ford Global Tech
2、nologies, LLC Page 1 of 11 ADHESIVE, HEM FLANGE, ALUMINUM BONDING, TWO WSB-M2G373-A COMPONENT 150 - 180 MINUTE GEL POINT, 70 - 90 C GEL POINT ADHESIVE, HEM FLANGE, STEEL BONDING, TWO WSS-M2G373-B COMPONENT 90 - 120 MINUTE GEL POINT, 100 - 120 C GEL POINT 1. SCOPE The materials defined by these speci
3、fications are pumpable two-component, induction heat responsive structural adhesives with bondline spacers for bonding metal. Full adhesive strengths are attained after an oven cure. The mixed adhesive performance for bonding aluminum and steel is defined as follows: A-series: Defines the mixed adhe
4、sive performance requirements for aluminum bonding: WSB-M2G373-A: The mixed adhesive is room temperature curing or induction responsive. At 23 C the material will gel after 150 - 180 minutes. The ramped heat gel point is 70 - 90 C as defined by para 3.4.2. B-series: Defines the mixed adhesive perfor
5、mance requirements for steel bonding. WSS-M2G373-B: The mixed adhesive is room temperature curing or induction responsive. At 23 C the material will gel after 90 - 120 minutes. The ramped heat gel point is 100 - 120 C as defined by para 3.4.2. 2. APPLICATION These specifications were released origin
6、ally for materials to structurally bond metal-to-metal body components such as the inner and outer panels (hem flange) of deck lids, doors, and hoods, etc. This adhesive can be used to bond oily, unclean metal substrates. Bondline spacers are added to one of the components to maintain a 0.25 mm bond
7、line thickness during the hemming process. The Manufacturing Properties and Engineering Performance requirements defined in these specifications are based upon laboratory coupon testing and define the minimum acceptance criteria for adhesive performance. The assembly process and design for the compo
8、nent will determine the specific adhesive processing parameters for each assembly line. The component engineering performance requirements are defined by the component SDS (Sub-system Design Specification). The materials are two component induction heat or room temperature cure responsive structural
9、 adhesives. Reactivity build rate of the adhesive to generate required component handling strengths for manufacturing is a function of the assembly line processing conditions. Full adhesive strengths are attained after an oven cure. Recommended material oven cure schedules are minimum 171 C metal te
10、mperature for 10 minutes and maximum 205 C metal temperature for 30 minutes. Prior to use, the adhesive must be evaluated under the component production parameters. The choice of substrates, stamping lubricants, stamping plant processing conditions, assembly plant processing ENGINEERING MATERIAL SPE
11、CIFICATION WSB-M2G373-A WSS-M2G373-B Copyright 2016, Ford Global Technologies, LLC Page 2 of 11 conditions and specific design application may affect adhesive performance. Compliance with this specification does not guarantee the adhesive will function for all potential applications on a vehicle. 3.
12、 REQUIREMENTS 3.1 APPROVED SOURCES . This specification requires the use of approved sources. Only the sources identified on the Ford Approved Source List (ASL) can be used when this specification is listed on the drawing, CAD file, or other documents. The list of approved sources is located within
13、Ford at or available externally through a Ford Materials Engineer. 3.2 CONDITIONING AND TEST CONDITIONS All test values are based on material conditioned for not less than 24 h prior to testing in a controlled environment of 23 +/- 2 C and 50 +/- 5% relative humidity. Testing of the material should
14、 occur in the conditioning environment or soon after removal. 3.3 SYSTEM COMPATIBILITY Initial adhesive approval was based on a specific material system which included the substrate, stamping lubricants and adhesive. The originally approved material system was induction heated or room temperature cu
15、red followed by an oven cured using specific production process parameters. Substrate choice, stamping lubricants, stamping plant processing conditions and assembly plant processing conditions may affect adhesive performance. If any of these parameters are changed, the adhesive performance must be v
16、alidated using the new parameters. 3.4 MATERIAL PROPERTIES 3.4.1 Weight Per Volume +/- 0.06 kg/L (ASTM D 816) The weight tolerance for any one supplier shall be +/- 0.06 kg/L, based on the recorded weight of their original approved production sample. Reference para 4.1. 3.4.2 Cure Behavior (ASTM D 4
17、473, 25 mm or 40 mm parallel plate with a 1.0 mm gap, Induction responsive materials - ramped heating at a 35 - 40 C/minute ramp rate over the temperature range 23 C to 205 C, room temperature curing materials record at 23 +/- 2 C, Report gel point - inter-section of elastic (G) and viscous (G“) mod
18、uli) Room Temperature Induction Curing Responsive (Ramped Heat) WSB-M2G373-A 150 - 180 minutes 70 - 90 C WSS-M2G373-B 90 - 120 minutes 100 - 120 C The gel point tolerance for any one supplier shall be +/- 5 minutes for room temperature curing at 23 C and +/- 5 C for ramped heating, based on the reco
19、rded gel point of their original approved production sample. 3.4.3 Expansion No porosity or (Substrates per para 4.5, induction expansion heat per para 4.6.1 or room temperature ENGINEERING MATERIAL SPECIFICATION WSB-M2G373-A WSS-M2G373-B Copyright 2016, Ford Global Technologies, LLC Page 3 of 11 cu
20、re per para 4.6.2, one panel each substrate and cure) Extrude a 13 x 200 mm adhesive bead onto a 100 x 300 mm panel. Induction heat or room temperature cure. Place the test panel in an air circulating oven and bake at 205 +/- 2 C for 40 minutes oven time. After bake, condition test panel at 23 +/- 2
21、 C for 1 h min. Cut the panel lengthwise through the center of the adhesive. Examine the adhesive for any voids, porosity or expansion caused by entrapped air or internal gassing. 3.5 MANUFACTURING PROPERTIES 3.5.1 Rheology (SAE J1524, rotational rheometer with 40 mm diameter parallel plates, 500 mi
22、cron gap, 50 Pa/sec ramp, stress controlled rheometers use stress range 0 - 3500 Pa, strain controlled rheometers use strain range 0 - 100 s-1, evaluate material to highest stress or strain as the formulation will allow, report material batch/lot number, identify rheometer make and model, for each t
23、est condition report yield stress and submit plots for shear stress vs. shear rate, submit plot for viscosity vs. temperature at mid-range shear rate, each component and mixed). Initial (as received) . Test at 23 +/- 2 C . Test at application temperature +/- 2 C . Test over range 10 to 50 C at incre
24、ments of 10 C Aged (age then test at 23 C and application temperature) . 7 d at 40 +/- 2 C . 90 d at 32 +/- 2 C The flow curves established for initial approval shall constitute the reference standard and shall be kept on file at the designated material laboratory. All samples shall produce flow cur
25、ves that correspond to the reference standard when tested under the same conditions. Final approval of material rheology for production shipments shall be made by the affected manufacturing activity. In all cases, the rheology shall be within the limits as identified on the material control plan. 3.
26、5.2 Sag Resistance/Flow Rate No measurable movement or flow, no loss of material 3.5.2.1 North American Production (FLTM BV 118-01, 6 mm diameter bead, substrates per para 4.5, room temperature cure per para 4.6.2, oven cure per para 4.6.3, one panel each bake) ENGINEERING MATERIAL SPECIFICATION WSB
27、-M2G373-A WSS-M2G373-B Copyright 2016, Ford Global Technologies, LLC Page 4 of 11 . Horizontal . Vertical . Inverted 3.5.2.2 European Production (FLTM BV 153-01, Method A, 8 mm diameter bead, substrates per para 5.5, room temperature cure per para 4.6.2, bake 30 minutes at 110 +/- 2C) 3.5.3 Phosphat
28、e Wash Resistance No measurable movement, displacement or wash off. No dissolution of material or lifting from panel. 3.5.3.1 North American Production (FLTM BV 116-01, Method B, 1.5 mm material thickness, room temperature cure per para. 4.6.2 prior to test) 3.5.3.2 European Production Test Method:
29、. Prepare a test panel (300 X 100 X 0.8 - 0.9 mm) according to FLTM BZ 150-11 oiling grade Normal. . Apply a ribbon of test material (250 x 30 x 5 mm) to the panel. . Condition for 2 h at 23 +/- 2 C. . Wash, phosphate and electrocoat the test panel under current process conditions. 3.5.4 Electrocoat
30、 Compatibility (FLTM BV 119-01, use current production paints as identified by Materials Engineering, room temperature cure per para 4.6.2 prior to test) Shall not contaminate electrocoat primer bath or cause electrocoat film irregularities. 3.5.5 Color Each component is distinctly different in colo
31、r. The mixed adhesive is dark in color and shall meet manufacturing process control requirements. Final approval of material color for production shipments shall be made by the affected manufacturing activity. The material color for any one supplier shall not visually deviate from the originally app
32、roved production sample. Reference para 4.3. 3.5.6 Odor Rating 3 max. (FLTM BO 131-03, method D) Shall be free from objectionable odors as determined by the manufacturing facility, both as received, after storage,and mixed. 3.5.7 Material Consistency Shall be a smooth homogenous mixture, free from e
33、ntrapped air, foreign materials and properties detrimental to normal production operation. ENGINEERING MATERIAL SPECIFICATION WSB-M2G373-A WSS-M2G373-B Copyright 2016, Ford Global Technologies, LLC Page 5 of 11 3.5.8 Volume Off-Ratio Mix Ratio Tolerance +/- 10% (SAE J 1523, Substrates per para 4.5,
34、0.25 mm adhesive bondline thickness, 13 mm length overlap, 13 mm/minute pull rate, induction heat per para 4.6.1 or room temperature cure per para 4.6.2, oven cure per para 4.6.3, test at 23 +/- C) Test Method: . Prepare coupons using adhesive at nominal mix ratio, at +10% off-ratio and at -10% off-
35、ratio. . Mix ratio by volume is determined by the following formulas: Volume A * 1.1 = RATIO at + 10% Volume A * 1.0 = RATIO at nominal, control Volume A * 0.9 = RATIO at - 10 % . Induction heat or room temperature cure. . Proceed with oven curing and testing. Overlap shear adhesive strengths for mi
36、x ratios conditions at +/- 10% shall meet the min requirement for 3.7.1.1 tested at 23 C and shall be no more that 10% lower than the strengths for the nominal mix ratio. 3.5.9 Adhesive Open Time 60 minutes min (SAE J 1523, substrates per para 5.5, 0.25 mm adhesive bondline thickness, 13 mm length o
37、verlap, 13 mm/minute pull rate, induction heat per para 5.6.1 or room temperature cure per para 5.6.2, oven cure per para 5.6.3, test at 23 +/- C) “Adhesive Open Time“ for the assembly process is defined as the time interval between dispensing and hemming. Test Method: . Prepare coupons as described
38、 with the following exception: . Apply adhesive to coupons, let unmated coupons lay flat for 0, 15, 30, 45, 60, 75, and 90 minutes prior to mating with second coupon. . Induction heat or room temperature cure. . Proceed with oven curing and testing. Overlap shear adhesive strengths for open times up
39、 to 60 minutes shall meet the min requirement for para 3.6.1.1 tested at 23 C and shall be no more than 10% lower the strengths at 0 minutes open time. ENGINEERING MATERIAL SPECIFICATION WSB-M2G373-A WSS-M2G373-B Copyright 2016, Ford Global Technologies, LLC Page 6 of 11 3.5.10 Exposed Adhesion Stre
40、ngth (SAE J1523, substrates per para 4.5, 0.25 mm adhesive bondline thickness, 13 mm length overlap, induction heat per para 4.6.1 or room temperature cure per para 4.6.2, 13 mm/minute pull rate) 3.5.10.1 Exposure after 1 h 8.0 MPa min (Induction heat or room temperature cure, condition at 23 +/- 2
41、C for 1 h, subject to environmental cycle and test at 23 C) 3.5.10.2 Exposure after 24 h 8.0 MPa min (Induction heat or room temperature cure, condition at 23 +/- 2 C for 24 h, subject to environmental cycle and test at 23 C) Environmental cycle: -40 +/- 1 C for 7 d PLUS 40 +/- 1 C for 98 +/- 2% RH
42、for 7 d PLUS 40 +/- 1 C for 7 d PLUS 23 +/- 2 C for 1 d 3.5.11 Creep Resistance (ASTM D 1780, substrates per para 4.5 0.25 mm adhesive bondline thickness, 13 mm bond overlap, induction heat per para 5.6.1 or room temperature cure per para 4.6.2, condition at 23 +/- 2 C for 72 h, test 205 C for 40 mi
43、nutes oven time) Induction Heat No creep with dead load weight of 10 kg Room Temperature No creep with dead load weight of 5 kg 3.5.12 Storage Stability Heat greatly accelerates aging. The material shall be stored in closed containers away from all sources of heat. The shelf life of the material sha
44、ll be 6 months when stored below 27 C. When these materials are stored at temperatures below 23 C, they shall be conditioned at room temperature 24 h prior to application. Adequate conditioning permits the material to retain its optimum application properties. 3.6 ENGINEERING REQUIREMENTS 3.6.1 Oven
45、 Cured Adhesion Strength (SAE J1523, Substrates per para 4.5, 0.25 mm adhesive bondline thickness, 13 mm length overlap, 13 mm/minute pull rate, induction heat per para 4.6.1 or room temperature cure per para 4.6.2, oven cure per para 4.6.3) ENGINEERING MATERIAL SPECIFICATION WSB-M2G373-A WSS-M2G373
46、-B Copyright 2016, Ford Global Technologies, LLC Page 7 of 11 3.6.1.1 Normal (Condition for 30 minutes at specified temperature prior to test) . Test at 23 +/- 2 C 10.0 MPa min . Test at 82 +/- 2 C Aluminum 2.0 MPa min Steel 5.0 MPa min . Test at - 40 +/- 2 C 7.0 MPa min 3.6.1.2 Exposed . Exposure a
47、fter 1 h 10.0 MPa min (Induction heat or room temperature cure, condition at 23 +/- 2 C for 1 h, subject to environmental cycle, oven cure, test at 23 C) . Exposure after 24 h 10.0 MPa (Induction heat or room temperature cure, condition at 23 +/- 2 C for 24 h, subject to environmental cycle, oven cu
48、re, test at 23 C) Environmental cycle: -40 +/- 1 C for 7 d PLUS 40 +/- 1 C for 98 +/- 2% RH for 7 d PLUS 40 +/- 1 C for 7 d PLUS 23 +/- 2 C for 1 d 3.6.1.3 Aged (Condition at 23 +/- 2 C for 24 h after exposure, test at 23 +/- 2) . 10 Thermal Cycles 10.0 MPa min One Cycle: 90 +/- 1 C for 4 h PLUS 40
49、+/- 1 C and 98 +/- 2% RH for 4 h PLUS -40 +/- 1 C for 16 h Cyclical Corrosion Exposure 10.0 MPa (CETP 00.00-L-467, 6 weeks) 3.6.2 Peel Resistance Aluminum 50 N/25 mm min (ASTM D 1876, substrates per para Steel 100 N/25 mm min 4.5, induction heat per para 4.6.1 or room temperature cure per para 4.6.2, oven cure per para 4.6.3) 3.6.3 Cold Adhesion (FLTM BV 101-02, Procedure E, 0.51 mm material thickness, substrates per para 4.5, room te
