1、 ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions 2015 02 03 N Status No replacement named L. Sinclair, NA 2003 03 28 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.8, 3.9, 4 deleted 1998 01 16 Revised Revised para 1 and 3.5.1; Updated S. DeGrood 1995 09
2、 15 Activated S. DeGrood Page 1 of 3 Copyright 2015, Ford Global Technologies, Inc. ADHESIVE, ONE COMPONENT SILICONE, THERMALLY WSS-M2G385-A3 CONDUCTIVE, HIGH DIELECTRIC STRENGTH NOT TO BE USED FOR NEW DESIGN 1. SCOPE The material defined by this specification is a one component, primerless, solvent
3、 free, thermally conductive adhesive. This material shall consist of vinyl terminated polydimethyl siloxane, platinum catalyst, adhesion promoters and alumina powder, with glass bead spacer material. 2. APPLICATION This specification was originally released as an adhesive to bond a Next Generation P
4、ower Control circuit board to an aluminum base plate housing assembly. The material is intended to function as a dielectric adhesive as well as a thermal transfer compound. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Co
5、mpanys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 UNCURED MATERIAL 3.4.1 Adhesive Type Addition Cured Polydimethyl- siloxane 3.4.2 Particle Size (ASTM C 925) Weight percent of alumina particles 99 % only, less than 50 microns Weight percent of total material, 0.3 - 0.4 % sp
6、acer beads only Average Particle Size - Spacer Beads 125 - 175 Only (distribution 85 %) microns ENGINEERING MATERIAL SPECIFICATION WSS-M2G385-A3 Page 2 of 3 Copyright 2015, Ford Global Technologies, Inc. 3.4.3 Specific Gravity, range 2.6 - 2.8 kg/L (ASTM D 792, Method A) 3.4.4 Viscosity, mPa-s, rang
7、e 40,000 - 80,000 (ISO 2555, Brookfield RVF, # 7 spindle, mPa s 20 rpm) 3.4.5 Thixoratio at 2 rpm/20 rpm, min. 2.5 (ISO 2555, Brookfield RVF, # 5 spindle) 3.5 CURED ADHESIVE PHYSICAL PROPERTIES 3.5.1 Sample Preparation A cured sheet of silicone adhesive shall be prepared by a curing in an ASTM flat
8、sheet mold (127 x 127 x 1.90 mm). The silicone shall be cured at 150 C for 30 minutes. 3.5.2 Color Gray 3.5.3 Non-Volatile, min 99 % (ASTM D 2369) 3.5.4 Silicone Volatiles, max 0.7 % (FLTM AV 102-01, report D4 - D10 and L4 - L10) 3.5.5 Cure Rate, max 15 minutes (ASTM 5289, Monsanto Oscillatory Disk
9、Rheometer, T-90 time at 125 C) 3.5.6 Odor Meets requirements The adhesive shall be free from objectionable or irritating odors, both as received and at application temperatures. 3.6 CURED ADHESIVE PERFORMANCE REQUIREMENTS 3.6.1 Adhesion, min 1.9 MPa (ISO 4587/ASTM D1002 lap shear, 2024 T3 aluminum a
10、lclad, cure sample 1 h at 125 C. Adhesive bondline to be 20 mils.) 3.6.2 Thermal Conductivity, min 1.6 W/m C (ASTM F 433, 40 to 150 C, use a 0.15 mm thick sample) 3.6.3 Volume Resistivity, min 1x10E13 ohm-cm (ASTM D 257/IEC 93) ENGINEERING MATERIAL SPECIFICATION WSS-M2G385-A3 Page 3 of 3 Copyright 2
11、015, Ford Global Technologies, Inc. 3.6.4 Dielectric Strength, min 13 kV/mm (ASTM D 149) 3.6.5 Dielectric Constant, max 6.0 (ASTM D 150, 10 MHz) 3.6.6 Hardness, Durometer A, range 75 - 100 (ISO 868/ASTM D 2240) 3.7 SHELF LIFE, min 1 month at 25 C 3 months at 5 C Manufacturer shall certify that the m
12、aterial will meet the specification when stored in the original sealed container at the specified temperatures for the specified time periods. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 RECOMMENDED CURE SCHEDULES 120 C for 60 minutes 150 C for 30 minutes
