1、REVISIONS SYMBOL DESCRIPTION DATE APPROVAL - A Released Revised per RN A-149 Source Control Drawing 11/13/07 8/22/08 SHEET REVISION STATUS SH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 REV A A A A A A A A A A A A A A A A A A A A SH 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
2、REV A A A A A A A A A A A A A A A A A A A A SH 41 42 43 44 45 46 47 48 49 50 51 52 REV A A A A A A A A A A A A ORIGINATOR: T. King/Perot Systems DATE 11/13/07 FSC: 5935 APPROVED: T. Perry/Perot Systems 11/13/07 CODE 562 APPROVAL: M. Proctor/GSFC 11/13/07 CODE 562 SUPERVISORY APPROVAL: K. Sahu/GSFC 1
3、1/13/07 Connectors, PWB, 2 mm cPCITMStyle, High Reliability ADDITIONAL APPROVAL: S-311-P-822 NATIONAL AERONAUTICS AND SPACE ADMINISTRATION GODDARD SPACE FLIGHT CENTER GREENBELT, MARYLAND 20771 CAGE CODE: 25306 Page 1 of 52 Provided by IHSNot for ResaleNo reproduction or networking permitted without
4、license from IHS-,-,-1.0 SCOPE 1.1 Purpose This specification establishes the general requirements for motherboard (AKA fixed/backplane) style connectors and daughterboard (AKA free) style high-reliability six-row 2-mm pitch cPCITMstyle printed wiring board (PWB) connectors that utilize the Hypertac
5、TMwire basket socket contact system. The connectors are designed to perform reliably in severe environments that include shock, vibration, and temperature extremes. Two styles for each connector are offered: style A for use with the multi-purpose center (MPC) polarization feature, and style B withou
6、t. 1.2 Application Notes This document also includes application notes (Section 6.1) to provide users with assistance in properly applying and handling these connectors. 1.3 Goddard Part Number (See Table III) Connectors procured in compliance with this specification shall be identified by a Goddard
7、 part number having the following form: 311P822 (X)XX XXX X(X) D(X) Solder Tail Length (Not applicable to adapters) (Refer to paragraph 1.3.2) Solder Tail Finish (Refer to paragraph 3.5.2) G = Gold flash over nickel S = Sn63Pb37 solder over nickel Connector Style A = With Multi-Purpose Center (polar
8、ization feature; MPC) (See 1.3.3; N/A 95 contact connectors) B = Without MPC Number of Contacts: 110 or 095 Connector Gender Designation (Refer to paragraph 1.3.1) Goddard Designator S-311-P-822 Page 2 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
9、rom IHS-,-,-1.3.1 Connector Gender Designations FC = Female Connector/Fixed Motherboard Backplane with Socket Contacts. MC = Male Connector/Free Daughterboard with Pin Contacts. MA = Male Adapter, mates 311P822 male daughterboard pin connector (designation MC) to commercial cPCITMfixed motherboard c
10、onnector (see note 6.1.6). FA = Female Adapter, mates 311P822 female motherboard socket connector (FC) to commercial cPCITMfree daughterboard connector (see application note 6.1.6). FFA = Female-to-Female Adapter, mates two 311P822 male daughterboard pin connectors (MC) together (see application not
11、e 6.1.6). 1.3.2 Connector Solder Tail Length Designations Designation FC Backplane Motherboard Connector Tail Length MC Daughterboard Connector Tail Length D 5.50 mm (.216”) 3.12 mm (.123”) D1 Reserved Reserved D2 16.0 mm (.630”) ReservedD3 Reserved ReservedD4 4.22 mm (.166”) 4.2 mm (.166”) 1.3.3 Mu
12、lti Purpose Center (MPC) Keying Optional polarization keys must be ordered separately. See Table III for part numbers. A male connector requires a male key. A female connector requires a female key. 1.3.4 Connector Solder Holding Fixtures For soldering fixture part numbers, see Table III. 2.0 APPLIC
13、ABLE DOCUMENTS 2.1 Issues of Documents The following documents, of the issues in effect on the date of invitation for bids or requests for proposals, form a part this specification to the extent specified herein: Military MIL-DTL-55302 Connectors, Printed Circuit Subassembly and Accessories MIL-STD-
14、202 Test Methods for Electric and Electrical Component Parts MIL-STD-1285 Marking of Electrical and Electronic Parts MIL-M-24519 Molding Plastics, Electrical, Thermoplastic S-311-P-822 Page 3 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
15、,-Industry EIA-364 Electrical Connector/Socket Test Procedures Including Environmental Classifications IEC 60297-3-101 International Electrotechnical Commission Specification for Mechanical Structures for Electronic Equipment, dimensions of mechanical structures of the 482.6 mm (19 in.), series part
16、 3-101, sub-racks and associated plug-in units IEC 61076-4-101 International Electrotechnical Commission Specification for Connectors, with assessed quality, for use in DC low-frequency analog and in digital high-speed data applications Part 4, Printed Board Connectors, Section 101, detail specifica
17、tion for two-part connector modules having a basic grid of 2.0 mm for printed boards and backplanes PICMG 2.0 R3.0 PCI Industrial Computer Manufacturers Group (PICMGTM) Spec for Compact Peripheral Component Interconnect (cPCITM) ASTM-B194 Standard Specification for Copper-Beryllium Alloy Plate, Shee
18、t, Strip and Rolled Bar ASTM-B197 Standard Specification for Copper-Beryllium Alloy Wire ASTM-B488 Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses ASTM-D5138 Liquid Crystal Polymers, Standard Specification for ASTM-E595 Material from Outgassing in a Vacuum Environme
19、nt, Total Mass Loss and Collected Volatile Condensable, Standard Test Method SAE-AMS-QQ-N-290 Plating, Nickel SAE-AMS-P-81728 Plating, Tin Lead (Electrodeposited) SAE-AMS-2418 Plating, Copper SAE-AS39029 Contacts, Electrical Connector, General Specifications for IPC/EIA J-STD-002 Solderability Tests
20、 for Component Leads, Termination, Lugs, Terminals and Wires IPC/EIA J-STD-006 Requirements for Electronic Grade Solder Alloys NASA GSFC EEE-INST-002 Instructions for EEE Parts Selection, Screening, Qualification, and Derating S-311-P-822 Page 4 of 52 REV A Provided by IHSNot for ResaleNo reproducti
21、on or networking permitted without license from IHS-,-,-3.0 REQUIREMENTS 3.1 General The individual item requirements shall be in accordance with the applicable specification herein. In the event of any conflict between requirements of this specification and the references cited herein, the text of
22、this specification shall take precedence. However, nothing in this text shall supersede applicable laws and regulations unless a specific exemption has been obtained. 3.2 Ratings The ratings for these connectors shall be as follows. 3.2.1 Derated Current 1 amp max. per contact at 70 C derated to 0.2
23、5 amp max. at 120 C. 3.2.2 Dielectric Withstanding Voltage 750 VRMS sea level. 3.2.3 Insulation Resistance 5,000 Megohms at 500 VDC. 3.2.4 Contact Resistance 20 milliohms per contact, max. as specified in IEC 61076-4-101. 3.2.5 Temperature Range -65 C to +125 C. 3.3 Workmanship The connectors and co
24、ntacts shall be manufactured in such a manner as to be uniform in quality, and shall be free from cracked or displaced parts, sharp edges, burrs, corrosion, and other defects that will affect life, serviceability, or appearance. 3.4 Test Reporting and Data Recording Test data according to table II G
25、roups A,B sample size per SAE-AS39029 on each contact production lot. 5/ Testing may require procurement of mating connectors. S-311-P-822 Page 13 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.4 Visual and Mechanical Examination Perfo
26、rm visual inspection of connectors and HypertacTMsocket contacts for workmanship flaws using a minimum of 3X magnification and adequate lighting. Perform dimensional measurements on samples. Measurements shall comply with specification requirements. For criteria, use GSFC EEE-INST-002, Section C2, T
27、able 4A for PC style connectors and Table 4B for PC contacts. A partial list is as follows: 1. Body: Cracks, voids. 2. Leads: Bent, cracked/broken leads; burrs; broken socket contact wires. 3. Plating: Adhesion/peeling, porosity/exposed bare metal, corrosion. 4.5 Contact Resistance Measurements shal
28、l be performed and recorded in accordance with EIA-364, test procedure 06. Set source voltage to 1.0 VDC. Applied current shall be 1.0 A DC. Testing shall be performed on seven contact positions per mated connector pair. 4.6 Low-Level Signal Contact Resistance Measurements shall be performed and rec
29、orded in accordance with EIA-364, test procedure 23, method B. Set source voltage to 20 mVDC. Applied current shall be 100 milliamps. Testing shall be performed on seven contact positions per mated connector pair (same as in paragraph 4.5). 4.7 Dielectric Withstanding Voltage (DWV) Perform in accord
30、ance with MIL-DTL-55302 and EIA-364-20. Hold time shall be 60 seconds. Contacts shall be alternately wired like the fields on a chess board, so that every other contact is daisy-chained to the same potential. All contacts in row F shall be wired together to ground. Adjust chamber pressure and apply
31、voltage as follows: For sea level, apply 750 VRMS in accordance with EIA-364-21, test condition I. For 70,000 ft. altitude, apply 300 VRMS in accordance with EIA-364-21, test condition IV. 4.8 Insulation Resistance When tested in accordance with MIL-DTL-55302 and EIA-364-21, insulation resistance re
32、adings shall be within the limits specified in paragraph 3.6.4. Contacts shall be wired (same as in paragraph 4.7). Applied voltage shall be 500 VDC, and electrification time shall be 60 seconds. 4.9 Contact-to-Contact Capacitance Contacts shall be tested in accordance with EIA-364-30 using a 10 MHz
33、 frequency. Five observations per connector shall be taken. S-311-P-822 Page 14 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.10 Contact Inductance Contacts shall be tested in accordance with EIA-364-33. Contact points shall be termin
34、ated with RF connectors. Applied frequency shall be 10 MHz. Five contacts per connector shall be tested. 4.11 Contact Impedance Contacts shall be tested in accordance with EIA-364-108 using the same test setup as in paragraph 4.10. Set equipment rise time to 35 picoseconds. 4.12 Propagation Delay Co
35、ntacts shall be tested in accordance with EIA-364-103 using the same test setup as in paragraph 4.10. 4.13 Interchangeability Connectors shall be subjected to dimensional verification in accordance with MIL-DTL-55302, paragraph 4.5.1. All materials shall be certified to be in accordance with the req
36、uirements of this specification. 4.14 Contact Engagement Force Socket contacts shall be measured in accordance with MIL-DTL-55302, paragraph 4.5.3 and EIA-364-37. A force gage and test stand shall be used. Engagement pin gage diameter shall be 0.016 + 0.00 0.002 inches. Insertion depth shall be 0.11
37、2 +/- 0.005 inches. Ten readings shall be taken. 4.15 Contact Separation Force Socket contacts shall be measured in accordance with MIL-DTL-55302, paragraph 4.5.3, and EIA-364-37. Separation pin gage diameter shall be 0.015 + 0.002 0.00 inches. Ten readings shall be taken using the setup and inserti
38、on depth from paragraph 4.14. 4.16 Mating/Unmating Force Connectors shall be tested in accordance with EIA-364-13, method A. Connectors shall be terminated, mounted to a fixture, and tested with a force gage. Connectors shall be gradually mated using a rate of 1.0 inch per minute. 4.17 Oversized Pin
39、 Exclusion Contacts shall be tested in accordance with MIL-DTL-55302, paragraph 4.5.2, using a test pin having a diameter of 0.0207 inches inserted with a force of 5 ounces. Four contacts shall be tested. S-311-P-822 Page 15 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking perm
40、itted without license from IHS-,-,-4.18 Contact Retention Connector contacts shall be tested in accordance with EIA-364-29. The load shall be applied longitudinally to the contact in an unmating direction and shall be 2.25 pounds for a 5-second duration. Contact displacement shall be measured and sh
41、all not exceed the value in paragraph 3.7.6. Seven contact positions shall be measured. 4.19 Contact Life Contacts shall be tested in accordance with EIA-364-09. Align connector test samples. 500 mate and unmate cycles shall be performed using a special holding fixture, and connectors shall be autom
42、atically cycled at a rate of less than 600 mating cycles per hour. Following mating cycles, the contacts shall be examined for evidence of mechanical damage. 4.20 Solderability Connector contacts shall be tested in accordance with EIA-364-52. The following test details shall apply: 1. Steam aging is
43、 required. 2. Type ROM0 flux (formerly RMA flux) shall be used. 3. Flux immersion shall be from 5 to 10 seconds. 4. Solder shall be applied at a temperature of 260 C +/- 5 C, with a dwell time of 4 to 5 seconds. 5. Isopropyl alcohol shall be used as the cleaning agent. Test specimens shall be visual
44、ly inspected using 10X magnification. 4.21 Resistance to Soldering Heat Connectors shall be tested in accordance with EIA-364-56, test procedure 3 (solder dip) using Sn63Pb37 solder and type ROM0 flux (formerly RMA flux). Solder shall be applied at a temperature of 350 C +/- 5 C, and dwell time shal
45、l be 4 to 5 seconds. 4.22 Random Vibration, Connector Level Testing shall be performed in accordance with EIA-364-28, test condition III (profile: 10 2 KHz, 15 G, 20-minute cycle), with the following details and exceptions: 1. Connectors shall be mated, and seven contact positions shall be wired for
46、 monitoring. Provisions shall be made to assure that the connectors do not become de-mated during testing. 2. Contacts shall be monitored for circuit interruptions in accordance with EIA-364-87 test method 1 (time domain reflectometry TDR technique and an event detector). 3. Test duration shall be 4
47、 hours per axis, 12 hours total. 4. Following testing, low-level contact resistance shall be performed in accordance with EIA-264-23, with an applied current of 100 milliamps, maximum. S-311-P-822 Page 16 of 52 REV A Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
48、e from IHS-,-,-4.23 Mechanical Shock (Specified pulse) testing shall be performed in accordance with MIL-DTL-55302, paragraph 4.5.14, and EIA-364-27. The following details shall apply: 1. 100 G peak value, 6 millisecond duration, sawtooth wave form. 2. Perform three shocks in each direction of three
49、 mutually perpendicular axes, total of 18 shocks. 3. Use the same wiring setup for seven sets of mated contacts as used in 4.22 random vibration. 4. Circuits shall be monitored for nanosecond event detection using TDR in accordance with EIA-364-87. 5. Following exposure, contacts shall be measured for low-level contact resi
