1、JEDEC PUBLICATION Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification JEP114.01 (Revision of JEP114, December 1989) OCTOBER 2007 (REAFFIRNED: JANUARY 2013) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain materia
2、l that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and pu
3、rchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards an
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7、C at the address below, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2013 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDE
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9、thout permission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Publication No. 114.01 -i- GUIDELINES FOR PARTICLE IMPACT NOISE DETECT
10、ION (PIND) TESTING, OPERATOR TRAINING AND CERTIFICATION Contents Page Introduction iii Scope iv SECTION 1 1.1 .Specific test requirements 1-1 1.2 Acceptance conditions 1-1 1.2.1 MIL-PRF-38535 Requirements for In-Line Screening of Class S Devices 1-1 1.2.2 MIL-PRF-38534 requirements for in-line scree
11、ning of Class K devices 1-1 1.2.3 MIL-PRF-19500 requirements for in-line screening of JANTX, JANTXV and JANS devices 1-1 1.2.4 Manufacturer and Customer Required Test 1-2 1.2.5 Quality Assurance Requirements 1-2 1.2.6 Qualification and Manufacturer-Imposed Test and/or applicable military specificati
12、on 1-2 SECTION 2 2.1 Sources of particles 2-1 2.1.1 Material/Handling 2-1 2.1.2 Processing 2-1 2.1.3 Environment 2-2 2.1.4 Danger of Particles 2-2 2.1.5 Process Control 2-2 SECTION 3 3.1 PIND test system 3-1 3.1.1 Testing Principles and Philosophy 3-1 3.2 Systems and components 3-2 3.2.1 Control Uni
13、t 3-2 3.2.2 Threshold Detector 3-2 3.2.3 Shaker 3-2 3.2.4 Transducer 3-3 3.2.5 Monitor Oscilloscope 3-3 3.2.6 Cabling Requirements 3-3 3.2.7 Sensitivity Test Unit (STU) 3-3 3.2.8 Visual Displacement Wedge 3-3 3.2.9 Mounting Medium 3-3 3.3 Calibration and equipment verification 3-4 3.3.1 Calibration
14、Requirements 3-4 3.3.2 Detailed Calibration Steps 3-5 3.3.3 Calibration Intervals 3-5 3.3.4 Control Sample Verification 3-6 3.4 Threshold voltage window levels 3-6 3.4.1 Low Threshold Requirements 3-6 3.4.2 Functional Threshold Calibration Technique 3-6 3.5 Transmission of acoustic signals 3-7 3.6 C
15、omparison of attachment mediums 3-10 3.7 Sensitivity test unit 3-12 3.8 Equipment preventive maintenance 3-13 3.9 Reasons for maintenance and symptoms of misuse 3-13 3.10 Test interference 3-14 3.10.1 External 3-14 3.10.2 Internal 3-15 JEDEC Publication No. 114.01 -ii- GUIDELINES FOR PARTICLE IMPACT
16、 NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING AND CERTIFICATION Contents (contd) Page SECTION 4 4.1 Operator education and training 4-1 4.1.1 Introduction 4-1 4.1.2 Particle Impact Noise Detection Test Training 4-1 4.1.3 Materials and Equipment Needed 4-1 4.1.4 Procedure 4-2 4.1.5 Certification
17、 and Training Records (Classroom) 4-2 4.1.6 Explanation of PIND Test Operator Procedure (at equipment site) 4-2 4.1.7 Process Control Verification 4-2 4.1.8 On the Job Training 4-2 4.1.9 Certification 4-2 SECTION 5 5.1 Loose particle recovery and failure analysis 5-1 SECTION 6 6.1 Summary 6-1 6.2 Re
18、ferences 6-2 Annex A A-1 JEDEC Publication No. 114.01 -iii- GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING AND CERTIFICATION (From JEDEC Board Ballot JCB-07-78, formulated under the cognizance of JC-13 Committee on Government Liaison.) Introduction All modern system
19、s for military, space and satellite applications use many electronic components that perform complex control, navigational and monitoring functions of the systems. Proper functioning of these devices without interruptions is vital to the success of the missions and safety of the personnel and equipm
20、ent. Towards achieving this objective, electronic components are manufactured and tested in accordance with the controls and requirements of applicable military standards, specifications and drawings. One critical factor that can cause catastrophic device failure is loose particles within the compon
21、ents. The focus and importance of screening devices for particles occurred when a catastrophic system failure in the Delta Launch Vehicle Program was traced to a loose bit of wire within an electronic component. (1, 2, 3) The significance of screening devices for particles was further elevated becau
22、se of advances in the manned space vehicle, satellite and missile programs. As a result, space-level devices (Class S) and Class B devices that are used in flight and missile applications must be particle-free. NASA, McDonnell Douglas and Texas Instruments developed and constantly improved technique
23、s of detecting particles audibly and visibly within device cavities. A finalized version of the audible technique was adopted as a Particle Impact Noise Detection Test procedure “PIND“ in MIL-STD-883, Test Method 2020. (4, 5, 6) Despite progress in regard to testing concepts, PIND tester design, met
24、hods and media of attachment, there still exists a lack of correlation between equipment, inconsistency in the test results and conditions, lack of repeatability and false detections. (7, 8, 9, 10, 11) As a result, there is a general tendency by manufacturers to question the reliability of the PIND
25、test. Still PIND testing remains the key measuring indicator for controlling and maintaining a reliable process line relative to particle contamination. It is a useful tool to continuously refine and improve the assembly process. Even though a wealth of information and knowledge about PIND test resi
26、des with various users and manufacturers, it is fragmented or communicated in the proceedings of various symposiums, NBS and NASA report, but not in an organized complete document on the subject. The main objective of this Publication is to disseminate and share the relevant information on PIND test
27、ing to all interested parties. The concepts and materials presented here primarily deal with most of the cause factors that affect the “Measurement Variability” pertinent to “PIND“ and how to control them. JEDEC Publication No. 114.01 -iv- Scope This publication is intended only as a guideline to te
28、st facilities in their efforts to establish and maintain consistent PIND testing. Imposition of these suggestions, or any part thereof, is within the province of each test facility as to its respective needs. SECTION I reviews specific PIND requirements on electronic devices and manufacturer facilit
29、ies to satisfy customer needs and military specifications. SECTION II discusses representative sources of particles that may be generated during device manufacturing. However, it should be noted that the nature, type and sources of particles can vary widely in different manufacturing facilities with
30、 different technologies, materials and processes and in no way is limited to those mentioned here. (12, 13) SECTION III covers most aspects of the PIND system including test principles, calibration and maintenance, device attachment mediums and sources of interference and prevention methods. SECTION
31、 IV covers operator education, training and certification. It is a guide to users for elimination of false particle detection due to improper testing by operators. SECTION V covers the methods of loose particle recovery and failure analysis of PIND failures. The section includes process control meas
32、ures for PIND testing and references made to product quality verification is included. With measurement consistency and reliable PIND results achievable and in control, manufacturers will be able to focus on the root causes of particles in the products and processes and will be able to eliminate the
33、 defects to enhance the device quality. SECTION VI covers a brief summary of this publication. JEDEC acknowledges that these publication materials are derived from information from the list of references, from participant companies internal documents and discussions from PIND Task Group meetings of
34、the JEDEC JC-13 (Government Liaison) and JC-13.5 (Government Liaison - Hybrid Microcircuit Technology) Committees. JEDEC Publication No. 114.01 Page 1-1 SECTION 1 1.1 Specific test requirements Before embarking on the PIND issues and problems in testing, a review of the specific test requirements (6
35、) and constraints on the electronic device is in order. These requirements are imposed on manufacturers through government documents by procuring agencies and end-system users. The specific test methods are listed in MIL-STD-750, Test Method 2052 and MIL-STD-883, Test Method 2020. Examples of the re
36、quirement stipulations fall broadly under the following categories: a) Class S device level requirements specified via device screening per Test Methods 5004 and 5010 of MIL-STD-883. b) Class B device level and customer-specific requirements imposed via specifications. c) Manufacturer line certifica
37、tion and/or process qualification requirements imposed via Performance Specification e.g. MIL-PRF-38535, MIL-PRF-19500, MIL-PRF-38534 d) Manufacturer process stability imposed through internal process controls and audits. e) PIND test requirements outlined in MIL-PRF-38535, MIL-PRF-19500 and MIL-PRF
38、-38534. 1.2 Acceptance conditions 1.2.1 MIL-PRF-38535 requirements for in-line screening of Class S devices For microcircuits, the inspection lot (or sublots) shall be submitted to 100% PIND testing a maximum of five times in accordance with Method 2020 of MIL-STD-883, Condition A. PIND prescreening
39、 shall not be performed. The lot may be accepted on any of the five runs if the percentage of defective devices (PDA) is less than 1% (or one device, whichever is greater). All defective devices shall be removed after each run. Lots that do not meet the 1% PDA on the fifth run, or cumulatively excee
40、d 25% defective shall be rejected and resubmission is not allowed. 1.2.2 MIL-PRF-38534 requirements for in-line screening of Class K devices For hybrids, the inspection lot (or sublots) shall be submitted to 100% PIND testing a maximum of five times in accordance with Method 2020 of MIL-STD-883, Con
41、dition A or B (when specified). PIND prescreening shall not be performed. The lot may be accepted on any of the five runs if the percentage of defective devices (PDA) is less than 1% (or one device, whichever is greater). All defective devices shall be removed after each run. Lots that do not meet t
42、he 1% PDA on the fifth run, or cumulatively exceed 25% defective shall be rejected and resubmission is not allowed. 1.2.3 MIL-PRF-19500 requirements for in-line screening of JANTX, JANTXV and JANS devices For semiconductors, the inspection lot (or sublots) shall be submitted to 100% PIND testing a m
43、aximum of five times in accordance with Method 2052 of MIL-STD-750, Condition A or B (when specified). PIND prescreening shall not be performed. The lot may be accepted on any of the five runs if the percentage of defective devices (PDA) is less than 1% (or one device, whichever is greater). All def
44、ective devices shall be removed after each run. Lots that do not meet the 1% PDA on the fifth run, or cumulatively exceed 25% defective shall be rejected and resubmission is not allowed. JEDEC Publication No. 114.01 Page 1-2 1.2 Acceptance conditions (contd) 1.2.4 Manufacturer and customer required
45、tests Manufacturer and customer required tests are usually imposed through specification control drawings by the customer for Class B or H level products that are used in flight or missile applications. The accept/reject criteria are specified in these documents. 1.2.5 Quality assurance requirements
46、 (reference MIL-PRF documents) Devices or lots that have failed to pass any test applied or acceptance criteria (PDA) shall not be downgraded to any lower quality assurance level, even though the test or criteria may not be a requirement of the lower level. (Failed devices or lots shall not be accep
47、ted.) (Ref. MIL-PRF-38535, MIL-PRF-19500 and /or MIL-PRF-38534.) 1.2.6 Qualification and manufacturer-imposed test (reference MIL-PRF documents) When a test detects a problem (such as loose particles), the manufacturer shall subject all devices in the lot to those tests to eliminate rejects, and sha
48、ll take steps to determine and eliminate the cause of failure. (Ref. MIL-PRF-38535, MIL-PRF-19500, MIL-PRF-38534) JEDEC Publication No. 114.01 Page 2-1 SECTION 2 2.1 Sources of particles Loose particles within electronic components can come from many sources. There have been extensive studies in thi
49、s area to identify the types of particles that may be trapped within devices and to determine their source. The particle sources are generally listed under the following categories: 2.1.1 Material/handling Particles in the form of foreign material may be introduced into devices during pre-seal handling and during assembly. Although some of these particles may appear to be attached during inspection, when subjected to thermal and mechanical stresses, they can loosen and dislodged from internal components of the device. Trays or chip carriers used repeatedly without proper cleaning are a ma
