JEDEC JESD22-A103E-2015 High Temperature Storage Life.pdf
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1、JEDEC STANDARD High Temperature Storage Life JESD22-A103E (Revision of JESD22-A103D, December 2010) OCTOBER 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level
2、 and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the pu
3、rchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve pate
4、nts or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approa
5、ch to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with
6、 this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents for alterna
7、tive contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees no
8、t to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Association 3103 N
9、orth 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A103E Page 1 Test Method A103E (Revision of A103D) TEST METHOD A103E HIGH TEMPERATURE STORAGE LIFE (From JEDEC Board Ballot JCB-15-48, formulated
10、 under the cognizance of JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. The high temperature storage test is typically used to determine the effects of time
11、 and temperature, under storage conditions, for thermally activated failure mechanisms and time-to-failure distributions of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). Thermally activated failure mechanisms are modeled using the Arrhenius
12、 Equation for acceleration. During the test, accelerated stress temperatures are used without electrical conditions applied. This test may be destructive, depending on time, temperature and packaging (if any). 2 Reference documents (informative) JEP122, Failure Mechanisms and Models for Semiconducto
13、r Devices. JESD22-A113, Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing. JESD22-B101, External Visual. JESD47, Stress-Test-Driven Qualification of Integrated Circuits. JESD94, Application Specific Qualification Using Knowledge Based Test Methodology. J-STD-020, Join
14、t IPC/JEDEC Standard, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices. JEDEC Standard No. 22-A103E Page 2 Test Method A103E (Revision of A103D) 3 Apparatus 3.1 High temperature storage chambers The apparatus required for this test shall consist of a contr
15、olled temperature chamber capable of maintaining the specified temperature over the entire sample population under test. 3.2 Electrical test equipment Electrical equipment capable of performing the appropriate measurements for the devices being tested, including write and verify the required data re
16、tention pattern(s) for nonvolatile memories. 4 Procedure 4.1 High temperature storage conditions The devices under test shall be subjected to continuous storage at one of the temperature conditions of Table 1. Table 1 High temperature storage conditions Condition A: +125 (-0/+10) C Condition B: +150
17、 (-0/+10) C Condition C: +175 (-0/+10) C Condition D: +200 (-0/+10) C Condition E: +250 (-0/+10) C Condition F: +300 (-0/+10) C NOTE CAUTION should be exercised when selecting an accelerated test condition since the accelerated temperature used may exceed the capabilities of the device and materials
18、, thereby inducing (overstress) failures that would not occur under normal use conditions. As a minimum the following items should be taken into consideration: 1) Melting point of metals present, especially solder. Degradation of metals including metallurgical interfaces. 2) Package degradation. For
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