1、JEDEC STANDARD Hybrids/MCM JESD93 SEPTEMBER 2005 (Reaffirmed: January 2009) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approv
2、ed by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining wi
3、th minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or proces
4、ses. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and appli
5、cation, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all
6、 requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or www.jedec.org Published by JEDEC Solid State Technology Association 2009 3103
7、North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Please refer to the current Catal
8、og of JEDEC Engineering Standards and Publications online at http:/www.jedec.org/Catalog/catalog.cfm Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to repr
9、oduce a limited number of copies through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or call (703) 907-7559 JEDEC Standard No. 93 -i- HYBRIDS/MCM Contents Page Foreword ii 1 Scop
10、e 1 2 General requirements 1 3 Terms and definitions 1 4 Product conformance 3 5 Device classifications 4 6 Design which if properly used will result in the successful manufacture and delivery of devices that perform properly in the intended application. 2 General requirements The general requiremen
11、ts for design and manufacturing of hybrid microcircuits, RF/microwave devices and MCMs are provided in the following paragraphs. This specification is intended for hermetic, cavity packaged devices. Devices delivered in accordance with this specification shall meet both the following general require
12、ments and requirements specified by the device acquisition document, with the exception of those requirements specifically identified as deviations by either the device acquisition document or contract. 3 Terms and definitions active element: A circuit element that contributes qualities to a circuit
13、 function other than those contributed by a passive circuit element, e.g., rectification, switching, gain, or conversion of energy from one form to another. NOTE Examples include diodes, transistors, active integrated circuits, and light-sensing or light-emitting devices. alternative method: For a d
14、evice requirement that has a prescribed method to verify compliance, another method that has been verified through test and analysis to adequately verify compliance of the device with that requirement. critical node: A node or step in the process flow whose output has a significant impact on the pro
15、cess. JEDEC Standard No. 93 Page 2 3 Terms and definitions (contd) device: For the purposes of this standard, a hybrid microcircuit, RF/microwave hybrid microcircuit, or multichip module (MCM). device type: A single specific device design. NOTE Within this standard, the term is meant to include only
16、 hybrid microcircuits, RF/microwave hybrid microcircuits, and MCM configurations. element, (circuit): Any constituent part of a circuit that contributes directly to its operation and performs a definable function. NOTE Examples include microcircuits, transistors, resistors, capacitors, and interconn
17、ections. film microcircuit; film integrated circuit: A microcircuit consisting exclusively of elements that are films formed in situ upon an insulating substrate. hybrid microcircuit: A microcircuit that contains two or more of a single type or a combination of types of the following elements, with
18、at least one of the elements being active: film microcircuit, monolithic microcircuit, discrete semiconductor device, passive chip, or passive element printed or deposited on a substrate. industry: For the purposes of this standard, the hybrid/MCM industry. monolithic microcircuit; single-chip micro
19、circuit: An integrated circuit or microcircuit consisting exclusively of elements formed in situ on or within a single semiconductor substrate with at least one of the elements formed within the substrate. (MIL-PRF-38535 definition) multichip module (MCM): A multichip integrated circuit or hybrid mi
20、crocircuit that contains two or more microcircuits. passive element: A circuit element primarily contributing resistance, capacitance, inductance, ohmic interconnection, or a combination of these to a circuit function. NOTE Examples include resistors, capacitors, inductors, passive filters, and inte
21、rconnections. radiofrequency (RF)/microwave hybrid: A hybrid microcircuit that meets one or more of the following criteria: it contains input and output terminals or connectors with matched impedance; it uses specific impedance transmission lines on an insulating substrate; its RF performance charac
22、teristics are affected by conductor length, width, or topology. JEDEC Standard No. 93 Page 3 3 Terms and definitions (contd) similar devices: For the purpose of periodic sample testing and design qualification, devices that meet any the following conditions: they are designed and manufactured with t
23、he same basic process flow, using the same or fewer fabrication and assembly processes and materials as a primary parent device type; they are assembled with the same active elements and the same passive elements, using no greater quantity of either; they are subject to the same process and material
24、 control monitoring, e.g., device screening, process control, reliability assessment, etc.; they are designed to generate the same or fewer functions using the same or less functional circuitry; e.g., a 4-bit A/D converter may be considered to be similar to a 10-bit A/D converter, but not vice versa
25、. 4 Product conformance 4.1 Responsibility for conformance The manufacturer shall be responsible for ensuring that inspections and tests are performed and comply with the requirements of the device acquisition document. The manufacturer may perform such inspections and tests, or use other facilities
26、 deemed suitable for the performance of the individual inspection or test. 4.2 Quality management program The device manufacturer shall have an established quality management program that ensures that all activities related to producing devices are planned and communicated in a predetermined manner.
27、 The system shall be designed to assure accurate conversion of the customers requirements into instructions and procedures that meet or exceed those requirements. The customers requirements comprise all requirements herein except those specifically deviated from or altered by the acquisition documen
28、t, and all requirements of the acquisition document. 4.3 Design and manufacturing documentation Design, manufacturing, acceptance, and process control documentation shall be sufficient to depict the physical and electrical construction of the device being supplied. The quality management program sha
29、ll establish procedures for configuration control. All changes in design, substitution of materials or processes, or modification to base-lined documentation shall be processed in accordance with established change control procedures. JEDEC Standard No. 93 Page 4 4 Product conformance (contd) 4.4 Ma
30、terial performance Material performance requirements shall be based on the quality and reliability requirements of the device in the devices intended application. The manufacturer shall be responsible for the approval of the performance requirements of all purchased and internally fabricated materia
31、l. The manufacturer shall document material performance requirements, in accordance with the manufacturers established design control program, to the extent necessary to ensure the requirements are met. Document EIA 623, Procurement Quality of Solid State Components by Government Contractors may be
32、used by the manufacturer as a guideline for establishment of a system for parts selection, supplier management, and receiving inspection/test. 4.5 Self assessment The quality management program plan shall provide for self assessment audits of the manufacturers quality system. The manufacturer shall
33、evaluate the system effectiveness and its ability to provide timely corrective and preventive measures based on the results of the audits. 4.6 Records The manufacturer shall establish and maintain documented procedures for the identification, collection, retention period, and disposition of quality
34、records. The minimum retention period for quality records shall be 5 years, unless otherwise specified. 4.7 Alternative methods The manufacturer may use the alternative method option for any requirement herein, including process monitors, screening or qualification. 5 Device application classificati
35、ons The device application classifications are shown in Table 1. Typical applications are for reference only. The acquisition document shall specify the required classification as determined by the customer as being appropriate for their intended application. The suggested operating temperature in T
36、able 1 is provided for guidance only. The confidence level is a relative measure of the criticality of the application. Environment severity is a relative measure of the mechanical, thermal, and chemical environment of the application. JEDEC Standard No. 93 Page 5 5 Device application classification
37、s (contd) Table 1 Device application guideline Classification Typical Applications (For Reference Only) Case Operating Temperature Range Environment Severity Operating Life (Years) Confidence Level* I Spacecraft -40 C to + 85 C Benign 8 to 15 1 II Missiles, Space Launch/Reentry Vehicles, Uninhabited
38、 areas of Aircraft -55 C to + 125 C Severe 8 to 15 2 III Inhabited areas of Aircraft -40 C to + 70 C Benign 8 to 15 2 IV Uninhabited Vehicle -55 C to + 125 C Severe 5 to 8 3 V Inhabited Vehicle, Fixed Ground Equipment -40 C to + 70 C Benign 5 to 8 3 VI Non-critical Applications 0 C to + 70 C Benign
39、3 to 5 4 Reference MIL-HDBK-217 Reliability Prediction of Electronic Equipment for Selection of Confidence Levels. 6 Design and construction The manufacturer shall have a design review and release process as part of initial product design or redesign. 6.1 Design Guidelines a) The manufacturer shall
40、generate a set of released design guidelines. A method for adding and/or updating the guidelines shall exist for incorporation of new technologies. b) The manufacturer shall document any specific tailoring or waivers to design guidelines during initial product release or redesign. 6.2 Design for man
41、ufacturing The manufacturer shall use processes that comply with their internal practices, as reflected in the manufacturers design guidelines. The manufacturer shall ensure the use of appropriately verified materials (see clause 7) which support the design guidelines and process control (see clause
42、 8). 6.2.1 Design control The manufacturer shall exercise control of the baseline design such that any change affecting the guaranteed qualification or device end item performance is documented. JEDEC Standard No. 93 Page 6 6.2 Design for manufacturing (contd) 6.2.2 Design analysis Refer to the clau
43、se/subclause indicated in Table 2. Table 2 Design analysis references Design analysis item Reference clause/subclause Product Qualification 9 Process Control 8.1 Thermal Design Analysis 6.3 Worst-Case Electrical Analysis 6.4 Mechanical Analysis 6.5 Radiation Evaluation 6.6 6.3 Thermal design Thermal
44、 design analysis shall be performed and shall establish as a minimum that functional device elements are operating within design temperature ratings when the device is operated at the specified maximum operating electrical case temperature and conditions. Finite element analysis is an acceptable the
45、rmal design analysis technique. 6.4 Worst-case electrical circuit design analysis Worst-case electrical circuit design analysis shall be performed and include the following evaluations as a minimum (applicable to the design). a) Electrical element stress over the specified operating temperature rang
46、e shall be within the specified derating criteria under worst case temperature conditions. b) Evaluation to the device test limits, as specified in the acquisition document, at worst case temperature and input power conditions, as applicable. 6.5 Mechanical analysis The device/design shall be evalua
47、ted to determine its capability to meet the required environmental and mechanical stress conditions. These considerations shall include (but are not limited to) the following: NOTE These considerations are highly interrelated and should not be considered individually. Package integrity Component con
48、struction and adhesion Selection of material Process analysis as agreed by the purchaser. JEP133, Guide for Production and Acquisition of Radiation-Hardness Assured MCMs and Hybrid Microcircuits may be used as a guideline. 7 Material & subcontractor management 7.1 Material evaluation The manufacture
49、r shall be responsible for the evaluation of material to the degree necessary to ensure specified performance requirements are met. The evaluations shall be carried out in accordance with the manufacturers established material purchasing program. 7.2 Supplier & subcontractor management The manufacturer shall be responsible for evaluating and selecting suppliers and subcontractors based on their ability to consistently deliver products and services that meet subcontract/supplier requirements. The manufacturer shall select suppliers and sub
