JEITA EDR7315B-2006 Design guide for semiconductor packages ball grid array(BGA)《半导体包装件球栅阵列(BGA)用设计指南》.pdf

相关资源

JEITA EDR-7316C-2007 Design guideline of integrated circuits for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array 《细间距球栅阵列和细间距基板栅格阵列用集成电路的设计指南》.pdf

BS EN 61191-6-2010 Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods《印刷电路板组件 球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准》.pdf

SJ 51420.3-2003 半导体集成电路陶瓷针栅阵列外壳详细规范.pdf

BS EN 60191-6-16-2007 Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA LGA FBGA and FLGA《半导体器件的机械标准化 球栅阵列封装(BGA) 栅格.pdf

JB T 11504-2013 球栅数字显示仪表.pdf

SJ 51420-3-2003 半导体集成电路陶瓷针栅阵列外壳详细规范.pdf

SJ 51420 3-2003 半导体集成电路陶瓷针栅阵列外壳.详细规范.pdf

IEC 61191-6-2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method《印刷电路板组件.第6部分 球栅阵列和网格阵列的焊接接头内空隙及测量方法用评定标准》.pdf

EN 61191-6-2010 en Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method《印刷电路板组件 第6部分 球栅阵列和网格阵列的焊接接头内空隙及测量方法用评定标准.pdf

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