JUS U N1 210 1-1988 Prefabricated concrete units Tiles Technical reguirements Amendments《预制混凝土构件 瓦 技术要求 修正版》.pdf

上传人:registerpick115 文档编号:814411 上传时间:2019-02-09 格式:PDF 页数:2 大小:93.30KB
下载 相关 举报
JUS U N1 210 1-1988 Prefabricated concrete units Tiles Technical reguirements Amendments《预制混凝土构件 瓦 技术要求 修正版》.pdf_第1页
第1页 / 共2页
JUS U N1 210 1-1988 Prefabricated concrete units Tiles Technical reguirements Amendments《预制混凝土构件 瓦 技术要求 修正版》.pdf_第2页
第2页 / 共2页
亲,该文档总共2页,全部预览完了,如果喜欢就下载吧!
资源描述
展开阅读全文
相关资源
猜你喜欢
  • BS EN 60191-6-12-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages DesL.pdf BS EN 60191-6-12-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages DesL.pdf
  • BS EN 60191-6-13-2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid A.pdf BS EN 60191-6-13-2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid A.pdf
  • BS EN 60191-6-16-2007 Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA LGA FBGA and FLGA《半导体器件的机械标准化 球栅阵列封装(BGA) 栅格.pdf BS EN 60191-6-16-2007 Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA LGA FBGA and FLGA《半导体器件的机械标准化 球栅阵列封装(BGA) 栅格.pdf
  • BS EN 60191-6-17-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Desr.pdf BS EN 60191-6-17-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Desr.pdf
  • BS EN 60191-6-18-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Des.pdf BS EN 60191-6-18-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Des.pdf
  • BS EN 60191-6-19-2010 Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage《半.pdf BS EN 60191-6-19-2010 Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage《半.pdf
  • BS EN 60191-6-2-2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - c.pdf BS EN 60191-6-2-2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - c.pdf
  • BS EN 60191-6-20-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Meau.pdf BS EN 60191-6-20-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Meau.pdf
  • BS EN 60191-6-21-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Meau.pdf BS EN 60191-6-21-2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages Meau.pdf
  • 相关搜索
    资源标签

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1