1、MIL-F-85675 58 7777906 0176564 7 = jMAO 3 MIL-F -85675 (AS) 7 JULY 1987 MILITARY SPECIFICATION FILTER, UHF BANDPASS F -1556lARC This specification is approved for use within the Naval Air Systems Command, Department of the Navy, arid is available for use by all Departments auid Agencies of the Depar
2、tment of Defense. 1. SCOPE 1.1 Scope. This specification establishes the design,-performance, and acceptanc-uirements for F-l556/ARC UHF Bandpass Fil ter hereinafter referred to as the filter. the Ultra High Frequency (UHF) range of 225 MHz to 400 MHz. The filter is electronically tuned and operates
3、 in 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The fol lowing specifications, standards, and handbooks form a part of this specification to the _extent specified herein. Unless otherwise specified, the issue of these documents shall be those lis
4、ted in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solici tation. Beneficial comments (recommendations, additions, deletions,) and any pertinent data which may be of use in improving this document should be addressed to:
5、Commanding Officer, Naval Air Engineering Center, Systems Engineering and Standardi- zation Department (SESD) Code 53, Lakehurst, NJ 08733-5100, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. DISTRIBUTION S
6、TATEMENT A: Approved for public release; distribution un1 imi ted. AMSC N/A is / THIS DOCUMENT CONTAINS Aerospace Vehicle Electronic Equipment, Airborne, General Specification for Testing, Environmental, Aircraft Electronic Equipment Anodic Coatings for Aluminum and Aluminum Alloys Electronic and El
7、ectrical Equipment, Accessories, and Repair Parts, Packaging and Packing of Test Procedures; Preproduction, Acceptance and Life for Aircraft Electronic Equipment, Format for Nomenclature and Identification for Electronic, Aeronautical, and Aeronautical Support Equipment Including Ground Support Equi
8、pment SwS tch, Coaxial, Radio Frequency Transmission Line Connector, Electrical, (Circular, Miniature, Quick Disconnect, Environment Resisting), Receptacles and Plugs, General Specification for Microcircuits General Specification for Capacitor, Fixed Electrolytic (Aluminum Oxide) , General Specifica
9、tion for Human Engineering Requirements for Military Systems, Equipment and Faci 1 i ties Printed Wiring Boaras Connector, Electrical, (Circular, Environment Resisting) , Receptacles and Plugs, General Specification for 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
10、icense from IHS-,-,-O MIL-F-85675 58 W 7777906 0376566 2 MIL-F-85675(AS) MIL-R-85664 Recei ver-Transmi ter, Radio RT-l250A/ARC, MI L-A-85672 Amp1 ifier, Radio Frequency, AM-7177A/ARC, Specification for Specification for MIL-B-85677 Mounting Electrical Equipment MT-6330/ARC, Specification for STANDAR
11、DS Federal FED-STD-595 Mi 1 i tary MIL-STD-129 MI L-STD-2 75 MIL-STD-415 MIL-STD-454 MIL-STD-461 MIL-STD-462 and Notice 2 MIL-STD-471 MIL-STD-704 MI L-STD -78 1 MI L-STD-785 MIL-STD-883 MIL-STD-965 MI L - STD - 14 7 2 MIL-STD-1562 Col ors Marking for Shipment and Storage Printed Wiring for Electroni
12、c Equipment Test Provisions for Electronic Systems and Associated Equipment, Design Cri teria for Standard General Requirements for Electronic Equipment Electromagnetic Emission and Susceptibility Measurements for the Control of Electromagnetic In ter ference Electromagnetic Interference Characteri
13、stics, Measurement of Maintainabil i ty Demonstration Electric Power, Aircraft, Characteristics and Utilization of Re1 iabil i ty Tests; Exponential Distribution Re1 i abi 1 i ty Program for Systems and Equipment Development and Production Test Methods and Procedures for Microelectronics .Parts Cont
14、rol Program Human Engi neeri ng Design Cri teri a for hi 1 i tary Systems, Equipment and Facilities Lists of Standard Microcircuits 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NIL-F-85b75 58 9 9999906 017b5b7 W MI L-STD-2068 MI L- STD-20 74 MIL
15、-STD-2016 MIL-STD-2077 MIL-STD-2084 HANDBOOKS Reliability Development Tests Failure Classification for Reliability Testing Unit Under Test Compatibility with Automatic Test Equipment, General Requirements for Test Program Sets, General Requirements for Maintainability of Avionics and Electronic Syst
16、ems and Equipment, General Requirements for * Mi 1 i tary MIL-tlDBK-217B(l) MIL-HDBK-235 (1 Electromagnetic (Radiated) Environment Electronic Equipment, Reliability Prediction of Considerations for Design and Procurement of Electrical and Electronic Equipment, Subsystems, ana Systems 2.1.2 Other Gov
17、ernment documents. The following other Government documents form a part of this Specification to the extent specified herein. Unless otherwise specified, the issues shall be those in effect on the date of the sol i ci ta ti on . DO CU NE N TS Naval Air Systems Command EI-669 AD-1 11 5 WS-6536 Avioni
18、cs Instal lation Instructions for Radio Set ANI ARC-182 Electromagnetic Compatibility Design Guide for Avionics and Related Ground Support Equipment Process Specification Procedures and Requirements for Preparations and Soldering of Electrical Connections Department of the Navy NAVMAT P-4855 1 Navy
19、Power Supply Re1 iabi 1 i ty NAVHAT P-9492 Navy Manufacturing Screening Program (Copies of specifications, standards, handbooks, and other Government documents required by contractors in connection with specific acquis tion functions should be obtained from the contracting activity or as directed by
20、 the contracting activity. 1 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-F-5675 58 m 777790b 0176568 b m MIL-F-85675 (AS) 2.2. Order of precedence. In the event of a conflict between the text of this specification and the references cited h
21、erein (except for associated detail specifications, specification sheets or MS standards), the text of this specification shall take precedence. Nothing in this specification, however, shall supersede applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1
22、Item description. The filter shall be designed for installation on a mount along with a receiver-transmitter (RT) and high power RF amplifier (HPA). System). Filter control shall be provided by a remote radio set control. In receive mode the fi 1 ter shall provide front-end receiver protection from
23、collocated UHF transmitters operating either on channel or off channel. In transmit mode it filters and removes spurious and harmonic content from the transmit signal before applying the signal to the HPA. The filter shall contain the following shop replaceable assemblies (SRAS) : Together, these eq
24、uipments make up a system (the EMC Filter/HPA a. Al - Receive - Transmit Fil ter b. A2 - Driver c. A3 - Digital Control d. A5 - Power Supply e. A6 - Chassis 3.2 First article. When specified in the contract or purchase order (see 6.2.11, a sample shall be subjected to first article inspection (see 4
25、.4 and 6.3). 3.3 Parts. In the selection of parts, the prime considerations are fulfillmem performance requirements, logistics supportability and reliability assurance in a cost effective design. in parts selection. The fol lowing shall govern a. Subassemblies shall be designed and fabricated to be
26、repairable. Maximum economic standardization of parts and materials shall be exercised. Parts selection shall be made in the following order of precedence: (1 (2) Nonstandard parts previously qualified for other programs. Mi 1 i tary Standard parts shall be sel ec ted i n accordance wi th MIL-STD-45
27、4, Requirement 22. (3) Nonstandard parts. b. Nonstandard parts and nonestablished reliability military standard parts shall be screened to the requirements of the most similiar military standard or standard nonestablished reliability part. and hybrids shall use MIL-STD-883, Method 5004, Class 5, as
28、a basis for tailored screens. Integrated circuits 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-F-85b75 58 W 9999906 OL7b5b9 W MI L-F -85675 ( AS ) 3.3.1 Component rescreening. The contractor shall conduct 100 percent incomirig inspection of
29、all active components used in production equipment and spares, Functional and parametric checks of active components will be performed at the components rated temperature extremes and at ambient, Components which are not compliant with their specifications shall not be used in the ARC-182. 3.3.2 Par
30、ts derating and application. All parts used shall be applied well within their ratings. The derating shall enconipass the appropriate and meaningful application conditions such as vol tage, current, power, temperature, mecharilcal, and duty cycle. Electronic and electromechanical parts shall conform
31、 to Table 1 electronic parts derating for worst case electrical and environmental stress unless formal written approval is received from the procuring activity prior to incorporation into the design. Part levei stress analysis shall be used to verify that all parameter stresses are within the derate
32、d values at worst case circuit and environmental conditions. The following limitations on parts usage shall apply: a. Prohibited application (1) Non-hermetical ly sealed semiconductors except power transistors (2) Photo couplers (photo transistors) (3) Hot carrier (Schottky) power rectifiers (4 1 Mi
33、 croci rcui t sockets (5) Non-hermetical ly sealed wet tanta1 um capacitors . 3.3.3 Parts control. The contractor shall establish and maintain a parts control program in accordance with the requirements of MIL-STD-965, Procedure I and as specified herein. The program shall control part standardizati
34、on and the criteria for the selection, application, and testing of parts to achieve the reliability requred. specified herein shall be required of subcontractors and suppliers. As a minimum, a parts program equivalent to that 3.3.4 Non-standard parts approval. The contractor shall obtain procuring a
35、ctivity approval of all non-standard parts used in the equipment. Standard parts are defined in MIL-E-5400. In addi ti on to the MIL-E-5400 requirements for standard parts, microelectronic parts are standard only if: a. The device is listed in MIL-STD-1562, and b. Sources (at least two) are listed o
36、n the Qualified Parts List (W), and c. The part is procured from one of the qualified sources, and d. Quality level “B“ (or better) of MIL-M-38510 is required. 6 I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-F-85b75 58 77777Ob 0376570 Y 9 a ?
37、 a a MIL-F -85675 (AS) TABLE I. ETectronic parts derating. Part Type Capacitor Resistors Diodes Transistors Integrated Circuits Di gi tal Li near Trans formers , I nduc ti ve Devi ces Parameter Appl i ed V 01 tage (Ripple Vol tage for Tantal um) Power Vol tage Power Current Vol tage Junction Tempera
38、ture Power Vol tage Junction Tempera ture Fan-Out, Fan-In Junction Tempera ture Power Junction Temperature Maximum Allowable Application Stress 50% of rating 11 - 50% of rating 70% of rating 50% of rating 75% of rating 60% of rating 21 55% of rating 60% of rating 80% of rating 75% of rating 21 - 2/
39、- Parts shall be used at a winding temperature of at least 30 degrees below rated temperature. addi tion, the maximum vol tage between windings or between a winding and a shield shall be not greater than 60% of rated voltage for the steady state condi tions and 90% of rated vol tage with transients.
40、 General purpose inductors, audio and power transformers shall be applied at no more than 70% of rated current. In - i/ For solid tantalum and all electrolytic capacitors, the maximum applied voltage shall be not greater than 70 percent of the vendor rated value. “Applied voltage“ is the sum of the
41、applied peak ripple voltage and the applied DC voltage. For high Q ceramic capacitors, the applied voltage shall be not greater than 80 percent of the vendor rated value. - 2/ Semiconductor devices shall be mounted and operated in such manner to insure worst-case junction temperature does not exceed
42、 110 degrees C at +7l degrees C ambient temperature. approval. mounted and operated with worst case junction temperatures not to exceed 150 degrees C at +71 degrees C ambient temperatures. Any deviation requires procuring activity Power semiconductor devices, on a very selective basis, may be 7 c Pr
43、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-F-85b75 58 777770b OL7b571 b m MIL-F-856 75( AS ) The approval procedure shall be in accordance with MIL-E-5400 and MIL-STD-965, Procedure I, standard parts will be based on: In addition to the requir
44、ements of MIL-E-5400, approval of non- a. Sui tabi 15 ty for the application b. Conformance to this specification and to MIL-E-5400 c. Interchangeability d. Screening (burn-in) method 3.3.5 Samples of non-standard parts. Samples of non-standard parts are not required unless specified in the contract
45、, Saniples are specified in the contract, the sample shall be in accordance with MIL-E-5400 (see 6.2.1). Where non-standard parts 3.3.6 Cabling and connections. 3.3.6.1 Cables and connectors. The filter shall provide for the use Of cables and connectors in accordance with MIL-E-5400. The design of t
46、he connectors shall be such that improper assembly, mating or instal lation is impossible. Al 1 exterrial connectors shall be scoop-proof, have cadmium plating finish in accordance with QQ-P-416 (over a suitable underplating) to withstand aa 500 hour salt test, and provide 360 degrees circumferentia
47、l grounding techniques for grounding prior to contact engagement. The HPA and fil ter interface connectors shall meet the requirements of MIL-C-26482 or MIL-C-83723. 3.3.6.2 Interconnection cabling. The filter shall be capable of required operation using external wiring in accordance with the applic
48、able requirements of MIL-W-5088.- The external wiring shall be unshielded,. except that a minimum number of the individual wires may be shielded when demonstrated as necessary to meet interference control requirements and provide the assembly of the cable to its plugs may be easily accomplished. por
49、tion of the connectors attached to the cables shall not be supplied as part of the filter. External cables and that 33.7 Modules. The electronic portions of the amplifier shall be functional lyari zed in accordance wi th MIL-STD-2084. Conformal coatings, encapsulants, embedments or potting material used with repairable modular assemblies containing integrated circuits and discrete parts shall be easily removeable without damage to the assembly. 3.3.8 Interch
