1、MIL-HDBK-45 = 9999970 0174270 4T MIL-HDBK-845 31 December 1992 MILITARY HANDBOOK STANDARD POWER SUPPLY APPLICATIONS HANDBOOK AMSC N/A FSC 6130 DISTRIBUTION STATEMENT A. distribution is unlimited. Approved for public release: Provided by IHSNot for ResaleNo reproduction or networking permitted withou
2、t license from IHS-,-,-tlIL-HDBK-845 m 9999970 0174214 660 m MIL-HDBK-845 PARAGRAPH 1 . 1.1 1.2 1.3 1.4 SCOPE Introduction . Background Categorization Organization . 2 . APPLICABLE DOCUMENTS 2.1 Government documents . 2.1.1 Specifications. standards and handbooks 2.1.2 Other Government documents. dr
3、awings. and publications 2.2 Non-Government publications 2.3 Order of precedence 3 . DEFINITIONS . 3.1 Acronyms . 3.2 Definitions 3.2.1 Mounting surface . 3.2.2 Cooling plate . 3.2.4 APSP-QAA . 3.2.3 SPSP-QAA 4 . SPSP MECHANICAL CHARACTERISTICS 4.1 Introduction 4.2 Family . 4.3 Family S1 packaging .
4、 4.3.1 Family S1 key code . 4.3.2 Keying pins . 4.3.3 Family S1 connectors 4.3.3.1 Connector brackets . 4.3.3.1.1 Floating connectors . 4.3.3.2 Connector mating contacts . . 4.3.3.3 Connector engagement 4.3.4 Cooling plate characteristics 4.3.4.1 Cooling plate engagement . . 4.3.4.2 Sealing devices
5、. 4.3.5 Thermal considerations . 4.3.5.1 Mounting surface temperature 4.3.5.2 Heat dissipation 4.3.5.3 Thermal resistance . 4.3.5.4 Cooling medium . 4.3.5.5 Thermal grease . 4.4 Family S2 packaging . . . 4.4.1 Family S2 key code . . . . 4.4.2 Family S2 connectors 4.4.3 Thermal considerations . 4.4.3
6、.1 Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 4 4 6 6 6 6 6 6 9 9 9 9 9 10 10 10 10 10 10 11 11 11 15 15 15 15 15 . ii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-B45 7999970 0374235 5T7 PARAGRAPH MIL-
7、HDBK-845 5 . 5.1 5.2 5.3 5.3.1 5.3.2 5.3.3 5.4 5.4.1 5.4.2 5.4.3 APSP MECHANICAL CONSIDERATIONS . 18 Introduction . 18 Family 18 Family Al packaging 18 Family Al key code 18 Family Al connectors . 18 Thermal considerations 18 Family A2 packaging 18 Family A2 key code 18 Family A2 connectors . 18 The
8、rmal considerations 18 6 . SPSP ELECTRICAL . . . . rn . . . . 19 6.1 Introduction . 19 6.2 Input power 19 6.2.1 155VDCinput . 19 6.2.1.1 Obtaining 155 VDC power 19 6.2.2 DC auxiliary inputs 19 6.2.4 Low input voltage conditions . 20 6.2.5 Emergency input conditions 20 6.2.6 Spike voltage . 20 6.2.3
9、Input current considerations . 19 6.3 6.3.1 O 6.3.2 6.3.3 6.4 6.4.1 6.4.2 6.4.3 6.4.4 6.5 6.5.1 6.5.1.1 6.5.1.2 6.5.2 6.5.3 6.5.4 Control functions . 20 Remote ON/OFF . 20 Voltage programming 21 Synchronization 21 output 21 Output voltage sensing 21 Overcurrent protection 22 Overvoltage protection 2
10、2 Hold-up time . 22 Status signals 22 Overtemperature indication 22 Unsafe temperature indication . 22 Excessive temperature indication . 24 Power interrupt 24 Output status . 24 Malfunction 24 7 . APSP ELECTRICAL . 26 7.1 Introduction . 26 7.2 Inputpower 26 7.2.1 Family Al input power . 26 7.2.1.1
11、Auxiliary inputs . 26 7.2.2 Family A2 input power . 26 7.2.2.1 270 VDC input . 26 7.2.2.2 28VDCinput . 27 7.2.3 Input current considerations . 27 iii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-GRAPH MIL-HDBK-845 = 9999970 OL742Lb 433 W MIL-HDBK-
12、845 PAGE 7.2.4 7.2.5 7.3 7.3.1 7.3.2 7.3.3 7.4 7.4.1 7.4.2 7.4.3 7.4.4 7.5 7.5.1 7.5.1.1 7.5.1.2 7.5.2 7.5.3 7.5.4 Low input voltage conditions . 27 Emergency input conditions 27 Control functions . 27 Remote ON/OFF . 28 Voltage programming 28 Synchronization 28 Ouput voltage sensing . 28 Overcurren
13、t protection 29 Overvoltage protection 29 Hold-up time . 29 Status signals 29 Overtemperature indication 29 Unsafe temperature indication . 30 Excessive temperature indication . 30 Power interrupt 30 Output status . 30 Malfunction 30 Output 28 8 . ELECTROMAGNETIC INTERFERENCE 31 8.1 Introduction . 3
14、1 8.2 Low frequency conducted emissions (CEO1) . 31 8.2.1 CEOllimits 31 8.2.2 Some system level CEO1 solutions . 31 8.2.2.1 DC input power 31 8.2.2.2 Multi-phase transformers . 32 8.2.2.3 Line filtering 32 8.3 High frequency conducted emissions (CE03) . 32 8.3.1 CE03limits 32 8.4 Filter design . 32
15、8.4.1 Stability . 32 8.4.1.1 Impedance analysis 32 8.4.1.2 Impedance curves . 34 8.4.2 Power rating . 34 8.4.3 Damping at resonant frequencies 34 8.5 Radiated magnetic field emissions (REO1) . 34 8.5.1 REOllimits 34 8.5.2 Limiting REO1 emissions 34 8.6 Radiated electric field emissions (REOS) . 35 8
16、.6.1 RE02limits 35 8.6.1.1 RE02 installed configuration . 35 8.6.1.2 RE02 connector opening configuration . 35 8.6.2 Shielding . 36 8.6.3 Bonding 36 8.6.3.1 Connections 36 8.6.3.2 Bonding materials . 36 8.6.3.3 Corrosion prevention . 37 iv Provided by IHSNot for ResaleNo reproduction or networking p
17、ermitted without license from IHS-,-,-MIL-HDBK-BlI5 m 9999970 0174217 37T m MIL-HDBK-845 PARAGRAPH 9 . DISTRIBUTION 9.1 introduction . 9.2 Distribution . 9.3 Redundancy 9.4 Mean time between failures . . 9.4.1 Failure rate . 9.5 Standby redundancy with SPS . . 9.5.1 Total load capacitance 9.5.2 Pre-
18、bias considerations 9.5.3 Switching delay 9.5.4 Output status signal . 9.6 Active redundancy . 9.6.1 Current sharing 9.6.2 Output status indication . 9.6.3 Reliability for paralleled SPS 9.6.4 N+l redundancy 9.6.4.1 Redundancy for N=l 9.6.5 Forced current sharing FIGURES 1 . 2 . 3 . 4 . 5 . 6 . 7 .
19、8 . 9 . TABLES PAGE 38 38 30 30 30 38 39 39 39 39 41 41 41 41 43 43 44 44 SPSP style 3 power supplies CEEE cabinet configuration . Family S2 SEM formats Overtemperature settings Standby redundancy configuration Active redundancy configuration . . Forced water cooling in the CEEE cabinet CE03 filter
20、attenuation required to meet MIL-STD-461 Family S1 dimensions and key code I . Malfunction combinations III . Dimensions for figure 9 . II . MTBF for incremental redundant elements . APPENDIX Family S1 power supply dimensions and keying . . 7 8 12 16 23 33 40 42 47 25 44 51 45 V Provided by IHSNot f
21、or ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-8q5 W 9999970 0174218 20b W I 1. I MIL-HDBK-84 5 i 1. SCOPE 1.1 Introduction. This handbook is written to be an informational aid for electronic system designers who use or plan to use Standard Power Supplies (SPS
22、). Included are performance characteristics of SPS, electrical and mechanical interface requirements, and general applications guidance and instructions. a . 1.2 Backaround. The term Standard Power Supply (SPS) refers to any one of a group of low voltage power supplies which are designed and manufac
23、tured to meet requirements established under the Navys Standard Hardware Acquisition and Reliability Program (SHARP). designers with a group of power supplies with varied standard input/output capabilities which meet established performance, reliability, and maintainability criteria. SPS represents
24、one step toward realizing system acquisition through the use of standardized hardware usage. By selecting from this group, system designers can reduce many of the initial acquisition costs associated with power supply design, test, and implementation. SPS designs are often born out of the need for c
25、ertain power supply capabilities in new electronic systems. As a result, the first user often influences which capabilities are built into each supply. The standardization philosophy builds on the needs of individual system requirements and outlines a power supply which can be used in multiple appli
26、cations. The purpose of this effort is to provide system 1.3 Cateaorizatioq. Standard Power Supplies are categorized into two groups: (SPSP) and Airborne Power Supply Products (APSP). SPSP are intended for use specifically in shipboard applications and are designed in accordance with MIL-P-24764. AP
27、SP are designed for airborne applications to the requirements of MIL-P-29590. significant applications criteria for SPS. separated between SPSP and APSP for each criteria. cases where the information is appropriate to both airborne and shipboard applications, it is not repeated. Shipboard Power Supp
28、ly Products O 1.4 Oraanization. This document addresses several The information is In those 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-845 9999970 0374239 342 MIL-HDBK-84 5 2. APPLICABLE DOCUMENTS 2.1 Go vernment doc uments. 2.1.1 Spe
29、c ifications. standards, an d handboo&. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DDISS
30、) and supplement thereto, cited in the solicitation. Unless otherwise SPECIFICATIONS FEDERAL QQ-P-35 MILITARY MIL-P-24764 MIL-C-28748 MIL-C-28754 MIL-M-2 8 7 8 7 MIL-P-29590 MIL-C-38999 MIL-C-83527 - Passivation Treatments for Corrosion-Resistant Steel - Power Supplies, Shipboard, Electronic, Genera
31、l Specification for - Connector, Plug and Receptacle, Rectangular, Rack and Panel Solder Type and Crimp Type Contacts, General Specification for - Connectors, Electrical, Modular, and Component Parts, General Specification for - Modules, Standard Electronic, General Specification for - Power Supplie
32、s, Airborne, Electronic, General Specification for - Connector, Electrical Circular, Miniature, High Density Quick Disconnect (Bayonet, Threaded and Breech Coupling), Environment Resistance Removable Crimp and Hermetic Solder Contacts, General Specification for - Connectors, Plug and Receptacle, Ele
33、ctrical, Rectangular Multiple Insert Type, Rack to Panel, Environment Resisting, 150C Total Continuous Operating Temperature 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-845 m 9999970 0374220 9b4 m :e I MIL-HDBK-845 MIL-E-85726 - Enclos
34、ure, Standard Avionics, Forced Air-Cooled, General Specification for STANDARDS MILITARY HANDBOOKS MIL-STD-454 - Electronic Equipment, Standard General Requirements for MIL-STD-461 - Electromagnetic Emission and Susceptibility Requirements for the Control of Electromagnetic Interference MIL-STD-462 -
35、 Electromagnetic Interference Characteristics, Measurement of MIL-STD-704 - Aircraft Electric Power Characteristics MIL-STD-1389 - Design Requirements for Standard Electronic Modules MIL-STD-1399 - Interface Standard for Shipboard section 300 Systems MIL-STD-2036 - General Requirements for Electroni
36、c Equipment Specifications MIL-STD-2038 - Employing Standard Power Supplies, Requirements for MIL-STD-5400 - Electronic Equipment, Airborne, General Requirements for MILITARY MIL-HDBK-217 - Reliability Prediction of MIL-HDBK-241 - Design Guide for Electromagnetic Electronic Equipment Interference (E
37、MI) Reduction in Power Supplies (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.1.2 Other Government documents. drawinas.
38、 an d publications. drawings, and publications form a part of this document to the extent specified herein. are those cited in the solicitation. The following other Government documents, Unless otherwise specified, the issues 3 Provided by IHSNot for ResaleNo reproduction or networking permitted wit
39、hout license from IHS-,-,-MIL-HDBK-845 m 9999970 0334223 8TO m NAVMAT P-4855-lA MIL-HDBK-845 - Navy Power Supply Reliability (Application for copies should be addressed to the Commanding Officer, Naval Publications and Forms Center, 5801 Tabor Avenue, Philadelphia, PA 19120-5099. Cite stock number 0
40、518-LP-204-4800.) 2.2 Pon-Government aub lications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the solicitation. Unless otherwi
41、se specified, the issues of documents listed in the DODISS are the issues of the documents cited in the solicitation. AMERICAN MATERIAL SPECIFICATIONS (AMs) (Listed with s-1 SOCIETY OF AUTOMOTIVE ENGINEERS, INC. (SAE) AMs 5604 - Steel Sheet, Strip, and Plate, Corrosion Resistant 16.5Cr - 4.ONi - 4.0
42、Cu - 0.30 (Cb + Ta) Solution Heat Treated. Precipitation Hardenable. (Application for copies should be addressed to the Society of Automotive Engineers, Inc., 400 Commonwealth Drive, Warrendale, PA 15096.) AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM A693 - Standard Specification for Preci
43、pitation-Hardening Stainless and Heat-Resisting Steel Plate, Sheet, and Strip (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA 19103-1187.) 2.3 Ord er of a recedence. In the event of a conflict between the text of this
44、document and the references cited herein, the text of this document takes precedence. this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Nothing in 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
45、om IHS-,-,-MIL-HDBK-845 m 7777770 0374222 737 m a 1 MIL-HDBK-845 3 . DEFINITIONS i 3.1 Acronvms. The acronyms used in this handbook are defined as follows: APSP - Airborne Power Supply Product. SPSP - Shipboard Power Supply Product. SHARP - Standard Hardware Acquisition and Reliability Program. SPS
46、- Standard Power Supply. SEM - Standard Electronic Module. CEEE - Common Electronic Equipment Enclosure. CCT - Critical Component Temperature. TCCT - Transient Critical Component Temperature. MTBF - Mean Time Between Failures. Definitions. The following definitions apply. 3.2.1 pountina surface. Mou
47、nting surface refers to that part of the power supply which serves as a thermal interface and which, when mounted, comes in direct contact with the cabinet cooling plate. O 3.2.2 Coolina plate. Cooling plate refers to that part of the system rack or cabinet which comes in contact with the power supp
48、ly mounting surface. heatsink for power supplies mounted directly to it. 3.2 . 3 SPSP-Qu . Shipboard power supply products quality assurance activity. Presently, this function is served by the Naval Surface Warfare Center, Crane Division, Code 6023, Crane, Indiana 47522. The cooling plate acts as a
49、thermal 3.2.4 APSP-UAA. Airborne power supply products quality assurance activity. Presently, this function is served by the Naval Air Warfare Center, Aircraft Division, Indianapolis, Code 3060, Indianapolis, IN 46219-2189. 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-845 9999970 0374223 673 MIL-HDBK-845 4. SPSP MECHA
