1、O MI L-STD- 1389D 30 MARCH 1989 SUPERSEDING MIL-STD-1389C 16 MAY 1986 (SEE 6.5) .MILITARY STANDARD DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES THIS DOCUMENT CONTAINS 2 PAGES. -. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-O O O MIL-STD-13
2、890 FOREWORD 1. This Military Standard is approved for use by all Departments and Agencies of the Department of Defense. 2. Benefi ci al comnents (recomnendat i ons , addi t i ons, del et ions) and any pertinent data which may be of use in improving this document should be addressed to: Naval Sea Sy
3、stems Command, Code .SEA55Z3, Department of the Navy, Washington,DC 20362-5101, by using the self-addressed . Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. . 3 .- The purpose of this standard is to provide instructions to contractors
4、 and suppt iers with respect. to the requirements to be considered during the design of new modules for use in the Standard Electronic Modules (SEM) Program as part of the Standard Hardware Acquisition and Reliability Program (SHARP). specified in MIL-STD-1378. MIL-STD-1378 also specifies the proced
5、ures -for recommending new modules for addition to the list of standard modules. standard shall also met the requirements of MIL-M-28787. Requirements for employing. Standard Electronic Modul es (SEM) are Modul es designed in accordance with the requirements of this . ii ., . Provided by IHSNot for
6、ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-13890 * CONTENTS PARAGRAPH . PAGE 1 . SCOPE . 1 1.1 Scope . 1 1b2 Classification . 1 2 . APPLICABLE DOCUMENTS . 3 2.1 Government documents 3 2.1.1 Specifications and.standards. 3 2.1 . 2 Other Government documents . 5
7、 2.2 Order of precedence . 5 3. DEFINITIONS . 6 3 . 1 Standard Electronic Modul es (SEM) Program . 6 . 3.2 SEM Design Review Activity (SEM-DRA) 6 3.3 SEM Quality Assurance Activity (SEM-QAA) . 6 3.4 Keycode 6- . 3.5 Aiphaend #, . 6 . 3.6 Betend 6 3.7 Cri tical component temperature (CCT) 6 3.8 Trans
8、ient critical component temperature (TCCT) . . . 6 3.9 Powered socket . 7 . 3. 10 Pitch 7 O 4 . GENERAL REQUIREMENTS 8 4. 2 Electrical configuration requirements 8 4,2.2 Optional contact assignment . 8 4.2.3- . Connector contact assignmeits. - 12 4.1 Specification and standards 8 4.2.1 Preassigned d
9、edicated contacts 8 5 . DETAILED REQUIREMENTS 13 5.1 Purpose 13 5.2 Module construction . 13 5.2.1 Mechanical configuration requirements . 13 5.2.1.1 . Module depth . 13 5.2.1.2 Module rib structure 13 5.2.1.2.1 Rib strength 13 *. ill . . . U.l . - . “ “ .- . -.- i-.*.-. )“.“-.-.“.3rr.“, . Provided
10、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-O PARAGRAPH 5.2.1.3 5.2.1.3.1 5.2.1.4 5.2.1.5 5.2.1.5,2 5.2.1.5.3 5.2.1.5.4 5.2.1.6 5.2.1.6.1 5.2.1.6.2 5:2.1.6.3 5.2.1.6i4 5.2.1.6.5 5.2.1i5.1 5.2.1.6.5.1 5.2.1.6.5.2 5.2.1.6.5.3 5.2.2 5.2.2.1 5.2.2.2 5.2.2.3 5
11、.2.3 5.2.3.1 5.2.3.2 5.2.3.3 5.2.3.4 5.2.4 5.2.4.1 5.2i4.2 5.2.4.3 .5.2.5 5.3 53.1 5.3.1.1 5.3.1.2 5:3.1.3 5.3.1.4 MIL-STD-1389D CONTENTS .L Continued . Pin shields, . . . . . . . . . Pin shield retention . . . . Modul e fin and header structure. Modul e connector . . . . . . . . Module contacts. .
12、. . . . . . . Connector contact integrity. . . Contact material . . e . e . . . Contact plating. . . . . . . . . . Modul e keying . . . . . . . . . . Keying pin orientation . . . . . Keying pin locations . . . . . Keying pin styles; . . -. . . . Keying pin sets. . . . . . . . . Keying pin integrity
13、requirement Keying pin torque. . . a . . . Keying pin pullout . , . . . . . Keying-pin cantilever load . . . Printed- boards and printed- board Rigid printed-bords . . , . . . Printed-board assemblies . . . . ._ assembl Cas. . . F1 exi bl e printed- board and assembl i es Material S. . . . . . . . .
14、 . . . . Use of toxic material . . . . . . e . Use of flammable material, . . . I. . Use of material affected by fungus Use of adhesive backed labels. . . . Fin-ishes and protective treatments . Anodic treatment/frame plating . . . Module frame surface finish. . . . . Conformal coating. o . . . . .
15、. .- . Weight . . . . . . . . . . . . . . Environmental requlrements . . . . Operat i ng environmental requi rements Operating temperature . . e . . . . Vibration . . . . S. . . . . . . . . Incl ination . . . . . . . . a . . . Life . . . . . . . . . . . . . . . . iv . - .- PAGE 14 14 14 14 .14 14 14
16、 15 15 15 15 - 15 15 16 16 16 16 - , 16 16 17 17 17 17 17 17 18 18 . 18 18 18 18 18 18 19 19 19 17 . . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. MIL-$Tb-13890 PARAGRAPH 5.3.1.5 5.3.1.6 5.3.2 5.3.2.1 5.3.2.2 5.3.2,3. 8.3.2,4 5.3.2.5 5.5.2.6 5.
17、4 5.4.1 5.4.2 5.4.2,l 5.4.3 5.4.4 5.4*5 5.4,5.1 5,4,5.2 . 5,4.5.2.1 5.4.5,2.2 5*4.5.3 5.4.6 5*4.8 5.5 5.5.1 5.5,2 505.3 5.8,3.1 5.5.3. 2 5*5.3.3 5.5.3.3,l 5.5.3.3.2 5. 4.7 . 5. 4.9“ CONTENTS . Continued . PAGE - Pressure 19 Radiation . 19 Nonoperating environmental requirements . . I 19 Thermal shoc
18、k . 20 Humidity 20 Shock 20 Salt -fog 20 Hydrogen atmosphere . . . . . . L 20 Storage temperature 20 Module marking . 20 Module key code. 21 Module part number. revision letter. and amendment number . 21 Module part number and revision status for special modules 22 Certification mark ! 22 Module nam
19、e . 23 Vendors information 23 Vendors identification . . . . . . . . 23 .Serial number 23 Serial number sequence . 23 Vendor designat i on . 24 Rate kode 24 Connector contact identification 24 ES0 . 24 RAM/ROM test code . 24 Module design requirements . 27 Personnel safety 27 Powered socket . 27 Com
20、ponent sel ectisn ; . 27 Germanium semiconductors 27 DI screte semiconductors . 27 Integrated circuits . 28 Qual i ty requirements 28 Selection requirements . 28 Extractor fin identification 27 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-ST
21、D-13890 . CONTENTS - Continued. PARAGRAPH 5.5.3.3.3 5.5.3.4 5.5.3.5 5.5.4 5.5.5 Restricted usage Passive components . Other microcircuits. Re1 iabil i ty design goal-s . .Parts derating, thermal. performance, failure rate prediction Diagnostic design requJrements . . ; 29 29 30 30 30 31 - 32 32 32 3
22、2 32 32 o . and . m e. 5.5.6 6. NOTES, 6.1 6.2 6.3 6.4 6.5 Intended use Issue of DODISS. . Supersession data Subject term (keyword) 1 isting . -. . Changes from previous issue. . o . . . . . * . . FIGURES 1; 2. Modu1.e blade contact . 33 Style 1/2 keying chart (viewing connector as figure 5). . Styl
23、e 1/1 keying chart (viewing conne-ctor as figure 5). shown shown . on on on eb e. I. *. 34 3. 35 . shown . . . -. 4. Style 2/2 keying chart (viewing Keying pin orientation.,. Module keying pin styles . e . Module outline figure 5). . connector as . e e 36. . 37 38 51 55 58 59 52 5. 6; 7. 9. . 10. 11
24、: a. i2. Module basic size outline. Mu1 tiple increment module outl ine. . Pl ate mounted module outline Sub-plate mounted module outline ing fin Identification, insertioil, .extractor, and cool outline. . Connector contact assignment . Modul e marking areas Module retention bolt interface. . 60 62
25、64 67 13. 14. 15. . vi .a . -. . - _. . .- . . ._ - F . -. “ Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. .-L MIL-STD-1389D CONTENTS - Conti nued . 16 17 , 18 e 19 0 20 0 21. 22 23 o 24. 25 * 26. 27 * 29 30. 31 32 33 0 34 * 36 37 . 38, 39 * 40 *
26、 41 42 . 43 44 . 45 * 46 0 47 0 48 49. 50 51 28 35 O F I GURES - PAGE Module outline , , , , , , , . , , , , , , , o 80 Module basic size outline. . . . . . , . . 81 Direct air impingement i format B . , o . . 84 Multiple increment module outline. . , , . , 86 Pl ate mounted module out1 ine , , . ,
27、, . . . . . . 89 Sub-plate mounted module outline , , , , . 90. Identification, insertion, extractor, and cooling fin outline,.,.,.,.;,I 91 Extractor fin identification . , 93 Module marking areas . + , , , , , . . , . ; 94 Connector contact assignment. , e , , I . . e 96 Module retention bolt inter
28、face, , , . , , , . , . e 97 Module outline , I , , , , . . . . . , , . . 107 Module configurations - side view, , , * , , , , , , 108 Module configurat4ons. , , . , , . . , , 109 Module marking areas , , . -, , , . . . 112 Module outline . , , I , , , , , . , . , . 121 Module configurations - side
29、view, , . , , , 122 . Direct air impingement, format D , . . . . . . . . . 123 Module configurations. . , , , , . , e . 124 Module marking areas e . . . . , . , , , , . , o . . 127 Module outline , . , . , , . o . , , -. . . . 136 Module configurations. . , , , , , . . . , , , . 137 Typical ,6 inch
30、pitch module , . . , , , , . , , 140 Direct air impingement, format E . , , , , . , . , , . 141 Module marking areas , , , , , , , , , , .“. , , 142 Conductor spacing. o , . , , , , . 151 Ma. alignment. , , , , . , , . , , , , . . , . , , 152 Leaded component lands , ,. , , . , , . , , . . , . . . .
31、 153 Leadless chip carrier lands, , , , , , , , , , . , , , 154 Chip component lands , . o , . , , , , , , , . , , o , 155 Procedural flow chart exampl e, , . . , , , , , , , 169 Parts list example- , , , , . . , . , . , e , , e o 170 .Example component layout , . , , , . , , . , , 170 Example of fi
32、n cooling thermal network model , , . . , , 171 Example results of thermal prediction, , , . , , . 172 Example module fai 1 Ure rate summary sheet , , , , 173 vi i Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1389D . I CONTENTS . Continued
33、 FIGURES PAGE 52 . Example component temperature test c4rcuit . I . . . . 174 53 . Sample piece part work sheet (hybrid) 175 54 . Sample piece part work sheet (capacitor) 178 - 55 . Sample piece part work sheet (resistor) . 179 57 . Example sketch showing node locations 181 58 . Rivet inspection 193
34、 59 . Lead1 ess part solder wetting . 194 60 . Leadless part misa1 ignment . 196 61 . Chip capacitor misa1 ignment 191 62 . Acceptable LCC solder wetting . 198 63 LCC soldetr.joint comparison 1 198 64 . LCC fillet formation cross sections . 199 65 . LCC solder adherence or flow . 201 66.- Chip capac
35、itor and resistor solder joint comparison . 202 67 . Chip capacitor or resistor fillet formation . 203 68 . Chip capacitor or resistor solder adherence or flow . , . . 204 70 Chip elevation for capacitors, resistors, and LCC 206 72 . Toe overhang 1 imi ts for ribbon leads 207 56 . Sample piece part
36、work sheet (solder connection) 180 0 . 69 . Minimum lap of chip.on terminal area 205. 71 . Heel mounting requirements for ribbon leads . 207 TABLES I Contact flunction (40 contact input/output connector contact assignments) 9 . connector contact assignments) . 10 III . Keying pin styles and location
37、s 16 IV -. Part constituents suscepti.ble to ESD 25 V . Module span and thickness Increments . 41 VI Module span and thickness dimensions 43 VI1 . Module span and thickness increments 70 VI11 . Module span and thickness dimensions . 72 IX . Module growth . 106 X . Module growth . 114 XI . Module gro
38、wth . 129 XII . Parts derating . 160 I I . Contact function (50-250 contact input/output viii . .- . .- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1389D CONTENTS - Conti nued . APPENDICIES 3 PAGE A. Design requirements for format A modul
39、es . . . . . . 39 B. Design requirements for format B modules . . . . . . .- 69 C, Design requirements for format C modules , . . . . . . . 99 O. Design requirements fir format O modules . . . . . . . I 113 E Design requirements for format E modules . . . . * . . 128 F, Thlck film multilayer interco
40、nnect board design requirements , . . e , . . . , . . . . . . I . . 143 G. Parts derating, thermal performance, and failure rate predlction for Standard Electronic Modules . . . . . . 156 H. Requirements for printed-board assemblies used in Standard Electronic Modules. . . . . . . . . . . . . 182 -
41、ix Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- O BD a “. .- MIL-STD-13890 . 1. SCOPE 1.1 Scope. This .standard establishes the design requirements for Standard Electronic Modules (SEM) for the Standard Hardware Acquisition and Re1 iabil i ty Pro
42、gram (SHARP) for use in mil i tary systems. Other requirements for new module development are specified in MIL-M-28787 for the appropriate cl ass selected to meet the system/equipment environmental requirements . .- “ 1.2 Classification. SEM shall be of the following classs and formats as specified
43、in the detail specifications: . Classes Class I - r Class II - Class III - Class IV - -For primary utilization in shipboard, subsurface . shi.p, and shore applications. Module interface _. temperature, rib surfaces or inlet air, at OC low, and 6OC high. For primary ut i 1 i rat i on i n airborne app
44、l i cat ions and where stringent environmental requirements are imposed. .Module interface temperature, rib surfaces or inlet air, at minus 55C low, and 85C high. For utilization where class I modules may be expo.sedto radiation. Module interface temperature, rib surfaces or inlet air, at OC low, an
45、d 60C high. For uti1 ization where. class II modules may be exposed to radi at i on. Modul e interface temperature, rib surfaces or inlet air, at minus 55C low, and. 85C hi.gh. 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-.I Formats Format A - F
46、ormat B - Format C - Format D - Format E - MIL- The basic S a thickness TO- 13890 re has a span of 2.62 inches (66.55 mm), of 0.290 inches (7.377 mm), and a total height of 1.95 inches (49.53 mm) including keying- pins. The basic size has a span of 2.74 inches (69.59 mm), B thickness of 0,290 inches
47、 (7.377 mm),. and a total height of 1.95 inches (49.53 mm) including keying pi ns The basic size has a span of 5.88 inches (149.35 mn), a thickness of 0.280 inches (7.112 mm), and a total. height of 4.06 inc.hes (103.12 mm) including keying pins . The basic size hasa span of 5.88 inches (149;35 mn),
48、 a thickness of 0.280 inches (7.112 mn), and a total height of 4.83 inches (122.68 mm), Including keying pins . The basic size has a span of 5.88 inches (149.35 mn), a thickness of 0.380 inches (9.652 mn), and a total height of 6.68 inches (169.67 mm), including keying pins . e Provided by IHSNot fo
49、r ResaleNo reproduction or networking permitted without license from IHS-,-,-“ a e 0 MIL-STD-13890 2. APPLICABLE DOCUMENTS 2 1 Government documents. and 2.1.1 Specifications and standards. The following specification standards form a part of this document to the extent specified herein. Unless otherwise spe
