1、I - 0-47 - zko MIL-T-85641 47 m 777770b 0258213 7 W MI L-T-85641 (AS) 4 February 1985 MILITARY SPECIFICATION TEST SET, GUIDED MISSILE LAUNCHER AN/AWM-SOA Department of the Navy and agencies of the Department This specification is approved for use by the Naval Air Systems Command, is available for us
2、e by all departments and of Defense. 1. SCOPE 1,l Scope. This spec fication establishes the des gn, performance, and acceptancwuirements for the Guided Missile Launcher Test Set AN/AWM-SOA. The test set is a microprocessor-controlled stimuli , load, and measurement system programmed to test AERO 5B,
3、 LAU-l18(V)l/A, LAU-7/A-5 , LAU-l15/A, LAU-llG/A, and LAU-l17A( V)2/A Guided Missi1 e Launchers. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. Unless otherwise specified, the following specifications, standards and handbooks of the issue listed in
4、that issue of Department of Defense Index of Specifications and Standards (DoDISS) specified in the solicitation form a part of this specification to the extent specified herein. Beneficial conents (recommendations, additions , deletions) and any pertinent data wnich may be of use in improving this
5、document should be addressed to: Comnanding Officer, Naval Air Engineering Center, Engineering Specifications and Standards Department (ESSD) Code 93, Lakehurst, NJ 08733, by using the. self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this docuFnt o
6、r by letter. . THIS DOCUMENT CONTAINS -3-y- PAGES .- FSC 4935 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-SbqL Y9 9999406 02582Lq 7 MIL-T-85641(AS) SPECIFICATIONS Federal PPP-T-60 P PP -T-76 PPP -B -5 85 PPP-B-601 P PP -B -6 2 1 PPP-B-636 Q
7、Q-S-781 Mi 1 i tary MIL-P-116 M IL -C -36 43 MIL-C-3650 M IL-E- 17555 MIL -T- 18303 MIL-N-18307 M I 9500 M IL IT- 28800 Tape, Packaging , Waterproof Tape, Pressure Sensitive Adhesive, Paper (For Carton Seal ing) Boxes, Wood, Wire-bound Boxes, Wood, C1 eated-Plywood Boxes, Wood, Nail ed and Lock-Corn
8、er Boxes, Fi berboard Strapping Steel, and Seals Preservation, Methods of Connector, P1 ug, Electrical Series HN, Type UG-59E/U Connector, Coaxial Radio Frequency, Series LC Electronic and Electrical Equipment, Accessories, and Repair Parts; Packaging and Packing of Test Procedures; Preproduction an
9、d Inspection, for Aircraft Electronic Equipment, Format for Nomenclature and Identification for Electronics, Aeronautical and Aeronautical Support Equipment Including Ground Support Equipment Semiconductor Device, General Specification for Test Equipment for use with Electrical and Electronic Equipm
10、ent, General Specification for 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-85641 q7 = 777770b 0258235 O M IL -M-385 10 MIL-C-38999 MI L-C -390 12 MIL -H-46855 MI L-C -55302 MIL-C-55544 MIL -C-837 23 STANDARDS Mi 1 i tary MI L-STD- 108 M I
11、L -STD- 129 MIL-STD-130 MIL-STD-147 MIL-STD-198 MIL-STD-199 M IL -STD -45 4 MIL -STD-46 1 MIL-T-85641 (AS) Microcircuit, General Specification for Connector, Electrical , Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded, and Breech Coup1 ing) , Environment Resistant, Removable
12、Crimp and Hermetic Sol der Contacts, General Specification for Connector, Coaxial , Radio Frequency, General Specification for Human Engineering Requirements for Mil itary Systems, Equipment and Facil i ties Connector, Printed Circuit Subassembly and Accessories Connector, Electrical , Environment R
13、esistant, for use with Flexible Flat Conductor Cable and Round Wire, General Specification for Connector, Electrical (Circular, Environment Resistant) , Receptacles and P1 ugs, General Specification for Definition of Basic Equipment for Enclosure for Electric and Electronic Equ i pent Marking for Sh
14、ipment and Storage Identification Marking of U.S. Military P rope r ty Palletized Unit Loads Validated October 1974 Capacitor, Selection and Use of Resistor, Selection and Use of Standard Requirements for Electronic Equipment Electromagnetic Emission and Susceptibility Requirements for the Control o
15、f Electromagnetic Interference 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-flIL-T-856YL Y7 7777706 0258236 2 9 MIL-T-85641 (AS) M IL -STD-462 MIL -STD-470 M IL -STD-47 1 MIL-STD-70 1 MIL-STD-704 MI L-STD-78 1 MIL-STD-785 M IL -STD -8 10 MIL-STD
16、-883 MIL-STD-1188 MIL-STD- 1472 Electromagnetic Interference Characteristics, Measurement of Maintainability Program Requirements for Systems and Equipments Prediction Maintainabil ity Demonstrations List of Standard Semiconductor Devices Aircraft Electric Power Characteristics Re1 iabil ity Tests E
17、xponential Di s tri buti on Re1 iabil i ty Program for Systems and Equipment Deve1 opment and Production Environmental Test Methods Test Methods and Procedures for Microelectronics Comercial Packaging of Suppl ies and Equipments Human Engineering Design Criteria for Military Systems, Equipment and F
18、acilities Lists of Standard Microcircuits MIL-STD-1562 HANDBOOKS Mil i tary MIL -HDBK-47 2 Military Standardization Handbook, Maintainability Predictions Naval Air Systems Comnand NAVAIR 16-30AWM90-1 Technical Manual, Intermediate Instruction with Illustrated Parts Breakdown, Guided Missile Launcher
19、 Test Set AN/AWM-WA 2.1.2 Other Government documents, drawings, and pub1 ications. The following other Government documents, drawings, and publications form a part of this specification to the extent specified herein. 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
20、ense from IHS-,-,-MIL-T-85641 47 777770b 0258237 4 MIL-T-85641(AS) BULLET1 NS ANA Bulletin No. 400 Air Force-Navy Aeroqautical Bu1 1 etin Electronic Equipment; Aircraft and Guided Missiles, Appl icable Documents DRAW I NGS Naval Air Systems Command 127 1AS 1000 Test Set, Guided Missile Launcher AN /
21、AM -90 A (Copies of specifications, standards, handbooks, drawings and pub1 ications required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting officer.) 2.1.3 Order of precedence. of this specificati
22、on and the references cfted herein, the text of this specification shall take precedence. In the event of a conflict between the text 3. REQUIREMENTS 3.1 Item description. The AN/AWM-SOA test set (see figure 1) shall consist of a self-test adapter for use in self tests, two test cables for performin
23、g self test and equipment tests, 13 adapters, for adapting to the various equipments, two power cables for DC and 400 cycle supply, a LAU-7 Detent Wrench, an accessory case, and an instrument case. subjected to first article inspection (see 4.4 and 6.3). 3.2 First article. When specified (see 6.2.11
24、, a sample shall be 3.3 Materials, parts, processes. Materials, parts, and processes used the test set shall be as specified in MIL-T-28800, MIL-STD-454 and 3.3.1 thrmgh 3.3.2.2. n 3.3.1 Parts. All parts shall be selected from those parts included in ANA Bulleti= 400, unless the parts listed therein
25、 will not perform as required in the intended appl ications and environments specified herein. the latter is the case, request for use of nonstandard parts shall be obtained by the contractor in accordance with Requirement 23. If 3.3.1.1 Solid state design. All microelectronic devices shall be selec
26、ted as specified in Requirement 64 of MIL-STD-454 and MIL-STD-883. Hybrid microcircuits, including radio frequency, memory, microwave, and mal timeter types are considered microelectronic devices and shall be controlled by Requirement 64 of MIL-STD-454, microcircuits are considered cri tical i tems
27、and shall be treated as specified in MIL-STD-785. Any deviation from all solid state construction shall be authorized by the procuring activity prior to initiation. Hybrid and complex mono1 ithic 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-
28、T-5641 49 U 9994906 02582118 b i- I I k ! 2 / MIL-T-85641 (AS) ACCESSORY CASE - 4 INSTRUMENT CASE WI, W2 TEST CABLES W3, W4 POWER CABLES W5 ADAPTER CABLE W6 ADAPTER W7 ADAPTER W8 ADAPTER WIO ADAPTER CABLE WII ADAPTER W9ADAPTER CABLE W14 ADAPTER FIGURE 1, Guided Missile Launcher Test Set AN/AWM-SOA (
29、Sheet 1 of 2) 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-85643 47 a 7777906 0258234 8 MIL-T-85641 (AS) W15 ADAPTER CABLE W17 CARTRIDGE ADAPTER DETENT WRENCH W16 ADAPTER CABLE W18 ADAPTER W19 ADAPTER W23 ADAPTER FIGURE 1. Guided Missile L
30、auncher Test Set AN/AWM-SOA (Sheet 2 of 2) 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-Sb41 49 W 777970b OZ58220 4 m 3-3.1.2 Microcircuits and semiconductors. All microcircuits and semiconductormall be packaged in hermetic packages. No pl
31、astic encapsulated devices shall be used. 3.3.1.2.1 Microcircuit devices. Only microcircuits listed in MIL-STD-1562 and procured as specified in MIL-M-38510 are standard for new design. When nonstandard microcircuit devices are approved for use as specified in the general requirement of MIL-M-38510,
32、 Class B shall apply. Nonstandard devices shall be screened and qualified as specified in MIL-STD-883 (Test Methods 5004.3 and 5005.3) . The qualification as specified ln the requirements of Methods 5005.3, Group C, shall be satisfied by submission of approved test results for all standard and nonst
33、andard microcircuit devices. 3.3. 1.2.2 Semiconductor devices. Only JANTX semiconductor devices. selected as specified in MIL - STD /OX are standard. listed, the selection of nonstandard devices shall conform to the following order of precedences : When a JANTX device is not a. A JAN device listed a
34、s specified in MIL-STD-701. bo A JAN device covered as specified by MIL-S-19500 but not listed in MIL-STD-7010 c. A commercial device. The definition of JANTX, JAN, and TX shall be specified by MIL-S-19500. As a minimum, a TX burn-in requirement as specified in Requirement 30 of MIL-STD-454 shall. b
35、e required for all nonstandard devices. Al 1 semiconductors shall be selected as specified in Requirement 30 of MIL-STD-454. Only solid glass metallurgically bonded axial lead diodes and rectifiers shall be used. When TO-5 and TO-18 packages are required, they shall be limited to the solid metal hea
36、der type. All semiconductor device junctions shall be protected and no organic or desiccant materials shall be included in the package. Thermocompression wedge bonding shall not be used with aluminum wire. Aluminum TO-3 packages shall not be used. contract ( see 6.Z.1) , Requirement 10 of MIL-STD-45
37、4 shall be appl icabl e except that only MIL-C-38999 and MIL-C-83723 covering circul ar connectors, and MIL-Cu55302 covering printed circuit board connectors shall be employed. Connectors for use with flat cable shall meet the specified requirements of ML-C-55544. RF coaxial connectors shall be as s
38、pecified in MIL-C-39012, Series TNC, SC, SMA, or SMB, except where the power or voltage rating of SC series does not meet application requirements. specified in MIL-C-3643 or Series LC as specified in MIL-C-3650 shall be used. 3.3. 1.4 Capacitors and resistors. Only established reliability capaci to
39、rs and resistors as specified in MIL-STD-198 and MIL-STD-199 are standard . 3.3.1.3 Electrical connectors. Unless otherwise specified in the In these cases, Series HN as 8 , Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-85bYL 43 .33777Ob 0258
40、221 b m a 0 a MIL-T-85641 (AS) 3.3.2 Material s. 3.3.2.1 Moisture and fungus resistance. The test set shall be designed Fungus inert materials are specified !n with materials that are moisture resistant and are not nutrient to fungi. The use of nutrient material is acceptable in hermetically sealed
41、assemblies, paper capacitors, and transformers. MIL-STD-454, Requirement 4. resistant or shall be tested as specified in Method 508.1 of MIL-STD-810. parts used in the design shall be moisture resistant. Absorption, retention, or release of moisture by a part shall not degrade or affect performance.
42、 3.3.2.2 Corrosion. Corrosion prevention and control as an overall concept shall be emphasized during design and fabrication. be designed to prevent corrosion that would adversely affect its functions during the specified service 1 ife consistent with required re1 iability and maintenance concepts.
43、Requirements 15 and 16 of MIL-STD-454 shall apply. Other materials shall be certified fungus- The The test set shall 3.3.3 Interchangeability. The test set shall meet the interchangeability requirements of MIL - T 28800 . measuring interchangeability of all applicable units, assemblies, subassembl i
44、ea, and parts. Drawing 1271AS1000 shall be standard for 3.4 Design and construction. The test set shall be manufactured in accordance with Drawing 12/1ASlO 00, except that errors of omission or commission on the drawing may be incompatible with the requirements of this specification. In any case, it
45、 is a condition of final acceptance that the equipment manufactured shall meet all the design, construction, and workmanship requirements of this specification and applicable test documents. 3.4.1 Re1 iabil ity. 3.4.1.1 Operational stability. The test set shall operate with required performance, con
46、tinuously or intermittently for a period of at least 1000 hours. During this time, it shall not be necessary to readjust any controls that are inaccessible to the operator during normal use. 3.4.1.2 Operating life. The test set shall have a minimum total operating life of 10000 h ours with minimal s
47、ervicing and replacement of parts. 3.4.1.3 Reliability in mean-time-between-failures (MTBF) The test set shall have a specified mean (operating) time between failures of 800 hours when tested in accordance with 4.5.3. - 3.4.2 Maintainability. Maintainability provisions shall be incorporated within t
48、he design to provide for service, access and repair of all assemblies. The replacement of major components within the equipment shall be accomplished without the need for special tools. Normal routine testing of the test set shall be accomplished using the standard test equipment normally available
49、in Intermediate Maintenance Shops. the equipment shall be not greater than two hours when replacing circuit modules, plug-ins, assemblies and parts that are intended for replacement at the intermediate level. 3.4.2.1 Mean-time-to-repair (MTTR). The mean-time-to-repair (MTTR) of Only where design changes shall cause significant 9 Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
