1、August 6, 20031SUBJECT 676AOUTLINE OF INVESTIGATIONFORPOTTING COMPOUNDS FOR SWIMMING POOL, FOUNTAIN, AND SPAEQUIPMENTIssue Number: 3AUGUST 6, 2003COPYRIGHT 1998, 2003 UNDERWRITERS LABORATORIES INC.AUGUST 6, 2003SUBJECT 676A2No Text on This PageCONTENTSFOREWORD 4INTRODUCTION1 Scope .52 General 53 Glo
2、ssary .5MARKINGS4 General 5SAMPLES5 General 6PERFORMANCE6 General 77 Characteristic Analyses 88 Exposure Conditions 9AUGUST 6, 2003 SUBJECT 676A 3FOREWORDA. This Outline of Investigation contains basic requirements for products covered by UnderwritersLaboratories Inc. (UL) under its Follow-Up Servic
3、e for this category within the limitations given below andin the Scope section of this Outline of Investigation. They are subject to revision as further experience andinvestigation may show is necessary or desirable.B. The observance of these requirements by a manufacturer is one of the conditions o
4、f the continuedcoverage of the manufacturers product.C. A product which complies with the text of this Outline of Investigation will not necessarily be judged tocomply with the Outline of Investigation if, when examined and tested, it is found to have other featureswhich impair the level of safety c
5、ontemplated by these requirements.D. A product employing materials or having forms of construction which conflict with specific requirementsof the Outline of Investigation cannot be judged to comply with the Outline of Investigation. A productemploying materials or having forms of construction not a
6、ddressed by this Outline of Investigation may beexamined and tested according to the intent of the requirements and, if found to meet the intent of thisOutline of Investigation, may be judged to comply with the Outline of Investigation.E. UL, in performing its functions in accordance with its object
7、ives, does not assume or undertake todischarge any responsibility of the manufacturer or any other party. The opinions and findings of ULrepresent its professional judgement given with due consideration to the necessary limitations of practicaloperation and state of the art at the time the Outline o
8、f Investigation is processed. UL shall not beresponsible to anyone for the use of or reliance upon this Outline of Investigation by anyone. UL shall notincur any obligation or liability for damages, including consequential damages, arising out of or inconnection with the use, interpretation of, or r
9、eliance upon this Outline of Investigation.F. Many tests required by the Outline of Investigations of UL are inherently hazardous and adequatesafeguards for personnel and property shall be employed in conducting such tests.AUGUST 6, 2003SUBJECT 676A4INTRODUCTION1 Scope1.1 This outline covers compoun
10、ds intended to be used to encapsulate grounding and bonding conductorsplices or terminations in swimming pool, spa, or fountain equipment such as fixtures, fixture housings,and junction boxes where the splices or terminations may be exposed to salt-free swimming pool orfountain water and sunlight fo
11、r varying lengths of time, including continuous exposure. This outline alsocovers potting compounds used to fill underwater junction boxes.2 General2.1 Values stated without parentheses are the requirement. Values in parentheses are explanatory orapproximate information.3 Glossary3.1 DIMENSIONAL STA
12、BILITY SAMPLES Test samples prepared in accordance with 5.1(c) andused to condition the potting compound and assess its dimensional stability.3.2 FIELD CONFIGURATION SAMPLES Test samples prepared in accordance with 5.1(a) intendedto represent the mounting of a brass terminal on a wall of a swimming
13、pool or fountain equipment, thetermination of a grounding or bonding conductor, and the encapsulating of the termination and terminalwith the potting compound.3.3 LAP-SHEAR SAMPLES Test samples prepared in accordance with 5.1(b) and used to facilitateconditioning of the potting compound and assess t
14、he adhering properties of the potting compound toone or more substrate material types.3.4 SUBSTRATE MATERIAL TYPE The type of material to which the potting compound is confirmedto adequately adhere.MARKINGS4 General4.1 The smallest unit container in which the compounds are packaged shall be marked w
15、ith the followinginformation:a) The manufacturers name and compound material designation.b) This compound is for use where exposed only to fresh swimming pool or fountain water andsunlight or the equivalent.c) For use only where adhering to copper alloy, stainless steel, and (other materials asappli
16、cable) or the equivalent marked on the container. The marking shall include only thosematerials to which it has been determined to adhere.AUGUST 6, 2003 SUBJECT 676A 54.2 Other markings or literature included with the compound shall not describe its use where exposed todeteriorating conditions or wh
17、ere adhering to materials other than those determined to be appropriate asdescribed in 4.1.4.3 The container for a compound determined to provide insulation resistance through the testprocedures involving only the lower voltages described in the Exceptions to 7.4 7.6 shall be markedEncapsulate only
18、grounding and bonding conductor splices. Literature included with the compound shallfurther indicate that the compound is not suitable for filling swimming pool junction boxes, underwaterjunction boxes, or other enclosures in which the splices or terminations of other than grounding andbonding condu
19、ctors are contained.SAMPLES5 General5.1 The following samples are required to complete the testing. These samples are to be subjected to theExposure Conditions, Section 8.a) Field Configuration Samples Samples of nominal 8 cm (3 inch) square panels of thesubstrate material type identified in the mar
20、king of 4.1(c) and having a nominal thickness in therange of 0.5 1.5 mm (0.020 0.060 inch). In or on each of these panels, two brassgrounding/bonding terminals typically used in swimming pool and fountain equipment shall beinstalled as intended separated by 13 25 mm (1/2 1 inch). The grounding/bondi
21、ng terminalsare to be fitted with a test conductor that is a 30-cm (12-inch) length of No. 8 AWG (8.4 mm2),Type RHW, solid copper wire. The potting compound is then to be applied to the terminal sideof the samples in accordance with the instructions included with the potting compound. Thepotting com
22、pound is to also be applied to the opposite side of the samples and to all otherexposed metal in the same thickness specified in the instructions to facilitate sample immersionwithout the wetting of the metal parts on the panel.b) Lap-Shear Samples Each sample is to be prepared with two panels of th
23、e substratematerial type, each 2.5 by 10 cm (1 by 4 inches) and having a thickness as specified in Table5.1. Stainless steel shall be an American Iron and Steel Institute (AISI) alloy type 304 or 316,also known as alloy S30400 and S31600, respectively, in the United Numbering System (UNS).The two pa
24、nels are to be adhered together with a 25-mm (1-inch) overlap using the pottingcompound with it applied in 3.2 mm (1/8 inch) thickness. The long access of each panel is toalign with the long access of the adjoining panel. For more specific sample features, see therequirements for Bond Strength of Pl
25、ated Polymeric Materials in the Standard for PolymericMaterials Short Term Property Evaluations, UL 746A, and the Standard Test Method forApparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by TensionLoading (Metal-to-Metal), ASTM D1002 (ISO 4587).c) Dimension Stability Sam
26、ples Samples of the potting compound prepared in 13 cm by 13mm by 3.2 mm (5 by 1/2 by 1/8 inch) panels.AUGUST 6, 2003SUBJECT 676A6Table 5.1Minimum thickness of substrate material for lap shear samplesSubstrate material Exposure conditions Required minimum thickness, mm(inch)Stainless steel Low HCI a
27、nd high HCI 1.5 (0.059)aStainless steel Other than low HCI and high HCI 0.5 (0.020)Metal other than stainless steel All 0.5 (0.020)Polymeric materials All 5.0 (0.20)baMinimum 1.5 mm thick stainless steel substrate, rather than minimum 0.5 mm thick, is required for stainless steel substratescondition
28、ed in the HCI solutions to compensate for the reduction in strength resulting from the corrosion that occurs.bLess than 0.5 mm thick polymeric material substrate may be used when the substrate does not break or tear during shearstrength testing.PERFORMANCE6 General6.1 Appropriate samples are to be s
29、ubjected to the Characteristic Analyses, Section 7, in theas-received condition and one or more of the additionally itemized Exposure Conditions, Section 8. Thespecific combinations of sample types, characteristic analyses, and exposure conditions are indicated inTable 6.1.Table 6.1Potting compound
30、test summarySample setnumberType of samples Number ofsamplesExposure conditions (in specifiedorder) for sample sets subjected tomultiple exposure conditionsCharacteristicanalyzed1 Field configuration 3 As-received Bonding path resistance2 Field configuration 3 Tap water immersion Insulation resistan
31、ceand dielectric voltage-withstand strengtha3 Field configuration 3 Normal pool water, then flexing andtwisting, then tap water immersionInsulation resistance4 Field configuration 3 Cold, then flexing and twisting, then tapwater immersionInsulation resistance5 Field configuration 3 High HCL, then fl
32、exing and twisting, thentap water immersionInsulation resistance6 Field configuration 8 Low HCL, then flexing and twisting, thentap water immersionInsulation resistance7 Field configuration 3 Weatherometer Insulation resistance8 Field configuration 3 Thermal cycling Insulation resistance,leakage cur
33、rent, anddielectric voltage-withstand strengthaTotal = 299 Lap-shear 4 As-received Adhesion shearstrength10 Lap-shear 5 Normal pool water Adhesion shearstrength11 Lap-shear 5 Cold Adhesion shearstrengthAUGUST 6, 2003 SUBJECT 676A 7Table 6.1 Continued on Next PageTable 6.1 ContinuedSample setnumberTy
34、pe of samples Number ofsamplesExposure conditions (in specifiedorder) for sample sets subjected tomultiple exposure conditionsCharacteristicanalyzed12 Lap-shear 3 High HCL Adhesion shearstrength13 Lap-shear 5 Thermal cycling Adhesion shearstrength14 Lap-shear 5 Low HCL Adhesion shearstrengthTotal =
35、2715 Dimensional stability 3 As-received Dimensional change16 Dimensional stability 5 High HCL Dimensional change17 Dimensional stability 5 Low HCL Dimensional changeTotal = 1318 Uncured sample 1 B Qualitative infraredaDielectric voltage-withstand strength and leakage current tests are not required
36、if the compound container is marked inaccordance with 4.3 for encapsulating only grounding and bonding conductor splices and terminations.7 Characteristic Analyses7.1 Bonding-Path Resistance Field configuration samples are to be used for this test. In theas-received condition and following the appli
37、cable exposure conditions, the resistance between the twotest conductors is to be measured by passing a 30-ampere, DC or AC current with an open circuit voltagenot exceeding 6 volts through the sample and measuring the resulting voltage potential between the testconductors. In the as-received condit
38、ion and following exposure conditions, the average bonding pathresistance shall not exceed 0.1 ohm. Following this analysis, the samples are to be cut into one or moresections and examined to determine if there is any evidence of water ingress or corrosion of conductivematerials.7.2 Dimensional Chan
39、ge Analysis Dimensional stability samples are to be used for this test. Threesamples are to be subjected to each applicable condition. The before-conditioning dimensions and theafter-conditioning dimensions are to be measured. The average of each of the after-conditioningdimensions shall not differ
40、from the average of each of the before-conditioning dimensions by more than2 percent.7.3 Adhesion Characteristic Analysis Lap-shear samples are to be used for this test. As-receivedsamples and samples for each applicable exposure condition are to be placed in the grips of a machinedesigned to apply
41、tensile stress. A tensile load is to be applied at the rate of 2.5 mm/min (0.1 inch/min)until the shear point is reached. The average shear strength after conditioning shall be at least 50 percentof the average shear strength of the as-received samples.7.4 Insulation Resistance Analysis The insulati
42、on resistance of the potting compound is to be measuredby immersing the field configuration samples in tap water. One lead of the megohmmeter is to beconnected to both conductor leads and the second lead of the megohmmeter is to be connected to a bareconductor immersed in the tap water. The megohmme
43、ter is to apply a DC potential of 500 volts acrossthe leads. The insulation resistance is to be monitored for 1 minute and the minimum insulation resistanceobserved is to be recorded. The average insulation resistance shall not be less than 1000 megohms.AUGUST 6, 2003SUBJECT 676A8Exception: The mego
44、hmmeter may be set to apply a DC potential of 50 volts across the leads if thecompound container is marked in accordance with 4.3 for encapsulating only grounding and bondingconductor splices and terminations.7.5 Dielectric Voltage-Withstand Strength Field configuration samples are to be used for th
45、is test.Each sample is to be immersed in tap water and one lead of the test equipment is to be connected to thetest conductors of the samples and the second lead of the test equipment is to be connected to a bareconductor immersed in the tap water. The sample is to be subjected to a 2200-volt, 60-he
46、rtz potential forone minute and no sample shall exhibit breakdown.Exception: The dielectric voltage-withstand strength characteristic analysis is not required to beconducted if the compound container is marked in accordance with 4.3 for encapsulating only groundingand bonding conductor splices and t
47、erminations.7.6 Leakage Current Analysis Field configuration samples are to be used for this test. Samples areto be immersed in tap water. A 600-volt, 60-hertz potential is to be applied between the connected testconductors of the sample and a bare conductor lead immersed in the tap water. A suitabl
48、e leakage currentmeter is to be connected in series in the circuit to observe the maximum leakage current during aone-minute period. The average maximum leakage current shall not exceed 1 mA.Exception: The leakage current analysis is not required to be conducted if the compound container ismarked in
49、 accordance with 4.3 for encapsulating only grounding and bonding conductor splices andterminations.7.7 Qualitative Infrared Analysis An infrared spectrum of the potting compound material is to beobtained. Fifty milliliters of the compound in uncured form is required for this analysis.8 Exposure Conditions8.1 Tap Water Immersion The test samples are to be immersed for 24 hours in tap water maintainedat a temperature of 25 5C (77 9F). All parts of the sample are to be placed at least 30 cm (1 foot)under the surface
