IEC 60286-3-2013 Packaging of components for automatic handling - Part 3 Packaging of surface mount components on continuous tapes《自动处理用元件的包装.第3部分 连续传送带上表面装配元件的包装》.pdf

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1、 IEC 60286-3 Edition 5.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes Emballage de composants pour oprations automatises Partie 3: Emballage des composants pour montage en surface

2、en bandes continues IEC 60286-3:2013 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopyin

3、g and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC

4、 member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sa

5、ns laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rs

6、idence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for al

7、l electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications sear

8、ch - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date o

9、n all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English

10、 and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Servic

11、e Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu

12、technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens utiles: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CE

13、I en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Published CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les

14、 nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes

15、 quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60286-3 Edition

16、 5.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes Emballage de composants pour oprations automatises Partie 3: Emballage des composants pour montage en surface en bandes continues

17、INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 31.020; 31.240 PRICE CODE CODE PRIX ISBN 978-2-83220-819-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure

18、 that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60286-3 IEC:2013 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 General 8 1.1 Scope 8 1.2 Normative references 8 2 Terms and definitions .

19、8 3 Structure of the specification 10 4 Dimensional requirements for taping. 10 4.1 Component cavity positioning requirements . 10 4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 10 4.1.2 Requirements for types 4 . 10 4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) 11

20、 4.3 Type 1a Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 4.4 Type 1b Pressed carrier tape, with top cover tape (tape width: 8 mm) 14 4.5 Type2a Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm,

21、16 mm and 24 mm) . 16 4.6 Type 2b Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) 18 4.7 Type 3 Blister carrier tape, with double sprocket holes (32 mm to 200 mm) 20 4.8 Type 4 Adhesive-backed punched plastic carrier tape for singulated bare die and

22、 other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22 5 Polarity and orientation requirements of components in the tape 25 5.1 Requirements for all tape types . 25 5.2 Specific requirements for type 1a 25 5.3 Specific requirements for type 4 25 6 Carrier tape requirements . 25 6.1 Tapi

23、ng materials 25 6.2 Minimum bending radius (for all types) 26 6.3 Camber . 26 7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27 8 Component taping and additional tape requirements 28 8.1 All types 28 8.2 Specific requirements for type 1b 28 8.3 Specific tape requirements for type 2b. 28

24、 8.4 Specific requirement for type 4 28 8.4.1 General . 28 8.4.2 Coordinate system . 29 8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30 8.5 Specific requirements for tapes containing die products 31 8.5.1 General . 31 8.5.2 Tape design for tapes containing die produ

25、cts . 31 8.5.3 Cleanliness 31 8.5.4 Die lateral movement (Types 1a, 2a and 2b) 32 9 Reel requirements 32 9.1.1 General . 32 60286-3 IEC:2013 3 9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32 9.1.3 Reel hole dimensions (see Figure 25 and Table 24) 34 9.2 Marking . 34 10 Tape r

26、eeling requirements 35 10.1 All types 35 10.2 Specific requirements for type 1a 35 10.3 Specific requirements for type 4 35 10.4 Leader and trailer tape (see Figure 27) . 36 10.4.1 Leader . 36 10.4.2 Trailer 36 10.5 Recycling 36 10.6 Missing components 36 Annex A (normative) Recommended measuring me

27、thods for type 1b . 37 Bibliography 39 Figure 1 Sectional view of component cavity (type 1b) . 9 Figure 2 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12 Figure 3 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset 12 Figure 4 Maximum component tilt, rotation

28、 and lateral movement 12 Figure 5 Dimensions (P 0 = 4 mm/P 1 = 2 mm) and (P 0 = 4 mm/P 1 = 1 mm) 14 Figure 6 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset 14 Figure 7 Maximum component tilt, rotation and lateral movement 14 Figure 8 Blister carrier tape dimensions (8 mm, 12 mm

29、, 16 mm and 24 mm) 16 Figure 9 Illustration of 2 mm cavity pitch and pocket offset 16 Figure 10 Maximum component tilt, rotation and lateral movement 16 Figure 11 Type 2b carrier tape . 18 Figure 12 Maximum pocket offset . 18 Figure 13 Maximum component tilt, rotation and lateral movement 18 Figure

30、14 Blister carrier tape 20 Figure 15 Elongated sprocket hole skew 20 Figure 16 Maximum component tilt, rotation and lateral movement 20 Figure 17 Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) 23 Figure 18 Illustration of 2 mm compartment pitch . 23 Figure 19 Maximum compon

31、ent planar rotation and lateral displacement . 23 Figure 20 Bending radius . 26 Figure 21 Camber (top view) 27 Figure 22 Type 4 coordinate system 30 Figure 23 Component clearance and positioning method . 31 Figure 24 Reel . 32 Figure 25 Reel hole presentation . 34 Figure 26 Tape reeling and label ar

32、ea on the reel 35 Figure 27 Leader and trailer . 36 Figure A.1 Carrier tape thickness measurement points 37 4 60286-3 IEC:2013 Figure A.2 Cavity cross-section 37 Figure A.3 Cavity depth dimension . 38 Table 1 component size codes . 9 Table 2 Constant dimensions of 8 mm and 12 mm punched carrier tape

33、 13 Table 3 Variable dimensions of 8 mm and 12 mm punched carrier tape . 13 Table 4 Component tilt, planar rotation and lateral movement 13 Table 5 Constant dimensions of 8 mm pressed carrier tape . 15 Table 6 Variable dimensions of 8 mm pressed carrier tape 15 Table 7 Component tilt, planar rotatio

34、n and lateral movement 15 Table 8 Constant dimensions of 8 mm to 24 mm blister carrier tape . 17 Table 9 Variable dimensions of 8 mm to 24 mm blister carrier tape 17 Table 10 Component tilt, rotation and lateral movement . 17 Table 11 Constant dimensions of 4 mm carrier tape . 19 Table 12 Variable d

35、imensions of 4 mm carrier tape 19 Table 13 Component tilt, planar rotation and lateral movements 19 Table 14 Constant dimensions of 32 mm to 200 mm blister carrier tape . 21 Table 15 Variable dimensions of 32 mm to 200 mm blister carrier tape 21 Table 16 Component tilt, planar rotation and lateral m

36、ovements 21 Table 17 Dimensions of adhesive backed punched carrier tape . 24 Table 18 Variable dimensions of adhesive-backed punched carrier tape 24 Table 19 Component planar rotation and lateral displacement . 24 Table 20 Minimum bending radius 26 Table 21 Peel force 27 Table 22 Absolute referencin

37、g data for component target position . 30 Table 23 Reel dimensions 33 Table 24 Reel hole dimensions 34 60286-3 IEC:2013 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING Part 3: Packaging of surface mount components on continuous tapes FOREWORD 1) The Inter

38、national Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and elect

39、ronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committee

40、s; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for St

41、andardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has

42、 representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurat

43、e, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional

44、publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some

45、 areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents in

46、cluding individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or re

47、liance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the

48、 elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for electronic equipment. This fifth ed

49、ition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Pa

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