1、 IEC 60749-40 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge Dispositifs semiconducteurs Mthodes dessais climatiques et mcaniques Partie 40: Mthode dessai de chute a
2、u niveau de la carte avec utilisation dune jauge de contrainte IEC 60749-40:2011 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
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16、ommentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60749-40 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climati
17、c test methods Part 40: Board level drop test method using a strain gauge Dispositifs semiconducteurs Mthodes dessais climatiques et mcaniques Partie 40: Mthode dessai de chute au niveau de la carte avec utilisation dune jauge de contrainte INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTR
18、OTECHNIQUE INTERNATIONALE S ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-583-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 60749-40 IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative re
19、ferences . 5 3 Terms and definitions . 5 4 Test equipment . 6 5 Test procedure . 6 5.1 Test specimen . 6 5.2 Test substrate . 6 5.3 Solder paste 6 5.4 Mounting method . 7 5.5 Pre-conditionings 7 5.6 Initial measurements . 7 5.7 Intermediate measurement 7 5.8 Final measurement 7 6 Test method . 7 6.1
20、 Purpose of test method . 7 6.2 Example of drop test equipment 7 6.3 Example of substrate-securing jig 8 6.4 Example of distance between supporting points 8 6.5 Example of impacting surface 8 6.6 Strain gauge 8 6.7 Strain gauge attachment . 8 6.8 Strain measurement instrument . 9 6.9 Test condition
21、10 6.9.1 Drop test conditions . 10 6.9.2 Test procedure 10 6.9.3 Drop height 11 6.9.4 Pre-test characterization 11 6.9.5 Direction 13 6.9.6 Number of drops 13 7 Summary 13 Annex A (normative) Drop impact test method using test rod . 15 Annex B (informative) An example of strain gauge attachment proc
22、edure 18 Figure 1 Example of drop test equipment and substrate securing jig 9 Figure 2 Position of strain gauge attachment . 10 Figure 3 Strain measurement instrument 11 Figure 4 Waveform of strain and electrical conductivity of daisy chain . 11 Figure 5a Number of times of drop to failure 13 Figure
23、 5b Pulse duration 13 Figure 5 Correlation strain and number of failures and strain and pulse duration 13 Figure 6 Correlation between pulse duration and distance between supporting points . 13 Figure 7 Correlation between the number of times of failure and the maximum strain 14 Figure 8 Direction o
24、f dropping 14 60749-40 IEC:2011 3 Figure A.1 Outline of test apparatus . 16 Figure A.2 Waveform of strain and electrical conductivity of a daisy chain 18 Figure B.1 Equipment and materials 19 Figure B.2 Example of Attaching Strain Gauge and Guide Mark Dimensions 20 Figure B.3 Strain gauge attachment
25、 procedure, part 1 . 21 Figure B.4 Strain gauge attachment procedure, part 2 . 22 4 60749-40 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 40: Board level drop test method using a strain gauge FOREWORD 1) The International Electr
26、otechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. T
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35、is IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of th
36、is IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-40 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following doc
37、uments: FDIS Report on voting 47/2094/FDIS 47/2100/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. 60749-40 IEC:2011 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list o
38、f all parts of the IEC 60749 series, under the general title Semiconductor devices Mechanical and climatic test methods, can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under
39、 “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are con
40、sidered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer. 6 60749-40 IEC:2011 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 40: Board level drop test method using a strain gauge 1 Scope This part of IEC
41、 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to pr
42、ovide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of
43、 a component. Test method IEC 60749-37 uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The detailed specification shall state which test method is to be used. NOTE 1 Although th
44、is test can evaluate a structure where the mounting method and its conditions, the design of a printed wired board, solder material, the mounting capability of a semiconductor device, etc. are combined, it does not solely evaluate the mounting capability of a semiconductor device. NOTE 2 The result
45、of this test is strongly influenced by the differences between soldering conditions, the design of the land pattern of a printed wired board, solder material, etc. Therefore, in carrying out this test, it is necessary to recognize that this test cannot intrinsically guarantee the reliability of the
46、solder joint of the semiconductor devices. NOTE 3 When the mechanical stress which is generated by this test does not occur in the actual application of the device, implementation of this test is unnecessary. 2 Normative references The following referenced documents are indispensable for the applica
47、tion of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-37, Semiconductor devices Mechanical and climatic test methods Part 37: Board level drop test method using
48、an accelerometer 3 Terms and definitions For purposes of this document, the following terms and definitions apply. 3.1 device single electronic component to be surface mounted 3.2 drop impact strength strength of the test substrate held by a jig that is dropped from a defined height, as represented
49、by the number of cyclic drops that finally cause fracture on the joint between a device and a PWB copper land 60749-40 IEC:2011 7 3.3 strain strain of surface of substrate degree of stretching observed when the test substrate is distorted NOTE The strain is a numeric dimensionless quantity. 3.4 maximum strain tensile side (+) of the strain waveform 3.5 pulse duration durati
