1、 IEC/TR 62258-7 Edition 1.0 2007-08 TECHNICAL REPORT Semiconductor die products Part 7: XML schema for data exchange IEC/TR 62258-7:2007(E) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may
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8、us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TR 62258-7 Edition 1.0 2007-08 TECHNICAL REPORT Semiconductor die products Part 7: XML schema for data exchan
9、ge INTERNATIONAL ELECTROTECHNICAL COMMISSION U ICS 31.080.99 PRICE CODE ISBN 2-8318-9289-9 2 TR 62258-7 IEC:2007(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references6 3 Definitions 6 4 General 7 5 Data exchange .7 Annex A (normative) XML schema8 Annex B (informative) XML example.19
10、 Bibliography26 TR 62258-7 IEC:2007(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 7: XML schema for data exchange FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnica
11、l committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Te
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20、on. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. Howeve
21、r, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62258-7, which is a technical report, has been prepared by IEC technical c
22、ommittee 47: Semiconductor devices. The text of this technical report is based on the following documents: Enquiry draft Report on voting 47/1887/DTR 47/1897/RVC Full information on the voting for the approval of this Technical Report can be found in the report on voting indicated in the above table
23、. 4 TR 62258-7 IEC:2007(E) This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62258 series, under the general title Semiconductor die products, can be found on the IEC website. Further parts may be added as required. The committee has
24、decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised editi
25、on, or amended. A bilingual version of this publication may be issued at a later date. TR 62258-7 IEC:2007(E) 5 INTRODUCTION This technical report is based on the work carried out in the ESPRIT 4 thFramework project GOODDIE which resulted in the publication of the ES 59008 series of European specifi
26、cations. Organizations that helped prepare this report included the ESPRIT ENCAST and IST ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 TR 62258-7 IEC:2007(E) SEMICONDUCTOR DIE PRODUCTS Part 7: XML schema for data exchange 1 Scope IEC/TR 62258-7, which is a technical report
27、, has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the eleme
28、nts needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in
29、IEC/TR 62258-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050
30、(all parts), International Electrotechnical Vocabulary IEC 62258-1: Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats IEC/TR 62258-4: Semiconductor die products Part 4: Questionnaire for die users and supplie
31、rs IEC 62258-5: Semiconductor die products Part 5 Requirements for information concerning electrical simulation IEC 62258-6: Semiconductor die products Part 6 Requirements for information concerning thermal simulation 3 Terms and definitions For the purposes of this document, relevant terms, which a
32、re defined in IEC 60050, together with additional terms and acronyms as given in IEC 62258-1, apply. TR 62258-7 IEC:2007(E) 7 4 General The schema given in this technical report complies with Version 1.0 (Third edition) of the Extensible Markup Language (XML) as defined by the World Wide Web Consort
33、ium (W3C). Links to the XML standard are given in the bibliography. To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish information that is necessary and sufficient for users of die devices at all stages of design, procurement, manufacture and test of produ
34、cts containing them. The schema in Annex A defines an exchange mechanism for structuring such information using an XML representation and as such is intended as an aid to compliance with the standard. Whilst it is expected that much of the information supplied will be in the public domain and availa
35、ble from such sources as manufacturers data sheets, neither the standard nor the schema places an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non-disclosure agreement.
36、5 Data exchange The schema in Annex A implements all the entities as defined by IEC 62258-2 for the DDX format. In addition, it includes additional entities extending the range of that data as follows: expansion of data on organisations (manufacturer, supplier etc.) to include addresses and contacts
37、; sub-division of some entities to make their values clearer. Annex B contains an example of an XML file based on the schema using a fictitious example similar to that employed in IEC 62258-2, and extended to cover additional data requirements. It is possible that software may be available for conve
38、rsion of data produced using the spreadsheet associated with IEC/TR 62258-4 into this format. In any case, a wide range of tools is available commercially for handling and processing XML files. The electronic form of the schema contained in this technical report may be downloaded from the IEC websit
39、e. The copyright conditions applying to the use of the electronic file are those that apply to IEC database standards, which permit the use of such information in electronic form for bona-fide e-commerce but do not permit its sale to third parties or other commercial use. 8 TR 62258-7 IEC:2007(E) An
40、nex A (normative) XML schema In electronic form, for use by the example file shown in Annex B, the file containing this schema is assumed to have the name DDXschema.xsd TR 62258-7 IEC:2007(E) 9 10 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 11 12 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 13 14
41、 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 15 16 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 17 18 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 19 Annex B (informative) XML example Annex B is based on a fictitious example for a quad two-input NAND gate and illustrates many of the features of
42、the schema. 2006-02-13 DDXconvert version 4.0 1.2 GOOD-DIE database Initial issue A bare_die 74ACT00 Mask T Fuzziwuzz Logic Ltd 74ACT00 Quad two-input advanced CMOS NAND gate micrometre top 356 CMOS silicon Al 175 Die, wafer 356 CONN Vcc 1 PADR1 20 TR 62258-7 IEC:2007(E) 28 T_1 1 A1 I T_2 2 B1 I T_3
43、 3 Y1 O T_4 4 A2 I T_5 5 B2 I T_6 6 TR 62258-7 IEC:2007(E) 21 Y2 O T_7 7 GND G T_8 8 Y3 O T_9 9 B3 I T_10 10 A3 I T_11 11 Y4 O T_12 12 22 TR 62258-7 IEC:2007(E) B4 I T_13 13 A4 I T_14 14 VCC V G_1 G_2 G_3 G_4 G_5 TR 62258-7 IEC:2007(E) 23 G_6 G_7 G_8 SP74ACT00.MOD 1997-09-17 pSpice 4.0.1 2G6 24 TR 6
44、2258-7 IEC:2007(E) SP74ACT00.S 1998-11-05 Spectre 4.2.1, 1992 2G6, Level-3 7995FID1.JIF 25Cel Vcc=5V IECQ None No changes planned TR 62258-7 IEC:2007(E) 25 Temperature 25Cel and mobile phone application MIL-HDBK 217E Maximum 150Cel for 2s Six months at 25Cel and 50%RH 26 TR 62258-7 IEC:2007(E) Bibli
45、ography Extensible Markup Language (XML) 1.0 (Third Edition): W3C Recommendation 04 February 2004 is available at http:/www.w3.org/TR/2004/REC-xml-20040204 XSL Transformations (XSLT) Version 1.0: W3C Recommendation 16 November 1999 is available at http:/www.w3.org/TR/1999/REC-xslt-19991116 _ INTERNATIONAL ELECTROTECHNICAL COMMISSION 3, rue de Varemb P.O. Box 131 CH-1211 Geneva 20 Switzerland Tel: + 41 22 919 02 11 Fax: + 41 22 919 03 00 infoiec.ch www.iec.ch
