1、 IEC 60191-6-13 Edition 2.0 2016-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) Normalisation mcanique des dispositifs
2、semiconducteurs Partie 6-13: Guide de conception pour les supports sans couvercle pour les botiers matriciels billes et pas fins (FBGA) et les botiers matriciels zone de contact plate et pas fins (FLGA) IEC 60191-6-13:2016-09(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva,
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20、z-nous: csciec.ch. IEC 60191-6-13 Edition 2.0 2016-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) Normalisation mcaniqu
21、e des dispositifs semiconducteurs Partie 6-13: Guide de conception pour les supports sans couvercle pour les botiers matriciels billes et pas fins (FBGA) et les botiers matriciels zone de contact plate et pas fins (FLGA) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATI
22、ONALE ICS 31.080.01 ISBN 978-2-8322-3662-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vo
23、us avez obtenu cette publication via un distributeur agr. 2 IEC 60191-6-13:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references. 6 3 Terms and definitions 6 4 Socket code 6 4.1 Construction of socket code 6 4.2 Symbols 7 4.2.1 Semiconductor sockets symbol . 7 4.2.2 S
24、ocket type symbol 7 4.2.3 Socket nominal dimension symbol 7 4.2.4 Number of terminal arrays 7 4.2.5 Terminal pitch 7 5 Terminal number . 7 6 Socket nominal dimension . 8 7 Socket length and width . 8 8 Reference symbols and schematics . 8 8.1 Outline drawings . 8 8.2 Reference symbols and schematics
25、 of recommended socket mounting pattern on printed circuit board 11 8.3 Overall dimensions 12 8.4 Recommended dimensions of socket mounting pattern on printed circuit board 17 9 Individual outline drawing standard registration 18 Figure 1 Outline drawings of the socket 9 Figure 2 Outline drawings fo
26、r the definition of terminal diameter . 10 Figure 3 Applicable package outline . 10 Figure 4 Socket mounting pattern . 11 Table 1 Overview for the different socket groups 8 Table 2 Overall dimensions (1 of 2) 12 Table 3 Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2) 14 Table 4 Socke
27、t dimension for Group 4 (square or rectangular socket) . 16 Table 5 Socket mounting dimensions 17 Table 6 Registration table 18 IEC 60191-6-13:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-13: Design guideline of open-top-type
28、sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to p
29、romote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guid
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35、ation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of
36、 this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or
37、 indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable f
38、or the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-13 has b
39、een prepared by subcommittee 47D: Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant techni
40、cal changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group n
41、umber 4. 4 IEC 60191-6-13:2016 IEC 2016 The text of this standard is based on the following documents: FDIS Report on voting 47D/878/FDIS 47D/885/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication h
42、as been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60191 series, under the general title Mechanical standardization of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remai
43、n unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 60191-6-13:2016 IEC 2016 5 INTRODUCTION This
44、part of IEC 60191 aims to standardize the outer dimensions of the sockets for FBGA and FLGA, where leading-edge developments are aggressively innovated, to establish their compatibility with the needs of the surface-mount industry that is globally expanding due to enhanced functions and performances
45、 of electrical devices. For defining each dimension, the target was to indicate the standard design value which has the concept of the design centre as much as possible, aiming to enhance the function as a standardization index. 6 IEC 60191-6-13:2016 IEC 2016 MECHANICAL STANDARDIZATION OF SEMICONDUC
46、TOR DEVICES Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) 1 Scope This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Gr
47、id Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indi
48、spensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60191-6, Mechanical s
49、tandardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60191-6 apply. 4 Socket code 4.1 Construction of socket code A socket code is constructed as follows. EXAMPLE Symbol of socket 4.2.1 Symbol of
