1、IEEE Std C37.301-2009IEEE Standard for High-Voltage Switchgear (Above 1000 V) Test TechniquesPartial Discharge MeasurementsIEEE3 Park Avenue New York, NY 10016-5997, USA20 March 2009IEEE Power +1 978 750 8400. Permission to photocopy portions of any individual standard for educational classroom use
2、can also be obtained through the Copyright Clearance Center. iv Copyright 2009 IEEE. All rights reserved. Introduction This introduction is not part of IEEE Std C37.301-2009, IEEE Standard for High-Voltage Switchgear (Above 1000 V) TestsPartial Discharge Measurements. A partial discharge is a locali
3、zed dielectric breakdown of a section of dielectrically stressed insulation path that occurs generally in voids, cracks, or interfaces within that insulating system or from the sharp edges of energized apparatus parts. These discharges may or may not exhibit a glow discharge, based on location and t
4、he intensity of these discharges. The classic form of Corona is usually denoted by a visual glow or dielectric breakdown of the insulating air or gas around overstressed conductors or the sharp edges of energized apparatus parts. Radio influence voltage (RIV) measurements are made to determine the e
5、xtent of radio interference generated by this Corona and the corrective measures that should be made. This Corona, when associated with the self-restoring insulation of the apparatus, may not necessarily contribute to insulation damage. In contrast, other types of partial discharges are localized di
6、electric breakdowns of a section in an insulation path where the discharges occur in voids, cracks, or interfaces of solid and/or solid/gas dielectrics. These localized discharges are undesirable because of the possible deterioration of that insulation with the formation of ionized gas due to this b
7、reakdown that may accumulate at or in a critical stress region. This generally involves non-self-restoring insulation that may be subject to permanent damage. Partial discharge measurements may be made on the basis of the resultant momentary change in the voltage at the terminals of the device. Such
8、 a change may be expressed as a voltage change (RIV in microvolts) or by calibration as an apparent charge. When injected between the terminals of the device, this apparent charge, measured in picocoulombs (pC), would cause the same voltage change as that resulting from the partial discharge. The in
9、itial efforts at measuring partial discharge levels on apparatus to provide acceptance criteria between user and manufacturer utilized NEMA 107-1987, Methods of Measurement of Radio Influence Voltage (RIV) of High-Voltage Apparatus. However, it has been determined that this narrow frequency band mea
10、suring system has limitations and that measuring partial discharges in terms of apparent charge has many advantages over that of the RIV approach. These advantages include the following: a) The internal and stray capacitance of differing switchgear and/or components is accounted for by the calibrati
11、on procedure. Thus, the measured value is related to the partial discharge level. b) The partial discharge measurements are, in most cases, not affected by local radio broadcast signals. It should be noted that apparent charge measurements may be made on either a wide-band or narrow-band basis. Part
12、ial discharge measurement is recognized as a helpful mean to ascertain the insulation quality. Most IEEE standards developed by the Recloser and Other Distribution Equipment subcommittee (RODE) of the IEEE Switchgear Committee now specify partial discharge measurement as a design (type) test and pro
13、duction (routine) test on equipment that use a non self-restoring dielectric as the primary insulation. This standard is intended to supersede the IEEE Std 1291-1993, IEEE Guide for Partial Discharge Measurement in Power Switchgear. This standard adopts the IEC 60270:2000 as the base document and fo
14、rms main part of this standard. Specific IEEE requirements for switchgear are contained in normative Annex I. Other useful data on pattern recognition is given in informative Annex J. Informative Annex K contains a bibliography. v Copyright 2009 IEEE. All rights reserved. Notice to users Laws and re
15、gulations Users of these documents should consult all applicable laws and regulations. Compliance with the provisions of this standard does not imply compliance to any applicable regulatory requirements. Implementers of the standard are responsible for observing or referring to the applicable regula
16、tory requirements. IEEE does not, by the publication of its standards, intend to urge action that is not in compliance with applicable laws, and these documents may not be construed as doing so. Copyrights This document is copyrighted by the IEEE. It is made available for a wide variety of both publ
17、ic and private uses. These include both use, by reference, in laws and regulations, and use in private self-regulation, standardization, and the promotion of engineering practices and methods. By making this document available for use and adoption by public authorities and private users, the IEEE do
18、es not waive any rights in copyright to this document. Updating of IEEE documents Users of IEEE standards should be aware that these documents may be superseded at any time by the issuance of new editions or may be amended from time to time through the issuance of amendments, corrigenda, or errata.
19、An official IEEE document at any point in time consists of the current edition of the document together with any amendments, corrigenda, or errata then in effect. In order to determine whether a given document is the current edition and whether it has been amended through the issuance of amendments,
20、 corrigenda, or errata, visit the IEEE Standards Association website at http:/ieeexplore.ieee.org/xpl/standards.jsp, or contact the IEEE at the address listed previously. For more information about the IEEE Standards Association or the IEEE standards development process, visit the IEEE-SA website at
21、 http:/standards.ieee.org. Errata Errata, if any, for this and all other standards can be accessed at the following URL: http:/standards.ieee.org/reading/ieee/updates/errata/index.html. Users are encouraged to check this URL for errata periodically. Interpretations Current interpretations can be acc
22、essed at the following URL: http:/standards.ieee.org/reading/ieee/interp/ index.html. vi Copyright 2009 IEEE. All rights reserved. Patents Attention is called to the possibility that implementation of this standard may require use of subject matter covered by patent rights. By publication of this st
23、andard, no position is taken with respect to the existence or validity of any patent rights in connection therewith. The IEEE is not responsible for identifying Essential Patent Claims for which a license may be required, for conducting inquiries into the legal validity or scope of Patents Claims or
24、 determining whether any licensing terms or conditions provided in connection with submission of a Letter of Assurance, if any, or in any licensing agreements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, a
25、nd the risk of infringement of such rights, is entirely their own responsibility. Further information may be obtained from the IEEE Standards Association. Participants At the time this standard was submitted to the IEEE-SA Standards Board for approval, the Administrative Subcommittee Working Group C
26、37.301 Working Group had the following membership: Marcel Fortin, Chair Franois Soulard, Vice Chair J. G. Angelis. Frank P. DeCesaro Lawrence B. Farr Edward M. Jankowich T. W. Olsen Miklos J. Orosz Donald M. Parker Gerard Schoonenberg James E. Smith Brian T. Steinbrecher Tom Tobin The following memb
27、ers of the individual balloting committee voted on this standard. Balloters may have voted for approval, disapproval, or abstention. Stan Arnot Ali Al Awazi Steven Bezner Thomas Bishop Harvey Bowles Steven Brockschink Ted Burse Eldridge Byron Bill Chiu Tommy Cooper Frank P. DeCesaro Gary L. Donner L
28、ouis Doucet Dana Dufield Donald Dunn Douglas J. Edwards Gary Engmann Paul Forquer Marcel Fortin Edwin Goodwin Randall Groves Bal K. Gupta Ronald Hartzel Wolfgang Haverkamp Steven Hensley Gary Heuston Scott Hietpas Werner Hoelzl R. Jackson Edward M. Jankowich James Jones Joseph L. Koepfinger Jim Kulc
29、hisky Saumen Kundu Chung-Yiu Lam Benjamin Lanz John Leach Maurice Linker R. Long G. Luri Frank Mayle William McDermid Gary Michel Georges Montillet Charles Morse Jeffrey Nelson Michael S. Newman Joe Nims George Nourse T. W. Olsen Miklos J. Orosz Ulrich Pohl Iulian Profir Anthony Ricciuti Johannes Ri
30、ckmann Michael Roberts Thomas Rozek Bartien Sayogo Devki Sharma James E. Smith James Smith Jerry Smith Franois Soulard David Stone Michael Swearingen S. Thamilarasan Tom Tobin John Vergis Waldemar Von Miller Loren Wagenaar John Webb Hugh Zhu Sandeep Zope vii Copyright 2009 IEEE. All rights reserved.
31、 When the IEEE-SA Standards Board approved this standard on 30 January 2009, it had the following membership: Robert M. Grow, Chair Thomas Prevost, Vice Chair Steve M. Mills, Past Chair Judith Gorman, Secretary Victor Berman Richard DeBlasio Andy Drozd Mark Epstein Alexander Gelman William Goldbach
32、Arnie Greenspan Ken Hanus Jim Hughes Richard Hulett Young Kyun Kim Joseph L. Koepfinger* John Kulick David J. Law Glenn Parsons Ron Petersen Chuck Powers Narayanan Ramachandran Jon Walter Rosdahl Anne-Marie Sahazizian Malcolm Thaden Howard Wolfman Don Wright *Member Emeritus Also included are the fo
33、llowing nonvoting IEEE-SA Standards Board liaisons: Satish K. Aggarwal, NRC Representative Michael Janezic, NIST Representative Lisa Perry IEEE Standards Project Editor Matthew J. Ceglia IEEE Standards Program Manager, Technical Program Development viii Copyright 2009 IEEE. All rights reserved. Cont
34、ents of IEEE Adoption of IEC 60270:2000 IEC 60270:2000 . 1 Annex H (informative) Other reference standard and symbols 52 Annex I (normative) Testing procedures 53 I.1 Introduction 53 I.2 Conditioning of the test object . 53 I.3 Test procedure 53 Annex J (informative) PD pattern recognition . 55 J.1
35、Introduction 55 J.2 Noises . 55 J.3 Pattern recognition . 59 Annex K (informative) IEEE bibliography 62 IEEE Standard for High-Voltage Switchgear (Above 1000 V) Test TechniquesPartial Discharge Measurements IMPORTANT NOTICE: This standard is not intended to ensure safety, security, health, or enviro
36、nmental protection in all circumstances. Implementers of the standard are responsible for determining appropriate safety, security, environmental, and health practices or regulatory requirements. This IEEE document is made available for use subject to important notices and legal disclaimers. These n
37、otices and disclaimers appear in all publications containing this document and may be found under the heading “Important Notice” or “Important Notices and Disclaimers Concerning IEEE Documents.” They can also be obtained on request from IEEE or viewed at http:/standards.ieee.org/IPR/disclaimers.html
38、. NORME INTERNATIONALECEIIECINTERNATIONAL STANDARD 60270Troisime ditionThird edition2000-12Techniques des essais haute tension Mesures des dcharges partielles High-voltage test techniques Partial discharge measurements Numro de rfrence Reference number CEI/IEC 60270:2000 Numrotation des publications
39、 Depuis le 1er janvier 1997, les publications de la CEI sont numrotes partir de 60000. Ainsi, la CEI 34-1 devient la CEI 60034-1. Editions consolides Les versions consolides de certaines publications de la CEI incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et
40、1.2 indiquent respectivement la publication de base, la publication de base incorporant lamendement 1, et la publication de base incorporant les amendements 1 et 2. Informations supplmentaires sur les publications de la CEI Le contenu technique des publications de la CEI est constamment revu par la
41、CEI afin quil reflte ltat actuel de la technique. Des renseignements relatifs cette publication, y compris sa validit, sont dispo-nibles dans le Catalogue des publications de la CEI (voir ci-dessous) en plus des nouvelles ditions, amendements et corrigenda. Des informations sur les sujets ltude et l
42、avancement des travaux entrepris par le comit dtudes qui a labor cette publication, ainsi que la liste des publications parues, sont galement disponibles par lintermdiaire de: Site web de la CEI (www.iec.ch) Catalogue des publications de la CEI Le catalogue en ligne sur le site web de la CEI (www.ie
43、c.ch/catlg-f.htm) vous permet de faire des recherches en utilisant de nombreux critres, comprenant des recherches textuelles, par comit dtudes ou date de publication. Des informations en ligne sont galement disponibles sur les nouvelles publications, les publications rempla-ces ou retires, ainsi que
44、 sur les corrigenda. IEC Just Published Ce rsum des dernires publications parues (www.iec.ch/JP.htm) est aussi disponible par courrier lectronique. Veuillez prendre contact avec le Service client (voir ci-dessous) pour plus dinformations. Service clients Si vous avez des questions au sujet de cette
45、publication ou avez besoin de renseignements supplmentaires, prenez contact avec le Service clients: Email: custserviec.ch Tl: +41 22 919 02 11 Fax: +41 22 919 03 00 Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC
46、34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incor
47、porating amendments 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, including its validity, is available in the I
48、EC Catalogue of publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is also availab
49、le from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/catlg-e.htm) enables you to search by a variety of criteria including text searches, technical committees and date of publication. On-line information is also available on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/JP.htm) is also available by emai
