1、 IEEE Standard for Pad-Mounted EquipmentEnclosure Integrity Sponsored by the Transformers Committee and the Switchgear Committee IEEE 3 Park Avenue New York, NY 10016-5997 USA IEEE Power and Energy Society IEEE Std C57.12.28-2014 (Revision of IEEE Std C57.12.28-2005) IEEE Std C57.12.28-2014 (Revisio
2、n of IEEE Std C57.12.28-2005) IEEE Standard for Pad-Mounted EquipmentEnclosure Integrity Sponsor Transformers Committee and the Switchgear Committee of the IEEE Power and Energy Society Approved 16 May 2014 IEEE-SA Standards Board Abstract: Conformance tests and requirements for the integrity of abo
3、ve grade pad-mounted enclosures that contain apparatus energized in excess of 600 volts and that may be exposed to the public including, but not limited to, the following types of equipment enclosures: pad-mounted capacitors or inductors, pad-mounted distribution transformers, pad-mounted junction e
4、nclosures, pad-mounted metering equipment, pad-mounted switchgear, and pad-mounted voltage regulators are covered. Keywords: enclosure integrity, IEEE C57.12.28, pad-mounted equipment, transformers, switches The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 1001
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34、pyright 2014 IEEE. All rights reserved. vi Participants At the time this IEEE standard was completed, the Enclosure Integrity Working Group had the following membership: Robert Olen, Chair Daniel Mulkey, Vice Chair Timothy Albers Kahveh Atef Adam Bromley Darren Brown Paul Buchanan Thomas Callsen Pau
35、l Chisholm Charles Drexler Michael Faulkenberry James Gardner Carlos Gaytan Ali Ghafourian Gael Kennedy Gary King Brian Klaponski Michael Miller Jerry Murphy Justin Pezzin Martin Rave Juan Saldivar Stephen Shull Charles Simmons Ronald Stahara Christopher Sullivan Giuseppe Termini Alan Traut Donnie T
36、rivitt Joshua Verdell Alan Wilks William Wimmer The Enclosure Integrity Working Group gratefully acknowledges the contributions of the following additional participants in the revision: Michael Hardin Thomas Holifield Kent Miller Charles Morgan Edward Smith The following members of the individual/en
37、tity balloting committee voted on this standard. Balloters may have voted for approval, disapproval, or abstention. Samuel Aguirre Steven Alexanderson Chris Ambrose I. Antweiler Charles Ball Peter Balma Barry Beaster David Beseda Steven Bezner Wallace Binder Thomas Blackburn Harvey Bowles Adam Broml
38、ey Darren Brown Paul Buchanan Ted Burse Carl Bush William Byrd Thomas Callsen Paul Cardinal Suresh Channarasappa Paul Chisholm Glenn Davis Gary Donner Randall Dotson Charles Drexler Edgar Dullni Michael Faulkenberry Rabiz Foda Paul Forquer Bruce Forsyth Marcel Fortin Derek Foster Fredric Friend Carl
39、os Gaytan Frank Gerleve Ali Ghafourian Jalal Gohari Randall Groves Ajit Gwal Said Hachichi David Harris Jeffrey Helzer Gary Heuston Philip Hopkinson Edward Jankowich Alan Jensen Andrew Jones Gael Kennedy Sheldon Kennedy Gary King Joseph L. Koepfinger Jim Kulchisky Chung-Yiu Lam John Leach Lee Matthe
40、ws Charles Morgan Daniel Mulkey Jerry Murphy Ali Naderian Jahromi K. R. M. Nair Michael Newman Joe Nims Robert Olen Ted Olsen Tim Olson Lorraine Padden Dwight Parkinson Bansi Patel Dhiru Patel Wesley Patterson Justin Pezzin Donald Platts Alvaro Portillo Iulian Profir Larry Putman Martin Rave Grant R
41、ingham Michael Roberts John Rossetti Marnie Roussell Daniel Sauer Bartien Sayogo Devki Sharma Copyright 2014 IEEE. All rights reserved. vii Stephen Shull Charles Simmons James Smith Jerry Smith Steve Snyder Ronald Stahara Gary Stoedter John Sullivan James Swank Michael Swearingen David Tepen Giusepp
42、e Termini Alan Traut Donnie Trivitt John Vergis Jane Verner William Walter Shelby Walters Alan Wilks William Wimmer When the IEEE-SA Standards Board approved this standard on 16 May 2014, it had the following membership: John Kulick, Chair Jon Walter Rosdahl, Vice-chair Richard H. Hulett, Past Chair
43、 Konstantinos Karachalios, Secretary Peter Balma Farooq Bari Ted Burse Clint Chaplain Stephen Dukes Jean-Phillippe Faure Gary Hoffman Michael Janezic Jeffrey Katz Joseph L. Koepfinger* David Law Hung Ling Oleg Logvinov Ted Olsen Glenn Parsons Ron Peterson Adrian Stephens Peter Sutherland Yatin Trive
44、di Phil Winston Don Wright Yu Yuan *Member Emeritus Also included are the following nonvoting IEEE-SA Standards Board liaisons: Richard DeBlasio, DOE Representative Michael Janezic, NIST Representative Michelle Turner IEEE-SA Content Publishing Erin Spiewak IEEE-SA Standards Technical Community Copy
45、right 2014 IEEE. All rights reserved. viii Introduction This introduction is not part of IEEE Std C57.12.28-2014, IEEE Standard for Pad-Mounted EquipmentEnclosure Integrity. The IEEE Standards Committee on Transformers, Regulators, and Reactors, IEEE C57, formerly developed and correlated standards
46、on these products, together with the IEEE Standards Committee on Power Switchgear, IEEE C37. The data used in this work have been gathered from many sources, including the standards of the Institute of Electrical and Electronics Engineers and the National Electrical Manufacturers Association, report
47、s of committees of the Edison Electric Institute, and others. This IEEE standard is a voluntary consensus standard. Its use becomes mandatory only when required by a duly constituted legal authority or when specified in a contractual relationship. To meet specialized needs and to allow innovation, s
48、pecific changes are permissible when mutually determined by the user and the producer, provided such changes do not violate existing laws and are considered technically adequate for the function intended. This standard was originally prepared by the Joint IEEE C57/IEEE C37 Working Group on Enclosure
49、s with Joseph Martin and then Robert C. Olen as chairman. This group is now the Enclosure Integrity Working Group of the IEEE Transformers Committee. Copyright 2014 IEEE. All rights reserved. ix Contents 1. Overview 1 1.1 Scope . 1 1.2 Purpose 1 2. Normative references 2 3. Definitions 2 4. Enclosure security 4 4.1 Test requirements 4 4.2 Test equipment 6 4.3 Resistance to foreign objects . 8 4.4 Test values . 9 5. Enclosure design and coating system requirements . 10 5.1 Enclosure design requirementsobjective 10 5.2 Substrate requirements. 10 5.3 Coating system requi
