HD 423 2 2 S1-1988 Test Code for the Determination of Airborne Acoustical Noise Emitted by Household and Similar Electrical Appliances- Part 2 Particular Requir.pdf

相关资源

IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf

IRS 70712-2018 Rail defects.pdf

IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf

IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf

IESNA TM-23-2017 Lighting Control Protocols.pdf

IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf

ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf

ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf

ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf

ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf

猜你喜欢

IEC 62047-10-2011 Semiconductor devices - Micro-electromechanical devices - Part 10 Micro-pillar compression test for MEMS materials《半导体器件.微电子机械器件.第10部分 MEMES材料微极压缩测试》.pdf

IEC 62047-14-2012 Semiconductor devices - Microelectromechanical devices - Part 14 Forming limit measuring method of metallic film materials《半导体装置.微电机装置.第14部分 金属薄膜材料的成型极限测量方法》.pdf

IEC 62047-15-2015 Semiconductor devices - Micro-electromechanical devices - Part 15 Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 第15部分 PDMS和玻璃之间粘结强度的试验方法》.pdf

IEC 62047-17-2015 Semiconductor devices - Micro-electromechanical devices - Part 17 Bulge test method for measuring mechanical properties of thin films《半导体器件 微型机电装置 第17部分 测量薄膜机械性能的膨胀试验方法》.pdf

IEC 62047-18-2013 Semiconductor devices - Micro-electromechanical devices - Part 18 Bend testing methods of thin film materials《半导体器件.微型机电器件.第18部分 薄膜材料的弯曲测试方法》.pdf

IEC 62047-19-2013 Semiconductor devices - Micro-electromechanical devices - Part 19 Electronic compasses《半导体器件.微型机电装置.第19部分 电子罗盘》.pdf

IEC 62047-2-2006 Semiconductor devices - Micro-electromechanical devices - Part 2 Tensile testing method of thin film materials《半导体装置.微型机电装置.第2部分 薄膜材料的拉伸试验方法》.pdf

IEC 62047-20-2014 Semiconductor devices - Micro-electromechanical devices - Part 20 Gyroscopes《半导体器件 微型机电装置 第20部分 陀螺仪》.pdf

IEC 62047-21-2014 Semiconductor devices - Micro-electromechanical devices - Part 21 Test method for Poisson's ratio of thin film MEMS materials《半导体器件 微型机电装置 第21部分 薄膜MEMS材料泊松比试验方法》.pdf