1、I=-$ MIL-B-55366( EL) 3 August 1972 Pl1 LI TARY SPEC I FI CATI ON BEACON SET, RADIO AN/TRN-30( ) (UNITS OF) 1. SCOPE 1.1 This specification covers the fol lowing units of one type of radio beacon set which operates on frequencies in the ranges of 200 to 535 kHz and 1605 to 1750 ktiz and is designate
2、d as Beacon Set, Radio AN/ TRN-30( ) (See 6.1 and 6.5). Transmitter, Radio T-1199 ( )/TRN-30 Ampl ifier-Coupler AM-641 7( )/TRN-30 Antenna AS-2633( )/TRN-30 Antenna AS-2634( )/TRN-30 Case, Transmitter CY-7142( )/TRN-30 Case, Ampl i fier-Coupl er GY -71 43( )/TRN-30 2. APPLICABLE DOCUMENTS 2.1 The fo
3、llowing documents of the issue in effect on date of in- vitation for bids, or request for proposal, form a part of this specifi- cation to the extent specified herein: SPECIFICATIONS: FEDERAL PPP-B-585 Box, Wood, Wi rebound PPP-B-601 Box, Wood Cleated-plywood PPP-B-621 PPP-F-320 PPP-T-76 QQ-S-781 Bo
4、x, Wood, Nailed A and Lock-corner Fi berboard, corrugated and Sol id Sheet Stock (Container Grade), and Cut Shapes Tape, Pressure-sensi tive Adhesive paper, Water Resi stant, (For Carton Seal i ng) Steel Strapping ; F1 at MI LI TARY MIL-P-116 Preservation , Methods of MIL-T-713 Twine, Impregnated La
5、cing and Typing MIL-M-13231 Marking of Electronic Items MIL-F-14072 Finishes for Ground Signal Equipment MIL-S-19500 for MIL-P-55110 Printed Wiring Boards Semi conductor Devi ce, General Speci f i cati on FSC 5825 THIS DOCUMENT CONBABNS PAGES. Copyright Communications - Electronics Command Provided
6、by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MI L-B-55366 (EL) STANDARDS MI L I TARY MI L-STD-105 MIL-STD-129 MI L-STD-252 MIL-STD-454 MI L-STD-461 MI L-STD-462 MI L-STD-669 MI L-STD-781 MIL-STD-810 MI L-STD- 1275 DRAWINGS US AECOM
7、Sampl ing Procedures and Tables for Inspection by Attributes tilarking for Shipment and Storage Wired Equipment, Classification of Visual and Mechanical Defects Standard Requirements for Electronic Equipment Electromagnetic Interference Character- istics Requirements for Equipment Electromagnetic In
8、terference Character- is tics, Measurement Of Loading Environment and Related Require- ments for Platform Rigged Airdrop Material Re1 i abi 1 i ty Tests : Exponential Distribution Envi ronmental Test Methods Electrical Circuit, 28 volt DC Transient Characteri s ti cs for Mi 1 i tary Vehi cl es DL-SM
9、-A-550412 Transmitter, Radio T-l199( )/TRN-30 DL-SM-A-550749 Ampl ifier-Coupler AM-6417( )/TRN-30 DL-SM-A-551037 Antenna AS-2633( )/TRN-30 DL-SM-A-551038 Antenna AS-2634( )/TRN-30 DL-SM-A-550392 Case, Transmitter CY-7142( )/TRN-30 BL-SM-A-550393 SC-A-6 78026 Set, Radio AN/TRN-30( )(Units Of) Case, A
10、mpl ifier-Coupler CY-7143( )/TRN-30 Burn-In/Debuggi ng Requirements for Beacon (Copie of specifications standards drawings and pub1 ications required by suppl iers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the Contracting Offic
11、er) 3 , KEQU I REMENTS 3,l Construction, - Construction shall be in accordance with the DL-SM-Am550412 DL-SM-Am550749 following drawing and data lists: Transmi tter , Radio T-1199 ( )/TRN-30 hpl if i er-Coup1 er AM-641 7 ( )/TRN-30 2 Copyright Communications - Electronics Command Provided by IHS und
12、er license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-B-55366 (EL) Antenna AS-2633 /TW-SO Antenna AS-2634 Il /TRN-30 Case, Amp1 if i er-Coup1 er CY-7143 ( )/TRN-30 Il-SM-A-551037 DL-SM-A-551038 DL-SM-A-550392 Case, Transmitter CY-7142( )/TRN-30 DL
13、 -SM- A- 550 39 3 3.2 Preproduction samples. - The contractor shall furnish the speci- fied number of DreDroduction samples on order for apwoval, if required by the invitation for bids and contract. (See 4.3 and 6.2) 3.3 Cleaning. - 3.3.1 Parts. - After fabrication, parts shall be cleaned in accord-
14、 ance with goohcamnercial practice, or as specified in an applicable document. Cleaning processes shall have no deleterious effect . Post cleaning assembly processes shall minimize handling by bare hands to prevent contamination by fungus nutrients. Corrosive material shall be removed completely bef
15、ore the parts are mounted on chassis, panels, and other parts. 3.3.2 Units. - After assembly, units shall be cleaned thoroughly and shall b-e from particles of solder, flux, and other foreign material. I In addition, when necessary, such cleaning shall also be performed before final assembly of the
16、units. binding omundue restriction. Controls shall not be assembled in a misaligned condi tion. 3.5 Finish, protective (See 4.4). - Theanits shall be given pro- tective fjnish in accordance with Specification MIL-F-14072 and the equipment drawings. This includes finish of hardware, such as handles,
17、hinges , screws , etc. and necessary touch-up after mounting. The final paint film on Type 1 surfaces shall be Film M in accordance with MIL-F- 14072. 3.4 Controls. - All movable controls shall operate properly with,out 3.6 Securing of parts. - 3.6.1 General. - Brackets. lugs, inserts, bolts, and ot
18、her mounting arrangement= retain items securely when subjected to specified service conditions . 3.6.2 Securing of parts by threaded fasteners. - Nylok or other screws and nuts with Plastic devices and Loctite or similar sealants shall not be subjected to temperatures in excess of 25OOF (as during b
19、aking of paint). with the manufacturers instructions. Loctite or similar sealants shall be applied in accordance 3 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-Bu55366 (EL)
20、 3.7 Marking (See 4,4), - 3,7,1 General - Marking shall conform to Specification MIL-M-13231 . Front panelmarking shall be engraved in accordance with Group 1 of the specif i ca tion . 3,7,2 Visibilit . - Wherever practicable, parts shall be so mounted that their 4 en cation markings will be readily
21、 visible with minimum dissasmbly of the unit(s), are being procured on this contract shall be serial numbered. 3.7.3 Serial numbers, - The unit(s) listed in paragraph 1.1 which 3.8 Soldering. - 3,8.1 Solderin , - Soldering shall conform to Requirement 5 of MIL- 3.8.2 Rosin-base residues. - Flux resi
22、dues shall be removed by apply- ing organic solvents . Mechanical means such as agitation, brushing, etc. # may be used in conjunction with the solvents, The cleaning solvents and methods used shall not have any deleterious effect on the parts, mater- ials # and assemblies being cleaned. resulting f
23、mufficient heating. The solder shall feather out to a thin edge, indicating proper flowing and wetting actions, and shall not be crystal ired, overheated, or underheated, The minimum necessary amount of flux and solder shall be used for electrical connections, Any means employed to remave an unavoid
24、able excess of flux shall not incur the risk of loose particles of flux, brush bristles, or other foreign mater- ial remaining in the unit(s); flux being spread over a larger area; or damage to the unit. Insulation material that has been subjected to heatlng during the soldering operation shall be u
25、ndamaged and parts fastened thereto shall not have become loosened, STD-454 and 7i-3 t e equ pment drawings. 3.8,3 Process. - There shall be no sharp points or rough surfaces 3,9 Wiring, cabling, bonds and grounds. - 39.1 Cablin - Insulated wires shall be formed into cables except where operat 7-7 o
26、n o the unit(s) would be adversely affected thereby or cables would be excessive 7 y large and would interfere with operation or where it is physically i racticable as in the case where the resulting maintenance, The cabling of wires shalt be effected by tape or twine conforming to Specification MIL
27、-f-713, Individual conductors thus secured shall lie essentially parallel; however, this does not prohibit the use of twisted pairs, 4 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-
28、,-,-14IL-B-55366( EL) 3.9.2 Slack. - Wires and cables shall be as short as practical except that sufficientslack shall be provided for the following purposes: a. To prevent undue stress on cable forms, wires, and connections, b. To enable parts to be removed and replaced during servicing To provide
29、for at least two replacements of the part to which including connections to resiliently supported parts. without disconnecting other parts. the wire or cable is connected, except where uninsulated wires are used. as to avoid contact, under specified service conditions, with rough or irregular surfac
30、es or sharp edges. 3.9.4 Support, - Wire and cable shall be properly supported and secured to prevent undue stress on the conductors and terminals and undue change in osition of the wire or cable (1) durin and after subjection of of the unit(s) in a normal manner. c. 3.9.3 Protection. - Mires and ca
31、bles shall be so placed and protected the unit(s P to specified service conditions or (2 after service or repair 3.9.5 Clearance. - Clearance between solder connections or bare con- ductors, on terminal boards, relays, or other parts, shall be such that no accidental contact can occur between adjace
32、nt connections when subjected to specified service conditions. 3.9.6 Splicing. - Wires in a continuous run between two terminals shall not be spliced during the wiring operation. 3.9.7 Connections, general, - Before being soldered to terminal lugs or fixed terminals, wires shall be mechanically secu
33、red so that the connec- tions are not dependent for strength on solder alone. Where practicable, wires soldered to fixed terminals shall be looped at least one-half turn but not more than three-quarters turn around the terminal before soldering. Bared ends of wire leads to be terminated in solder-ty
34、pe terminal lugs shall be tinned, silver plated, or lead-alloy coated. No varnish, lacquer, inspection paint, or other coating shall be applied to completed electrical connections. I 3.9.8 Bonds and grounds. - Mating surfaces requiring RF gaskets and internal grounds and bonds required to reduce cur
35、rent path return, RF potentials and shock hazards shall be free of anodic film, non-conductive grease, paint or lacquer. 3.10 Semiconductors (transistors Securing of parts 3*6 Sol deri ng 3,8 Wiring, cab1 i ng , bonds and grounds 3,9 Tropicalization of materials 3.11 4, SUALITY ASSURANCE PROVISIONS
36、4,l Responsibility for inspection, - Unless otherwise specified in the contract or purchase order, the supplier is responsible for the perfomnee of all inspection requirements as specified herein, Except as otherwise specified in the contract or order, the supplier ay use his onn or any other facili
37、ties suitable for the performance of the inspection requirements specified herein, unless disapproved by the 6overnment, The Government reserves the right to perforar any of the inspections set forth in the speci- fication where such inspections are deemed necessary to assure that supplies and servi
38、 ces conform to prescribed requirements , 4,2 Classification of inspection, Inspection shall be classified as fol1ows: a, Preproduction inspection (does not include preparation for b. Inspection covered by subsidiary documents (See 4.4) c, Quality Conformance inspection: delivery), (See 4,3) (1) Qua
39、lity conformance inspection of quipaient before prepara- tion for delivery. (See 4.5) (2) Quality confomnce inspection of preparation for delivery (See 4,15 and 4,16), 14 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking
40、 permitted without license from IHS-,-,-MIL-B-55366 (EL) 4.3 Preproduction inspection. - This insnection will be performed by the Government unless otherwise specified in the contract. It shall con- sist of the inspection specified in the subsidiary documents covering the items listed in 4.4 and the
41、 inspection specified for Group A, Group 6, and Group C (See Tables I, II and III respectively). The preproduction inspection will normally be performed in this order: Sample 1 : ity; (5) Salt Fog; Search; (4) Shock-Bench Handling; Sample 3: (1) Fungus; Sample 4: (4) Air delivery; (5) Immersion; oth
42、er preproduction inspections may precede, fol 1 ow or be interspersed between the forego! ng . samples see 4.5.4.1.4. (1) High Temperature; (2) Low Temperature; (3) Rain; (4) Humid- (1) EMC; (2) Shock-Drop; (3) Bounce (loose cargo); Sample 2: (1) Altitude; (2) Dust; (3) Resonance For rei i abi 1 i t
43、y 4.4 Inspection covered by subsidiary documents. - The following shall be inspected under the applicable subsidiary documents as part of the in- spection before preparation for delivery: - I tem Where Required Finish, Protective 3.5 Marking 3.7 Semiconductors (Transistors & Diodes) 3.10 4.5 Quality
44、 conformance inspection of equipment before preparation for deliver - Each unit of each lot of equipment shall be subjected to burn- TnTaebugging (See 3.16) prior to conformance inspection. The contractor shall perform the inspection specified in 4.4 and 4.5.1 through 4.5.6. does not relieve the con
45、tractor of his responsibility for performing any additional inspection which is necessary to control the quality of the pro- duct and to assure compliance with all specification requirements. Failure to meet any requirement as a result of burn-in/debugging shall be classified as a defect and recorde
46、d as such, The Government will review and evaluate the contractors inspection procedures and examine the contractors inspec- tion records. In addition the Government - at its discretion - may perform all or any part of the specified inspection. to verify the con- tractors compliance with specified r
47、equirement. (See 6.6) Test equipmnet for Government verification inspection shall be made available by the con tractor. This 15 Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL
48、=BI55366( EL) 4,5.1 Group A inspection. - Each unit of each lot of equipment shall be inspected for conformance to all the inspection and test requirement of Table I, Each lot will be subject to verification utilizing the procedures of MIL-STD-105 using the general inspection levels and the AQLs ind
49、icated in Table I. Group A inspection shall be performed in any order which is satisfactory to the Government, except that the operational inspection 4.14 shall be last (See 6,4). TABLE I GROUP A INSPECTION Mi nor AQL % % Inspect i on Req. Para Insp. Para Major Visual & Mechanical 3.20 4.12 Modules (Pluck Out): VCO Circuit Card Phase Detector Circuit Card Fixed Divider Circuit Card Control Divider Circuit Card Lockout Logic Circuit Card Encoder #2 Cir
