1、Designation: B 32 08Standard Specification forSolder Metal1This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the yea
2、r of last reapproval.Asuperscriptepsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This specification covers solder metal alloys (commonlyknown as soft solders) used in non-elec
3、tronic applications,including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the pur-pose of joining together two or more metals at temperaturesbelow their melting points. Electro
4、nic grade solder alloys andfluxed and non-fluxed solid solders for electronic solderingapplications are not covered by this specification as they areunder the auspices of IPC Association Connecting ElectronicIndustries.1.1.1 These solders include those alloys having a liquidustemperature not exceedi
5、ng 800F (430C).1.1.2 This specification includes solders in the form of solidbars, ingots, powder and special forms, and in the form of solidand flux-core ribbon, wire, and solder paste.1.2 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are mathe
6、maticalconversions to SI units that are provided for information onlyand are not considered standard.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to become familiarwith all hazards inclu
7、ding those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine the applicability ofregulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D
8、269 Test Method for Insoluble Matter in Rosin and RosinDerivativesD 464 Test Methods for Saponification Number of NavalStore Products Including Tall Oil and Other RelatedProductsD 465 Test Methods for Acid Number of Naval StoresProducts Including Tall Oil and Other Related ProductsD 509 Test Methods
9、 of Sampling and Grading RosinE28 Test Methods for Softening Point of Resins Derivedfrom Naval Stores by Ring-and-Ball ApparatusE29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE46 Test Methods for Chemical Analysis of Lead- andTin-Base Solder3E51 Met
10、hod for Spectrographic Analysis of Tin Alloys bythe Powder Technique3E55 Practice for Sampling Wrought Nonferrous Metals andAlloys for Determination of Chemical CompositionE87 Methods for Chemical Analysis of Lead, Tin, Anti-mony, and Their Alloys (Photometric Method)3E88 Practice for Sampling Nonfe
11、rrous Metals and Alloysin Cast Form for Determination of Chemical Composition2.2 Federal Standard:4Fed. Std. No. 123 Marking for Shipment (Civil Agencies)2.3 Military Standard:5MIL-STD-129 Marking for Shipment and Storage3. Terminology3.1 Definition:3.1.1 producer, nthe primary manufacturer of the m
12、ate-rial.3.2 Definitions of Terms Specific to This Standard:3.2.1 lot, nThe term “lot” as used in this specification isdefined as follows:3.2.1.1 DiscussionFor solid solder metal, a lot consists ofall solder of the same type designation, produced from thesame batch of raw materials under essentially
13、 the sameconditions, and offered for inspection at one time.1This specification is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.02 on Refined Lead, Tin, Antimony, and Their Alloys.Current edition approved May 1, 2008.
14、 Published May 2008. Originallyapproved in 1919. Last previous edition approved in 2004 as B 32 - 04.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards D
15、ocument Summary page onthe ASTM website.3Withdrawn.4Available from Global Engineering Documents, 15 Inverness Way, EastEnglewood, CO 80112-5704, http:/.5Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:/www.dodssp.dap
16、s.mil.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.3.2.1.2 DiscussionFor fluxcore solder, a lot consists ofall solder of the same core mixture, produced from the samebatch of raw materials under essentially the same conditionsand
17、offered for inspection at one time.3.2.2 lot number, nThe term “lot number” as used in thisspecification refers to an alphanumeric or numerical designa-tion for a lot which is traceable to a date of manufacture.4. Classification4.1 Type DesignationThe type designation uses the fol-lowing symbols to
18、properly identify the material:4.1.1 Alloy CompositionThe composition is identified bya two-letter symbol and a number. The letters typically indicatethe chemical symbol for the critical element in the solder andthe number indicates the nominal percentage, by weight, of thecritical element in the so
19、lder. The designation followed by theletters A or B distinguishes between different alloy grades ofsimilar composition (see Table 1).4.1.2 FormThe form is indicated by a single letter inaccordance with Table 2.4.1.3 Flux TypeThe flux type is indicated by a letter orcombination of letters in accordan
20、ce with Table 3.4.1.4 Core Condition and Flux Percentage (applicable onlyto flux-cored solder)The core condition and flux percentageis identified by a single letter and a number in accordance withTable 4.4.1.5 Powder Mesh Size and Flux Percentage (applicableonly to solder paste)The powder mesh size
21、and flux percent-age is identified by a single letter and a number in accordancewith Table 5.5. Ordering Information5.1 Orders for material under this specification indicate thefollowing information, as required, to adequately describe thedesired material.5.1.1 Type designation (see 4.1),5.1.2 Detai
22、led requirements for special forms,5.1.3 Dimensions of ribbon and wire solder (see 9.2),5.1.4 Unit weight,5.1.5 Packaging (see Section 18),5.1.6 Marking (see Section 17),5.1.7 ASTM specification number and issue, marked on (a)purchase order and (b) package or spool, and5.1.8 Special requirements, as
23、 agreed upon between sup-plier and purchaser.6. Materials and Manufacture6.1 The producer must have each lot of solder metal asuniform in quality as practicable and of satisfactory appearancein accordance with best industrial practices. Each bar, ingot, orother form in which the solder is sold must
24、be uniform incomposition with the entire lot.7. Chemical Composition7.1 Solder AlloyThe solder alloy composition is as speci-fied in Table 1.NOTE 1By mutual agreement between supplier and purchaser, analy-sis may be required and limits established for elements or compounds notspecified in Table 1.7.
25、2 Flux (applicable to flux-core ribbon, wire, and solderpaste):7.2.1 Type RThe flux is composed of Grade WW or WGgum rosin of Test Methods D 509. The rosin shall have atolueneinsoluble matter content of not more than 0.05weight % in accordance with Test Method D 269, a minimumacid number of 160 mg K
26、OH/1 g sample in accordance withTest Methods D 465, a minimum softening point of 70C inaccordance with Test Methods E28, and a minimum saponi-fication number of 166 in accordance with Test MethodsD 464. When solvents or plasticizers are added, they must benonchlorinated.7.2.2 Type RMAThe flux is com
27、posed of rosin conform-ing to 7.2.1. Incorporated additives provide a material meetingthe requirements of 8.1.2 for type RMA. When solvents orplasticizers are added, they must be nonchlorinated.7.2.3 Type RAThe flux is composed of rosin conformingto 7.2.1. Incorporated additives provide a material m
28、eeting therequirements of 8.1.2 for Type RA. When solvents or plasti-cizers are added, they must be nonchlorinated.7.2.4 Type OAThe flux is composed of one or morewater-soluble organic materials.7.2.5 Type OSThe flux is composed of one or morewater-insoluble organic materials, other than Types R, RM
29、A,and RA, which are soluble in organic solvents.7.2.6 Type ISThe flux is composed of one or moreinorganic salts or acids with or without an organic binder andsolvents.8. Physical Properties and Performance Requirements8.1 Solder PasteSolder paste must exhibit smoothness oftexture (no lumps) and the
30、absence of caking and drying.8.1.1 Powder Mesh SizeThe solder powder mesh sizeshall be as specified (see 5.1.1 and 4.1.5) when the extractedsolder powder is tested as specified in 13.4.8.1.2 ViscosityThe viscosity of solder paste and themethod used to determine the viscosity must be agreed uponbetwe
31、en the supplier and purchaser. The following variablesmust be taken into account when relating one viscositymeasurement to another type of viscometer used, spindle sizeand shape, speed (r/min), temperature of sample, and the use ornon-use of a helipath.8.2 Requirements for FluxThe flux must meet the
32、 physi-cal and performance requirements specified in Table 6 asapplicable.8.2.1 Solder PoolWhen solder is tested as specified in13.3.2, there must be no spattering, as indicated by thepresence of flux particles outside the main pool of residue. Theflux must promote spreading of the molten solder ove
33、r thecoupon to form integrally thereon a coat of solder that shallfeather out to a thin edge. The complete edge of the solder poolmust be clearly visible through the flux residue.8.2.2 DrynessWhen solder is tested as specified in 13.3.2,the surface of the residue must be free of tackiness, permittin
34、geasy and complete removal of applied powdered chalk.8.2.3 Chlorides and Bromides TestWhen the extractedflux is tested as specified in 13.3.6, the test paper will show nochlorides or bromides by a color change of the paper tooff-white or yellow white.B32082TABLE1SolderCompositions-wt%(rangeormaximum
35、)Composition,%AMeltingRangeBAlloy GradeSn1Pb2Sb3Ag4Cu5Cd6Al7Bi8As9Fe 10Zn 11Ni 12Ce 13Se 14SolidusLiquidusUNSNumberFCFCSection1:SolderAlloysContainingLessthan0.2%LeadCSn96Rem0.100.123.43.80.080.0050.0050.150.05max0.020.005.430221430221L13965Sn95Rem0.100.124.44.80.080.0050.0050.150.050.020.005.430221
36、473245L13967Sn94Rem0.100.125.45.80.080.0050.0050.150.050.020.005.430221536280L13969Sb594.0min0.204.5-5.50.0150.080.0050.0050.150.050.040.005.450233464240L13950EDRem0.100.050.250.753.05.00.0050.0050.020.050.020.005.440225660349L13935HADRem0.100.54.00.13.00.12.00.0050.0050.150.050.020.54.0.42021644022
37、7L13955HBDRem0.104.06.00.050.52.05.00.0050.0050.150.050.020.010.052.0.460238660349L13952HNDRem0.100.050.050.153.54.50.0050.0050.150.050.020.0050.15-0.25.440225660350L13933PTDRem0.20.254.00.050.500.254.00.0050.0050.150.010.020.0050.0050.01 0.25.430221435224ACDRem0.100.050.20.30.10.30.0050.0052.753.75
38、0.050.020.0050.001.403206453234L13964OADRem0.20.050.050.32.04.00.0050.0050.51.50.050.040.05.420216460238L13937AMRem0.100.81.20.40.62.83.20.0050.0050.150.050.020.005.430220446230L13938TCRem0.200.050.0154.05.00.0050.0050.050.050.040.0050.005.0.04 0.20419215660350L13931WSRem0.101.01.50.20.63.54.50.0050
39、.0050.020.050.020.005.440225660350L13939Section2:SolderAlloysContainingLeadSn7069.571.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183377193L13700Sn6362.563.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183361183L13630Sn6261.562.5Rem0.501.752.250.080.0010.0050.250.030.020.005.354179372189L13620
40、Sn6059.561.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183374190L13600Sn5049.551.5Rem0.500.0150.080.0010.0050.250.0250.020.005.361183421216L55031Sn4544.546.5Rem0.500.0150.080.0010.0050.250.0250.020.005.361183441227L54951Sn40A39.541.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183460238L54916S
41、n40B39.541.5Rem1.82.40.0150.080.0010.0050.250.020.020.005.365185448231L54918Sn35A34.536.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183447247L54851Sn35B34.536.5Rem1.62.00.0150.080.0010.0050.250.020.020.005.365185470243L54852Sn30A29.531.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183491255L54
42、821Sn30B29.531.5Rem1.41.80.0150.080.0010.0050.250.020.020.005.365185482250L54822Sn25A24.526.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183511266L54721Sn25B24.526.5Rem1.11.50.0150.080.0010.0050.250.020.020.005.365185504263L54722Sn20A19.521.5Rem0.500.0150.080.0010.0050.250.020.020.005.36118353127
43、7L54711Sn20B19.521.5Rem0.81.20.0150.080.0010.0050.250.020.020.005.363184517270L54712Sn1514.516.5Rem0.500.0150.080.0010.0050.250.020.020.005.437225554290L54560Sn10A9.011.0Rem0.500.0150.080.0010.0050.250.020.020.005.514268576302L54520Sn10B9.011.0Rem0.201.72.40.080.0010.0050.030.020.020.005.51426857029
44、9L54525Sn54.55.5Rem0.500.0150.080.0010.0050.250.020.020.005.586308594312L54322Sn21.52.5Rem0.500.0150.080.0010.0050.250.020.020.005.601316611322L54210Ag1.50.751.25Rem0.401.31.70.300.0010.0050.250.020.020.005.588309588309L50132Ag2.50.25Rem0.402.32.70.300.0010.0050.250.020.020.005.580304580304L50151Ag5
45、.50.25Rem0.405.06.00.300.0010.0050.250.020.020.005.580304716380L50180AForpurposesofdeterminingconformancetotheselimits,anobservedvalueorcalculatedvalueobtainedfromanalysisshallberoundedtothenearestunitinthelastright-handplaceoffiguresusedinexpressingthespecifiedlimit,inaccordancewiththeroundingmetho
46、dofPracticeE29.BTemperaturesgivenareapproximationsandforinformationonly.CForalloysnotidentified,namedelementsshallconformtothefollowingtolerances(wt%):5%60.5%,=5%60.25%;Impurityelements(maximum):Sn-0.2,Pb-0.2,Sb-0.5,Ag-0.015,Cu-0.08,Cd-0.005,Al-0.05,Bi-0.15,As-0.02,Fe-0.02,Zn-0.005.DGradesEandOAarec
47、overedbyU.S.patentsheldbyEngelhardCorp,Mansfield,MA,andOateyCo.Cleveland,OHrespectively.FederatedFryMetals,Altoona,PAandTaracorpInc.,Atlanta,GAhaveappliedforpatentsongradesACandTCrespectively.GradesHA,HB,andHNarecoveredbypatentsassignedtoJ.W.HarrisCo.,Cincinnati,OH.GradePTiscoveredbyapatentissuedtoP
48、reciseAlloysCorporation,Bronx,NY.InterestedpartiesareinvitedtosubmitinformationregardingidentificationofacceptablealternativestothesepatenteditemstotheCommitteeonStandards,ASTMInternationalHeadquarters,100BarrHarborDrive,WestConshohocken,PA19428.Yourcommentswillreceivecarefulconsiderationatameetingo
49、ftheresponsibletechnicalcommittee1,whichyoumayattend.OAvalueforFe10wascorrectededitorially.B320838.2.4 Copper Mirror TestWhen tested as specified in13.3.7, the extracted flux will have failed the test if, whenexamined against a white background, complete removal of thecopper film is noted, as evidenced by the white backgroundshowing through, and must be rejected. Discoloration of thecopper due to a
