1、Designation: B 907 05Standard Specification forZinc, Tin and Cadmium Base Alloys Used as Solders1This standard is issued under the fixed designation B 907; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision.
2、A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers solder metal alloys (commonlyknown as soft solders), including zinc-aluminum, zinc-aluminum-copper, zinc-
3、tin, zinc-tin-copper, zinc-cadmium-tin,zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver,and cadmium-silver, used as solders for the purpose of joiningtogether two or more metals at temperatures below theirmelting points.1.1.1 Certain alloys specified in this standard are also usedas Thermal
4、 Spray Wire in the electronics industry and arecovered for this purpose in Specification B 943. SpecificationB 833 covers Zinc and Zinc Alloy Wire for Thermal Spraying(Metallizing) used primarily for the corrosion protection ofsteel (as noted in the Annex part of this specification).1.1.2 Tin base a
5、lloys are included in this specificationbecause their use in the electronics industry is different than themajor use of the tin and lead solder compositions specified inSpecification B 32.1.1.3 These solders include alloys having a nominal liqui-dus temperature not exceeding 850F (455C).1.1.4 This s
6、pecification includes solder in the form of solidbars, ingots, wire, powder and special forms, and in the form ofsolder paste.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.3 ToxicityWarning: Soluble and respirab
7、le forms ofcadmium may be harmful to human health and the environmentin certain forms and concentrations. Therefore, ingestion andinhalation of cadmium should be controlled under the appro-priate regulations of the U.S. Occupational Safety and HealthAdministration (OSHA). Cadmium-containing alloys a
8、nd coat-ings should not be used on articles that will contact food orbeverages, or for dental and other equipment that is normallyinserted in the mouth. Similarly, if articles using cadmium-containing alloys or coatings are welded, soldered, brazed,ground, flame-cut, or otherwise heated during fabri
9、cation,adequate ventilation must be provided to maintain occupationalcadmium exposure below the OSHA Permissible ExposureLevel (PEL).1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to becom
10、e familiarwith all hazards including those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine the applicability ofregulatory limitations prior to use.2. Referenced
11、 Documents2.1 ASTM Standards:2B32 Specification for Solder MetalB 833 Specification for Zinc and Zinc Alloy Wire forThermal Spraying (Metallizing)B 899 Terminology Relating to Non-ferrous Metals andAlloysB 943 Specification for Zinc and Tin Alloy Wire Used inThermal Spraying for Electronic Applicati
12、onsE29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE46 Test Methods for Chemical Analysis of Lead andTin-Base Solder3E47 Test Methods for Chemical Analysis of Zinc Die-Casting Alloys3E51 Method for Spectrographic Analysis of Tin Alloys bythe Powder T
13、echnique3E55 Practice for Sampling Wrought Nonferrous Metals andAlloys for Determination of Chemical CompositionE87 Methods for Chemical Analysis of Lead, Tin, Anti-mony, and Their Alloys (Photometry Method)3E88 Practice for Sampling Nonferrous Metals and Alloysin Cast Form for Determination of Chem
14、ical CompositionE 527 Practice for Numbering Metals and Alloys (UNS)E 536 Test Method for Chemical Analysis of Zinc and ZincAlloys1This specification is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.04 on Zinc and Cadm
15、ium.Current edition approved Nov. 1, 2005. Published December 2005. Originallyapproved in 2000. Last previous edition approved in 2004 as B 907 04.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandard
16、s volume information, refer to the standards Document Summary page onthe ASTM website.3Withdrawn.1*A Summary of Changes section appears at the end of this standard.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.2.2 Federal Standard:F
17、ed. Std. No. 123 Marking for Shipment (Civil Agencies)42.3 Military Standard:Mil-Std-129 Marking for Shipment and Storage43. Terminology3.1 Terms shall be defined in accordance with TerminologyB 899.4. Classification4.1 Type DesignationThe type designation uses the fol-lowing symbols to properly ide
18、ntify the material:4.1.1 Alloy CompositionThe composition is identified bya two or four-letter symbol and a number. The letters typicallyindicate the chemical symbol for the critical element in thesolder and the number indicates the nominal percentage, byweight, of the critical element in the solder
19、 (see Table 1).4.1.2 FormThe form is indicated by a single letter inaccordance with Table 2.4.1.3 Powder Mesh Size (applicable only to solder paste)The powder mesh size is identified by a single letter inaccordance with Table 3.5. Ordering Information5.1 Orders for material under this specification
20、indicate thefollowing information, as required, to adequately describe thedesired material.4Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098.TABLE 1 Solder CompositionsTable 1a: Zinc Base AlloysComposition %A,B,CTemperature
21、UNSDCd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFCFCZn 98 Z30402 0.005 REM 0.003 0.005 0.10 0.015 0.005 1.52.5 0.02 0.002 0.02 0.005 0.02 720 382 770 410Zn 97 Z30505 0.005 REM 0.003 0.005 0.10 0.015 0.005 2.53.5 0.02 0.002 0.02 0.005 0.02 720 382 743 395Zn 96E0.005 REM 0.003 0.005 0.10 0.
22、015 0.005 3.54.5 0.02 0.002 0.02 0.005 0.02 720 382 720 382Zn 95 Z30502 0.005 REM 0.003 0.005 0.10 0.015 0.005 4.55.5 0.02 0.002 0.02 0.005 0.02 720 382 720 382Zn 94E0.005 REM 0.003 0.005 0.10 0.015 1.31.5 3.54.5 0.02 0.002 0.02 0.005 0.02 730 388 734 390Zn 90 Z34550 0.004 88.092.0 0.003 0.005 0.10
23、0.015 3.06.0 3.06.0 0.02 0.002 0.100 0.005 0.05 720 382 797 425Zn 87 Z30705 0.005 REM 0.003 0.005 0.10 0.015 0.005 12.513.5 0.02 0.002 0.05 0.005 0.02 720 382 815 435Zn 85 Z30702 0.005 REM 0.003 0.005 0.10 0.015 0.005 14.016.0 0.02 0.002 0.06 0.005 0.02 720 382 842 450Zn 80 Z30800 0.005 REM 0.003 0.
24、005 0.10 0.015 0.005 19.520.5 0.02 0.002 0.08 0.005 0.02 720 382 896 480Zn/Sn 50 Z56900 0.005 REM 49.051.0 0.05 0.10 0.015 0.005 0.100 0.02 0.002 0.02 0.005 0.02 388 198 680 360Zn/Sn 49 Z56930 0.005 REM 47.550.5 0.05 0.10 0.015 0.81.3 0.100 0.02 0.002 0.02 0.005 0.05 392 200 592 311Zn/Sn 27FE33.0 26
25、.028.0 REM 0.05 0.10 0.015 0.05 0.050 0.02 0.020 0.02 0.005 0.05 351 177 500 260Zn/Cd 90FZ50940 REM 89.091.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 738 392Zn/Cd 60FZ50980 REM 59.061.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 648 342Table 1b: Ti
26、n Base AlloysComposition %A,B,CTemperatureUNSECd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFCFCSn/Zn 60 0.005 REM 59.061.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 666 352Sn/Zn 70 0.005 REM 69.071.0 0.005 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 601 3
27、16Sn/Zn 75 0.004 REM 74.076.0 0.20 0.10 0.015 0.05 0.050 0.020 0.020 0.02 0.005 0.05 390 199 572 300Sn/Zn 80 0.005 REM 79.081.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 536 280Sn/Zn 91 0.005 REM 90.092.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 390 199Tabl
28、e 1c: Cadmium Base AlloysComposition %A,B,CTemperatureUNSECd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFCFCCd 60 REM 39.041.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 601 316Cd 70 REM 29.031.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 57
29、2 300Cd 78 REM 11.013.0 0.003 0.05 0.10 4.55.5 0.05 0.100 0.02 0.002 0.02 0.005 0.05 480 249 601 316Cd 83 REM 16.018.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 509 265Cd 95 REM 0.007 0.003 0.05 0.10 4.55.5 0.05 0.100 0.02 0.002 0.02 0.005 0.05 640 338 739 393AFor purposes
30、of acceptance and rejection, the observed value or calculated value obtained from analysis should be rounded to the nearest unit in the last right-handplace of figures, used in expressing the specified limit, in accordance with the rounding procedure prescribed in Practice E29.BAll values not given
31、as a range are maximum values unless stated otherwise.CRemainder (REM) determined arithmetically by difference.DThe USN designations were established in accordance with Practice E 527. The last digit of a UNS number differentiates between alloys of similar composition.EUNS numbers to be added when a
32、ssigned.FThese alloys are listed with the zinc base alloys even though they contain significant amounts of cadmium because their use is similar to those of the other alloysin Table 1A.B9070525.1.1 Type designation (see 4.1),5.1.2 Detailed requirements for special forms,5.1.3 Dimensions of ribbon and
33、 wire solder (see 9.2),5.1.4 Unit weight,5.1.5 Packaging (see Section 18),5.1.6 Marking (see Section 17),5.1.7 ASTM Specification number and issue, marked on (a)purchase order and (b) package or spool, and5.1.8 Special requirements, as agreed upon between sup-plier and purchaser.6. Materials and Man
34、ufacture6.1 The producer shall have each lot of solder metal asuniform in quality as practicable and of satisfactory appearancein accordance with best industrial practices. Each bar, ingot, orother form in which the solder is sold must be uniform incomposition with the entire lot.7. Chemical Composi
35、tion7.1 Solder AlloyThe solder alloy composition is as speci-fied in Table 1.NOTE 1By mutual agreement between supplier and purchaser, analy-sis may be required and limits established for elements or compounds notspecified in Table 4.8. Physical Properties and Performance Requirements8.1 Solder Past
36、eSolder paste must exhibit smoothness oftexture (no lumps) and the absence of caking and drying duringstorage and application. Some applications may require a fastdrying formulation.8.1.1 Powder Mesh SizeThe solder powder mesh sizeshall be as specified (see Section 4.1.3) when the extractedsolder po
37、wder is tested as agreed upon between supplier andpurchaser.8.1.2 ViscosityThe viscosity of solder paste and themethod used to determine the viscosity must be agreed uponbetween the supplier and the purchaser.8.2 The following variables must be taken into accountwhen relating one viscosity measureme
38、nt to another: type ofviscometer used, spindle size and shape, speed (r/min), tem-perature and the recent mixing history of the sample, and theuse or non-use of a helipath.9. Dimensions and Unit Weight9.1 Bar and Ingot SolderThe dimensions and unit weightof bar and ingot solder will be as agreed upo
39、n between supplierand purchaser.9.2 Wire solderThe dimensions and unit weight of wiresolder are specified in 5.13 and 5.14. The tolerance on specifiedoutside diameter shall be 6 5%or6 0.002 in. (0.05 mm),whichever is greater.9.3 Other forms:9.3.1 Dimension for ribbon and special forms will be agreed
40、upon between supplier and purchaser.9.3.2 The unit weight of solder paste is specified in 5.1.4.10. Workmanship, Finish and Appearance10.1 All forms of solder must be processed in such a manneras to be uniform in quality and free of defects that will affectlife, serviceability, or appearance.11. Sam
41、pling11.1 Care must be taken to ensure that the sample selectedfor testing is representative of the material. The method forsampling consists of one of the following methods:11.1.1 Samples taken from the final solidified cast of fabri-cated product.11.1.2 Representative samples obtained from the lot
42、 ofmolten metal during casting. The molten sample is poured intoa cool mold, forming a bar approximately14 in (6.4 mm) thick.11.2 Frequency of SamplingFrequency of sampling fordetermination of chemical composition shall be in accordancewith Table 4. For spools and coils, the sample is obtained bycut
43、ting back 6 ft (1.8 m) of wire from the free end and thentaking the next 6 ft for test. In other forms, an equivalentsample is selected at random from the container.11.3 Other aspects of SamplingOther aspects of samplingconforms in the case of bar and ingots, to Practice E 88. Forfabricated solders
44、the appropriate reference is Practice E 55.12. Specimen Preparation12.1 Solid Ribbon and Wire SolderEach sample of solidribbon and wire solder is prepared in accordance with 12.1 asapplicable.12.2 Bar and Ingot solderEach sample piece is cut in halfand one half marked and held in reserve. The remain
45、ing half ismelted in a clean container, mixed thoroughly and poured intoa cool mold, forming a bar approximately14 in (6.4 mm) thick.Sampling is performed by one of the following methods:12.3 SawingSaw cuts are made across the bar at equalintervals of not more than 1 in (2.5 cm) throughout its lengt
46、h.TABLE 2 FormSymbol FormB BarI IngotP PowderR RibbonS SpecialAW WireAIncludes pellets, preforms, etc.TABLE 3 Powder Mesh SizeSize Symbol Powder Mesh SizeA 325B 200C 100D 60TABLE 4 Frequency of SamplingSize of Lot, lb (kg) Number of Samples (spools, coils,containers or pieces)Up to 1000 (450), incl
47、3Over 1000 to 10,000 (450 to 4500), incl 5Over 10,000 (4500) 10B907053If it is impractical to melt the bar or ingot as specified above,saw cuts are made across each piece at equal intervals of notmore than 1 in (2.5 cm) throughout its length. No lubricants areused during sawing. The specimen consist
48、s of not less than 5 oz(143 g).12.4 DrillingThe bar is drilled at least halfway throughfrom the opposite sides. A drill of about12 in (12.7 mm) indiameter is preferred. In drilling, the holes are placed along adiagonal line from one corner of the ingot to the other. Thedrillings are clipped into pie
49、ces not over12 in (12.7 mm) inlength and mixed thoroughly. The specimen consists of not lessthan 5 oz (143g).13. Test Methods13.1 Visual and Dimensional Examination13.1.1 Ribbon and Wire SolderRibbon and wire soldermust be examined to verify that the dimensions, unit weight,and workmanship are in accordance with the applicable re-quirements.13.1.2 Solder PasteSolder paste must be examined forsmoothness of texture (no lumps), caking, drying, unit weight,and workmanship in accordance with the applicable require-ments.13.1.3 Bar and
