1、Designation: D7447 08 (Reapproved 2014)Standard Practice forSymbolizing Adhesive Applications1This standard is issued under the fixed designation D7447; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A n
2、umber in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice covers a standard symbol that may be usedby the design-engineering community on engineering drawingsto indicate a bonded a
3、ssembly for any type of adhesive.1.2 This design is based on criteria contained in ANSI/AWSA2.4 as well as ISO 15785.1.3 The values given in SI units are to be regarded as thestandard. The values in parentheses are for information only.1.4 This standard does not purport to address all of thesafety c
4、oncerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ANSI/AWS Standard:2ANSI/AWS A2.4 Symbols for Welding
5、 and NondestructiveTesting2.2 ISO Standard:2ISO 15785 Technical DrawingsSymbolic Presentation andIndication of Adhesive, Fold and Pressed Joints3. Significance and Use3.1 An adhesive symbol provides an efficient means ofplacing complete information about adhesives on engineeringdrawings. The joint i
6、s the basis of reference for the symbol towhich the arrow line is pointed. The reference line of thesymbol is used to designate the type of adhesive to be used,including information about its physical form, chemical tech-nology family, requirements for surface preparation, applica-tion method (bead
7、versus roll coat), and cure method. Theoptional tail (shown at left in Fig. 1) provides a place to includeadditional information about the adhesive that is not referencedin other notations.3.2 Refer to Fig. 1 for an overview schematic of theadhesive symbol denoted by a mast supporting a circle with
8、theletter “A” inside for adhesive. Detail behind each of theelements noted (for example, FORM, CHEM, APPL METH)can be found in corresponding tables in Section 5.4. Elements of the Adhesive Symbol4.1 The elements represented in Fig. 1 are explained ingreater detail in Tables 1-5 and Fig. 2.4.2 Fig. 3
9、 illustrates an expanded view of the parametersdetailed in the tables described in Tables 1-5 and Fig. 2.5. References and Other Notations5.1 Symbols With ReferencesWhen specifications,processes, or other references are used with the adhesivesymbol, the notation is placed in the tail (see “T” symbol
10、 inFig. 1 or Fig. 3). This notation may reflect information about aparticular manufacturers product or other pertinent data notcontained in the symbol elements.5.2 Symbols Without ReferencesSymbols may be usedwithout specifications, processes, or other references when:5.2.1 A note appears on the dra
11、wing: “Unless otherwisedesignated, all adhesive bonds are to be made in accordancewith Specification No .”5.2.2 The bonding procedure to be used is described else-where such as in shop instructions and process sheets: “Referto Instruction for bonding procedure.”5.3 Orientation of Bond JointThe horiz
12、ontal orientation isdefault (“parallel line” element should be omitted) or theelement is present only when either inclined or vertical:5.3.1 If vertical orientation, display lines as “| |” or5.3.2 If inclined orientation, display lines as “/.”5.4 Symbol Attachments to the Reference Line:5.4.1 Geomet
13、ry of cross section of the dispensed bead styleBEAD X-SECT and5.4.2 An arrow-shaped element indicating surface applica-tion of the adhesive APP SURF that may be shown posi-tioned as:5.4.2.1 Above line onlyIf adhesive is to applied to sub-strate surface to which arrow is pointing,5.4.2.2 Below line o
14、nlyIf adhesive is to be applied tosubstrate surface opposite to which arrow is pointing, and1This practice is under the jurisdiction of ASTM Committee D14 on Adhesivesand is the direct responsibility of Subcommittee D14.60 on Adhesive MaterialClassification System.Current edition approved March 1, 2
15、014. Published March 2014. Originallyapproved in 2008. Last previous edition approved in 2008 as D7447 081. DOI:10.1520/D7447-08R14.2Available from American National Standards Institute (ANSI), 25 W. 43rd St.,4th Floor, New York, NY 10036, http:/www.ansi.org.Copyright ASTM International, 100 Barr Ha
16、rbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States15.4.2.3 Both above and below lineIf adhesive is to beapplied to both substrate surfaces.5.5 Symbol Attachments to the Intersection of the Referenceand Arrow LinesA circle is noted where the adhesive is to beapplied around the p
17、erimeter of a joint (for example, pipe toflange joint).5.6 The mast line contains “A” notation to denote adhesive.5.7 Symbol Attachments to “Circle A” Mast Line:5.7.1 The presence of a filled flag indicates the adhesive isto be applied in the field and the absence of this elementindicates factory ap
18、plication.5.8 Fig. 4 and Fig. 5 are examples of a bonded joint beforeand after the use of the symbol. For illustrative purposes,assume adhesive is applied in the plant.6. Keywords6.1 adhesive; CAD; joint; symbolFIG. 1 Standard Locations of Elements of the Adhesive SymbolTABLE 1 FORM(Adhesive Physica
19、l Forms)One-Part System 1CTwo-Part System 2CFilm FILFoam FOAOther (specify)TABLE 2 TECH(Technology Families)Acrylic (other than AN, CA) ACAnaerobic ANCasein CSCyanoacrylate CAEpoxy EPHot Melt HMMelamine-Formaldehyde MFPhenol-Formaldehyde PFPolyimide PIPolyurethane PURPolyurethane/Epoxy Hybrid PUR/EP
20、Silane Modified SLSilicone SIOther (specify)TABLE 3 SURF PREP(Surface Preparation)a. DETERGENT CLEANINGA(insert type)b. SOLVENT WIPEB(insert type)c. CHEMICAL TREATMENTC(insert type)d. MECHANICAL TREATMENTD(insert type)Note (SAND grit size) or(GRIT shot size) as neededADetergent Cleaning types may in
21、clude but are not limited to: (1) detergent; (2)soap; (3) caustic soda.BSolvent Wipe types may include but are not limited to: (1) acetone; (2) isopropylalcohol.CChemical Treatment types may include but are not limited to: (1) corona; (2)flame; (3) plasma; (4) chemical etching; (5) conversion coatin
22、g; (6) silicatization.DMechanical Treatment types may include but are not limited to: (1) manualsanding; (2) sandblasting; (3) tumbling; (4) vapor honing. Indicate SAND grit sizeor GRIT shot size as needed.D7447 08 (2014)2TABLE 4 APP METH(Application Method)DISPENSED BEAD ROLL COATSelect Dispensed B
23、ead or Roll Coat Application YES NO YES NOa. Cross Section (BEAD X-SEC) See Fig. 2 N/Ab. Mix Ratio (MIX) X:Y X:Yc. Applied Thickness (APP THCK) orCoat Weight (COAT WT)Applied Thickness(dimension)Coat Weight(wt/area)d. Coverage Area (AREA) (as % of total area) N/A A %e. Design (Final) Bond Line Thick
24、ness (BL THCK) (dimension) (dimension)f. Bond Line Set Method (BL SET) Part Stand-Off(PSO): (dimension)Mechanical Spacer(MS): (dimension)Part Stand-Off(PSO): (dimension)Mechanical Spacer(MS): (dimension)g. Surface of Application (APP SURF)AAElement is displayed above, below, or on both sides of refe
25、rence line depending on which substrate surface adhesive is to be applied.TABLE 5 CURE(Curing Parameters)Heat:Exposure Time: (min)Temperature: TcC (Tf F) at ambient humidityHeat Application Method:A(insert type)Moisture: Exposure Time: (min)Humidity Range: (% range)Ultraviolet Light (UV):BWavelength
26、: (nm) Time: (sec) Intensity: (mW/cm2)Electron Beam (EB):BElectron Energy: (keV) Time: (sec) Electron Current Density: (A/cm2)Radio Frequency (RF):BFrequency: (Mhz, Ghz) Time: (sec) Intensity: (W/cm2)Visible Light (VIS):BWavelength: (nm) Time: (sec)Other: (specify)AHeat Application Method may includ
27、e but is not limited to: (1) heated press; (2) oven; (3) infrared (IR); (4) hot air impingement; (5) induction heating.BAt the design phase, dosage, wavelength, and time parameters may NOT be known as ultimate values will depend on the specifics of the manufacturing process; thesefields should be le
28、ft blank under these circumstances.1NoteThis criteria may only be applicable if adhesive is mastic; if self-leveling, leave blank.FIG. 2 BEAD X-SECT1(Geometry of Dispensed Bead Cross-Section)D7447 08 (2014)3FIG. 3 Expanded Detail of Elements of the Adhesive SymbolD7447 08 (2014)4ASTM International t
29、akes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own
30、responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addr
31、essed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at
32、the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (
33、phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the ASTM website (www.astm.org/COPYRIGHT/).FIG. 4 Drawing Before SymbolFIG. 5 Application of Symbol(1 in. = 2.54 cm and tc=(tf 32)/1.8)(for clarity, symbol is shown for upper adhesive bond only)D7447 08 (2014)5
