1、Designation: F 68 05Standard Specification forOxygen-Free Copper in Wrought Forms for ElectronDevices1This standard is issued under the fixed designation F 68; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revisi
2、on. A number in parentheses indicates the year of last reapproval. A superscriptepsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification establishes the requirements forwrought and fabricated shapes made from Copper UNS2No.C10100, conforming to
3、the chemical requirements of Specifi-cation B 170, Grade 1, and suitable for use in electron devices.1.2 The requirements of this specification are in addition tothose prescribed in the following product specifications appro-priate to the material being ordered: B1, B2, B75, B 75M,B 152/B 152M, B 17
4、0, B 187/B 187M, B 272, and B 372.Incase of conflict, however, this specification shall take prece-dence.1.3 The inch-pound units are the standard for this specifi-cation except for grain sizes which are in metric units. Metricvalues given in parentheses are for information only.1.4 The following sa
5、fety hazard caveat applies to sections17.4, 17.5 and 18.7 of this specification: This standard does notpurport to address all of the safety concerns, if any, associatedwith its use. It is the responsibility of the user of this standardto establish appropriate safety and health practices anddetermine
6、 the applicability of regulatory limitations prior touse.2. Referenced Documents2.1 ASTM Standards:3B1 Specification for Hard-Drawn Copper WireB2 Specification for Medium-Hard-Drawn Copper WireB3 Specification for Soft or Annealed Copper WireB75 Specification for Seamless Copper TubeB 75M Specificat
7、ion for Seamless Copper Tube (Metric)B 152/B 152M Specification for Copper Sheet, Strip, Plateand Rolled BarB 170 Specification for Oxygen-Free Electrolytic CopperRefinery ShapesB 187/B 187M Specification for Copper Bar, Bus Bar, Rodand ShapesB 188 Specification for Seamless Copper Bus Pipe andTubeB
8、 193 Test Method for Resistivity of Electrical ConductorMaterialsB 248 Specification for General Requirements for WroughtCopper and Copper-Alloy Plate, Sheet, Strip and RolledBarB 248M Specification for General Requirements forWrought Copper and Copper-Alloy Plate, Sheet, Strip andRolled Bar MetricB
9、 249/B 249M Specification for General Requirements forWrought Copper and Copper-Alloy Rod, Bar, Shapes, andForgingsB 250/B 250M Specification for General Requirements forWrought Copper-Alloy WireB 272 Specification for Copper Flat Products with Finished(Rolled or Drawn) Edges (Flat Wire and Strip)B
10、372 Specification for Seamless Copper and Copper-AlloyRectangular Waveguide TubeB 577 Test Methods for Detection of Cuprous Oxide Hy-drogen Embrittlement Susceptibility in CopperE29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE112 Test Methods for De
11、termining Average Grain SizesE 527 Practice for Numbering Metals and Alloys (UNS)2.2 ASTM Adjunct:Comparison Chart43. Terminology3.1 For definitions of terms related to this product, refer tothe terminology sections of Specifications B3, B 188, B 248,B 248M, B 249/B 249M, B 250/B 250M, or B 251.1Thi
12、s specification is under the jurisdiction ofASTM Committee B05 on Copperand Copper Alloys and is the direct responsibility of Subcommittee B05.02 on Rod,Bar, Wire, Shapes, and Forgings.Current edition approved Oct. 1, 2005. Published October 2005. Originallyapproved in 1966. Last previous edition ap
13、proved in 2004 as F 68 99 (2004).2The UNS System for copper and copper alloys (see Practice E 527) is a simpleexpansion of the former standard designation system accomplished by the additionof a prefix “C” and a suffix “00”. The suffix can be used to accommodatecomposition variations of the base all
14、oy.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.4Available from ASTM International Headquarters. Order Adj
15、unct No.ADJF0068.1*A Summary of Changes section appears at the end of this standard.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.3.2 Definition of Terms Specific to This Standard:3.2.1 extrusion pipe, na lamination resulting from t
16、heflow of the oxide surface of a billet into the article beingextruded and usually confined to the trailing-end portion of theextruded product.3.2.2 oxygen-free, adjelectrolytic copper produced sub-stantially free of cuprous oxide and containing no more than 10ppm oxygen, as determined by metallogra
17、phic examination at753 under polarized light, and manufactured without the useof metallic or metalloidal deoxidizers.3.2.3 oxygen-free, grade 1, adjas defined in 3.2.2 exceptthat the oxygen content must be 5 ppm maximum. This copperis also commonly termed “oxygen-free electronic.”3.2.4 rms, nroot-me
18、an-square, a statistical measure ofsurface roughness usually determined by means of a profilo-meter.4. Ordering Information4.1 Orders for the product shall include the followinginformation:4.1.1 The designation and year of issue of both Specifica-tion F 68 and the basic product specification involve
19、d,4.1.2 Shape of product,4.1.3 Size,4.1.4 Total estimated weight or number of pieces, or both,for each size and shape,4.1.5 The Specification F 68 Class of material,4.1.6 Intended application (for example, wave guide),4.1.7 Temper,4.1.8 Heat identification or traceability details,4.1.9 Certification
20、,4.2 The following options are available:4.2.1 Mill test report,4.2.2 Special packaging,4.2.3 Special marking.5. Materials and Manufacture5.1 MaterialThe material shall be oxygen-free electroniccopper which conforms to the requirements of SpecificationB 170, Grade 1.5.2 ManufactureThe manufacturing
21、process shall con-form to the requirements of this specification and to the basicproduct specification to which the product was ordered.6. Chemical Composition6.1 The cast refinery shape shall conform to the require-ments specified in Specification B 170, Grade 1, Table 1.6.1.1 Copper shall be taken
22、 as the difference between thesum of results for Grade 1 specified elements and 100 %.6.2 These composition limits do not preclude the possiblepresence of other unnamed elements. Limits may be estab-lished and analysis required for unnamed elements by agree-ment between the manufacturer and the purc
23、haser.7. Temper7.1 The temper of the wrought or fabricated product sup-plied shall conform to the requirements of the basic productspecification to which it was ordered.8. Physical Properties8.1 Electrical ResistivityThe maximum mass resistivityshall be 0.15176 ohms g/m2(conductivity 101.0 % minimum
24、,International Annealed Copper Standard (IACS) at 20C whentested in the annealed condition.8.2 ScalingWhen agreed upon between customer andsupplier, the test specimens of oxygen-free copper shall showsubstantial surface oxide adherence when subjected to test asdescribed in 18.7.NOTE 1The purpose of
25、this test is to distinguish between oxygen freeand deoxidized copper. Deoxidized copper will not retain the surfaceoxide in this test.9. Mechanical Properties9.1 All products shall conform to the mechanical propertyrequirements of the basic product specification to which theitem was ordered, with th
26、e following exception:9.1.1 Sheet and strip with a thickness of 0.125 in. or less andintended for gaskets or for deep drawing shall conform to therequirements prescribed in Table 1.10. Hydrogen Embrittlement (Reverse Bend TestMethod)10.1 Specimens shall withstand a minimum of ten reversebends withou
27、t breaking. Evidence of blisters, upon visualexamination, shall be cause for rejection.NOTE 2Fractured areas of the bent samples should show somereduction in area and have a distorted, smeared surface. The ideal breakwill have the appearance of a cup and cone tensile failure.11. General Examination1
28、1.1 When examined the samples shall have:11.1.1 A relatively uniform surface free of irregular roughspots sometimes termed open grains,11.1.2 Edges free of seams, laps and cracks,11.1.3 Cross sections free of breaks, inclusions or extrusionpipe.12. Special Examinations12.1 Special Macro Examination:
29、12.1.1 The samples shall show no subsurface defects inexcess of the following limits:12.1.1.1 Tubular Products:(1) Tubes for Exhaust (Pinch-off) Purposes:(a) For wall thickness over 0.1 in. (2.5 mm), no defectson the external surface deeper than 0.005 in. (0.13 mm).(b) For wall thicknesses up to 0.1
30、 (2.5 mm) inclusive, nodefects on the external surface deeper than 5 % of the wallthickness.(c) No significant defects on the inside surface whenexamined with fiber optics or a boroscope.TABLE 1 Grain SizeThicknessAverage GrainSize,max, mmHardnessHRFAmaxLess than 0.040 in. (1.0 mm) 0.035 750.040 to
31、0.125 in. (1.0 to 3.2 mm) 0.050 75AFor information only.F68052(2) WaveguidesNo defects on the external surface deeperthan 0.005 in. (0.13 mm) or 5 % of the wall thickness,whichever is smaller. No significant defects on the insidesurface when examined with fiber optics or a boroscope.(3) Tube for Oth
32、er ApplicationsNo defects on either theinternal or external surfaces deeper than 0.020 in. (0.51 mm) or5 % of the wall thickness, whichever is the smaller.12.1.1.2 Bar and Plate ProductsNo defects deeper than0.06 in. (1.6 mm) or 5 % of the thickness, whichever is thesmaller.12.1.1.3 Sheet, Strip and
33、 Flat Wire ProductsNo defectsdeeper than 0.005 in. (0.13 mm) or 5 % of the thickness,whichever is smaller.12.1.1.4 Rod and Wire Products:(1) Rod and Wire less than 0.19 in. (4.8 mm) inDiameterNo defects deeper than 0.005 in. (0.13 mm) or 5 %of the diameter, whichever is smaller.(2) Rod and Wire 0.19
34、 in. (4.8 mm) and Over inDiameterNo defects deeper than 0.06 in. (1.6 mm) or 5 % ofthe diameter, whichever is smaller.12.2 Special Microscopical Examination:12.2.1 Samples shall be classified by comparison to Plate 1,which is available from ASTM International Headquarters asan adjunct (see 2.2).12.2
35、.1.1 Product whose samples have an appearance inconforming to either Class 1 or Class 2 shall be consideredacceptable.12.2.1.2 Subsurface microporosity similar to those typicalof Class 3, 4 or 5 as illustrated in Plate 1, are permissible inClass 1 and 2 material provided the microporosity does notap
36、pear below the metal surface at depths exceeding thefollowing:(1) Tubular Products:(a) Tubes for Exhaust Purposes and WaveguidesNoindications at any depth below the surface.(b) Tubes for Other ApplicationsMicroporosity permis-sible to depths of 0.020 in. (0.51 mm) or 5 % of the tube wall,whichever i
37、s smaller.(2) Bar and PlateMicroporosity permissible to depths of0.06 in. (1.5 mm) or 5 % of the thickness, whichever is smaller.(3) Sheet, Strip and Flat WireMicroporosity permissibleto depths of 0.010 in. (0.25 mm) or 5 % of the thickness,whichever is smaller.(4) Rod and Wire Products:(a) Rod and
38、Wire less than 0.19 in. (4.8 mm) inDiameterMicroporosity permissible to depths of 0.010 in.(0.25 mm) or 5 % of the diameter or thickness, whichever issmaller.(b) Rod and Wire 0.19 in. (4.8 mm) and Over inDiameterMicroporosity permissible to depths of 0.06 in.(1.5 mm) or 5 % of the diameter or thickn
39、ess, whichever is thesmaller.12.2.1.3 Product whose samples have an appearance corre-sponding to Class 3, 4 or 5 and not in conformance with12.2.1.2, shall be acceptable only by agreement between themanufacturer or supplier and the purchaser.13. Dimensions, Mass and Permissible Variations13.1 The di
40、mensional tolerances for the product describedby this specification shall be as prescribed in the basic productspecification to which it was ordered.14. Workmanship, Finish and Appearance14.1 The product shall be prepared and handled in such amanner as to be substantially free from surface oxide and
41、 thepresence of foreign material such as metal chips, dirt andgrease.15. Sampling15.1 The sampling practice shall be as prescribed in thebasic product specification to which it was ordered.15.1.1 The number of sample pieces to be selected, how-ever, shall be twice the number prescribed in the basic
42、productspecification.16. Number of Tests and Retests16.1 TestsThe number of samples submitted to all testsshall be twice that required by the basic product specificationto which the product was ordered.16.2 Retests:16.2.1 Retests are permitted as stated in the basic productspecification to which the
43、 product was ordered for testsassociated with the basic product specification.16.2.2 Retests shall be permitted for tests and examinationsrequired by this specification.16.2.3 Products which fail in retest shall be rejected.17. Specimen Preparation17.1 Chemical CompositionAnalytical sample prepara-t
44、ion shall be as directed in the basic product specification towhich the product was ordered.17.2 Electrical ResistivitySpecimen preparation shall beas directed in the basic product specification to which theproduct was ordered.17.3 Grain SizeSpecimen preparation shall be as directedin the basic prod
45、uct specification to which the product wasordered.17.4 General and Special Macro Examination:17.4.1 Transverse sections of the samples shall be machinedto a 63 rms or smoother surface finish and degreased.17.4.1.1 In a properly ventilated fume hood, etch thesamples for 3 to 5 min by lowering the sam
46、ples into a freshlyprepared etching solution and slowly agitate.17.4.1.2 Prepare the etching solution by mixing equal partsof concentrated reagent grade nitric acid (HNO3) and deionizedor distilled water. Add 5 grams of copper for each liter of the50 % acid solution and cool the solution to ambient
47、tempera-ture prior to use. The solution shall be kept free of dirt andmaintained at 75 6 5F (24 6 3C) during use.(WarningDo not pour the water into the acid.)17.4.1.3 Remove the samples periodically from the etchingsolution and visually examine to determine whether sufficientlyetched. Should the sam
48、ples tend to stain, add 25 mL ofconcentrated reagent grade hydrochloric acid (HCl) to eachliter of etching solution.F6805317.4.1.4 After etching, rinse the samples thoroughly withdeionized or distilled water and blow dry with air for exami-nation.17.5 Special Microscopical Examination:17.5.1 Cut and
49、 degrease longitudinal samples taken fromthe finished product.17.5.2 Heat the samples to 1870 6 40F (1020 6 20C) andhold at temperature for 30 min in an atmosphere comprisingnot less than 10 % hydrogen. Rapidly cool to ambient tempera-ture by quenching in water without undue exposure to air orquickly cool the specimens in the same atmosphere.17.5.3 Polish and etch for examination using the etchingsolution described in Table 2.(WarningWith constant gentlestirring or swirling of the water, slowly add the acid. Do notpour the water into the acid.)17.6
