1、Designation: F2678 10F2678 16Standard Practice forPreparing Panel Underlayments, Thick Poured GypsumConcrete Underlayments, Thick Poured Lightweight CellularConcrete Underlayments, and Concrete Subfloors withUnderlayment Patching Compounds to Receive ResilientFlooring1This standard is issued under t
2、he fixed designation F2678; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the l
3、ast revision or reapproval.1. Scope1.1 This practice includes recommendations for preparing and smoothing panel underlayments, gypsum concrete and concretesubfloors with patching compounds upon which resilient flooring may be installed.1.2 This practice does not cover the adequacy of the subfloor as
4、sembly to perform its structural requirements, which is governedby local building codes.1.3 This practice does not supersede in any manner the resilient flooring, underlayment or adhesive manufacturers writteninstructions. Consult the individual resilient flooring, underlayment or adhesive manufactu
5、rer for specific recommendations.1.4 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematicalconversions to SI units that are provided for information only and are not considered standard.1.5 This standard does not purport to address all
6、of the safety concerns, if any, associated with its use. It is the responsibilityof the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatorylimitations prior to use.2. Referenced Documents2.1 ASTM Standards:2C109/C109M Test Method f
7、or Compressive Strength of Hydraulic Cement Mortars (Using 2-in. or 50-mm Cube Specimens)C472 Test Methods for Physical Testing of Gypsum, Gypsum Plasters and Gypsum ConcreteF141 Terminology Relating to Resilient Floor CoveringsF710 Practice for Preparing Concrete Floors to Receive Resilient Floorin
8、gF1482 Practice for Installation and Preparation of Panel Type Underlayments to Receive Resilient FlooringF2419 Practice for Installation of Thick Poured Gypsum Concrete Underlayments and Preparation of the Surface to ReceiveResilient FlooringF2471 Practice for Installation of Thick Poured Lightweig
9、ht Cellular Concrete Underlayments and Preparation of the Surfaceto Receive Resilient Flooring3. Terminology3.1 Definitions used in this practice shall be in accordance with Terminology F141.4. Significance and Use4.1 This practice provides minimum recommendations for preparing and smoothing panel u
10、nderlayments, thick poured gypsumconcrete underlayments, thick poured lightweight cellular concrete underlayments and concrete subfloors with patching1 This practice is under the jurisdiction of ASTM Committee F06 on Resilient Floor Coverings and is the direct responsibility of Subcommittee F06.40 o
11、n Practices.Current edition approved June 1, 2010Feb. 15, 2016. Published August 2010March 3016. Originally approved in 2010. Last previous edition approved in 2010 asF2678-10. DOI: 10.1520/F267810.10.1520/F267816.2 For referencedASTM standards, visit theASTM website, www.astm.org, or contactASTM Cu
12、stomer Service at serviceastm.org. For Annual Book of ASTM Standardsvolume information, refer to the standards Document Summary page on the ASTM website.This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to
13、the previous version. Becauseit may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current versionof the standard as published by ASTM is to be considered the official document.Copyright
14、 ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1compounds. Actual requirements for materials to be used, mixtures, and other details are generally included as part of the projectplans or specification details and may vary from the minimum reco
15、mmendations set forth in this practice.5. Product Requirements5.1 The patching compound shall be able to be applied from featheredge up to the manufacturers specified thickness over largeareas.5.2 The patching compound may require the addition of an additive other than water.5.3 The patching compoun
16、d shall be able to be covered by resilient floorings as soon as the patching hardens and driessufficiently.5.4 The dried patching compound shall be moisture-free, mildew-resistant and alkali-resistant.5.5 For commercial installations, the patching compound shall develop a minimum of 3000 psi compres
17、sive strength after 28days when tested in accordance with Test Method C109/C109M (air-cured only) or with Test Methods C472.6. Material Acceptance6.1 All patching compounds shall be delivered in their original, factory packaging.7. Material Storage, Conditioning and Protection7.1 All patching compou
18、nds shall be kept dry in a temperature controlled environment on site and protected from the weatherat least 48 h prior to use. The temperature shall not be below 65F (18C) or above 100F (38C). Refer to the patching compoundmanufacturers recommendation for more specific instruction.7.2 All patching
19、compounds shall be kept off the ground and away from damp and cold surfaces.7.3 Protect the applied patching compound from excessive heat and drafty conditions while curing.7.4 Protect the applied patching compound and the entire subfloor from traffic, dirt or dust or other contaminates such assweep
20、ing compounds until final installation of the resilient floor covering.8. General Guidelines8.1 General Specifications:8.1.1 The patching compound shall not be applied to a subfloor containing frost. The subfloor surface temperature shall not bebelow 50F (10C) or above 95F (35C). The temperature con
21、ditions for installing resilient flooring products and the patchingcompound is typically 65 to 85F (18 to 30C) for 48 h before, during and after the installation. The complete installation shallremain within the range of 55 to 95F (13 to 35C) thereafter.8.1.2 All subfloors shall be clean and free of
22、 dust, oil, grease, paint, tar, wax, curing compounds, sealers, from release agents,primers, free alkali, loosely bonded toppings, loose particles, old adhesive residues and any other substance that may prevent orreduce adhesion of the patching compound.8.1.3 Any substance that may reduce or prevent
23、 the adhesion from the subfloor shall be completely removed by mechanicalmeans only. Refer to supplementary requirement section.8.1.4 Structural lightweight concretes having a minimum density of 115 lb/ft3(1842 kg/m3) and a minimum compressivestrength of 3000 psi can be suitable substrates to receiv
24、e patching compounds.8.1.5 The temperature of a heated subfloor must not exceed 85F (30C).8.1.6 All moving joints such as expansion joints, isolation joints and any cracks exhibiting movement shall not be filled withpatching compound or covered with resilient flooring. Consult the resilient flooring
25、 manufacturer regarding the use of an expansionjoint covering system.8.2 Panel Underlayment:8.2.1 All panel underlayment used shall be recommended by either the panel underlayment manufacturer or the resilient flooringmanufacturer.8.2.2 All panel underlayment shall be installed in accordance with th
26、e Standard Practice F1482.8.2.3 All wood structural panel floor assemblies shall be double-layered. double-layered (a combination of the wood subfloorand panel underlayment). The subfloor panel shall be 58 in. (16 mm) thick minimum wood structural panels (usually Exterior GradePlywood) over joist 16
27、 in. (41 cm), typically on center. Joist center spacing shall comply with local building codes. The secondlayerpanel underlayment shall be a minimum 14 in. (6.4 mm) thick, and sufficiently smooth to receive resilient flooring (thickerboards may be required for commercial applications). The adjacent
28、edges of the underlayment panels shall not be more than 132in. (1.6 mm) above or below each other. End joints of panel underlayment shall be offset from subfloor panel joints by at least onejoist spacing. Panel underlayment edge joints shall be offset from subfloor panel edge joints by at least 2 in
29、.8.3 Concrete Subfloors:8.3.1 All concrete subfloors shall meet the requirements outlined in Practice F710.F2678 1628.3.2 All concrete subfloors shall have a minimum density of 115 lb/ft3 (1842 kg/m3).8.3.3 Due to the varying porosity of concrete subfloors, we recommend that a bond test be performed
30、 to ensure adequate bond.If an adequate bond is not achieved, abrasively prepare the concrete subfloor surface according to the patching compoundmanufacturers recommendation. Methods such as grinding or shot blasting are appropriate.8.3.4 Porous concrete substrate may require being primed. Refer to
31、the patching compound manufacturers recommendation.8.4 Gypsum Concrete Subfloors:8.4.1 All gypsum concrete subfloors shall meet the requirements outlined in Practice F2419.8.4.2 All gypsum concrete subfloors shall have a minimum density of 105 lb/ft3 (1460 kg/m3).8.4.3 Porous gypsum concrete substra
32、tes may require being primed. Refer to the patching compound manufacturersrecommendation.8.4.4 Due to the varying porosity of gypsum concrete subfloors, we recommend that a bond test be performed to ensure adequatebond. If an adequate bond is not achieved, refer to the patching compound manufacturer
33、s recommendation.8.5 Poured Lightweight Cellular Concrete Subfloors:8.5.1 All poured lightweight cellular concrete subfloors shall meet the requirements outlined in Practice F2471.8.5.2 All poured lightweight cellular concrete subfloors shall have a minimum density of 110 lb/ft3 (1762 kg/m3).8.5.3 P
34、orous poured lightweight cellular concrete substrate may require being primed. Refer to the patching compoundmanufacturers recommendation.8.5.4 Due to the varying porosity of poured lightweight cellular concrete subfloors, we recommend that a bond test be performedto ensure adequate bond. If an adeq
35、uate bond is not achieved, refer to the patching compound manufacturers recommendation.9. Installation of Patching Compounds9.1 Materials:9.1.1 Trowelable patching compound.9.1.2 Water shall be potable and cool. Water temperature shall not exceed 73F (23C).9.1.3 Clean mixing container.9.1.4 Mechanic
36、al mixer and mixing paddle recommended by the patching compound manufacturer.9.2 Mixing and Application:9.2.1 In a clean container, pour the required amount of water or liquid additive, and then gradually add the required amount ofthe patching compound while slowly mixing with the mechanical mixer.
37、Mix thoroughly until a smooth and lump-free consistencyis obtained.9.2.2 Apply the patching compound mix to the subfloor using a flat-edge steel trowel to fill surface cracks, grooves, depressionsand other irregularities in order to meet the floor covering manufacturer recommendations.9.2.3 Protrusi
38、ons should be ground off, driven flush, sanded smooth or driven below the surface, then patched and sanded inorder to meet the floor covering manufacturer recommendations.10. Field Quality Control10.1 To determine representative compressive strengths, specimens of the patching compounds shall be tak
39、en at the job sitefrom an unopened package. The compressive strength tests shall be done in accordance with Test Method C109/C109M, (air-curedonly) or with Test Methods C472.11. Protection11.1 Protect the subfloor from traffic, dirt or dust from other trades until final installation of resilient flo
40、or covering.11.2 The surface of the subfloor shall be cleaned of all loose material by scraping, brushing, vacuuming, other methods, or acombination thereof, recommended by the resilient flooring manufacturer, immediately before commencing installation of resilientflooring.12. Keywords12.1 concrete
41、subfloors; gypsum concrete subfloors; panel underlayment; patching compounds; poured lightweight cellularconcrete subfloorsF2678 163SUPPLEMENTARY REQUIREMENTSS1. RECOMMENDED WORK PRACTICES FOR REMOVAL OF RESILIENT FLOORCOVERINGSThe following supplementary requirements shall apply only when specified
42、 by the purchaser in thepurchase order or contract.S1.1 Asbestos WarningDo not sand, dry sweep, dry scrape, drill, saw, beadblast, or mechanically chip or pulverize existingresilient flooring, backing, lining felt, paint, asphaltic “cutback” adhesives, or other adhesives. These products may containa
43、sbestos fibers or crystalline silica. Avoid creating dust. Inhalation of such dust is a cancer and respiratory tract hazard. Smokingby individuals exposed to asbestos fibers greatly increases the risk of serious bodily harm. Unless positively certain that the productis a non-asbestos-containing mate
44、rial, you must presume it contains asbestos. Regulations may require that the material be testedto determine asbestos content. The Resilient Floor Covering Institute (RFCI) document, “Recommended Work Practices forRemoval of Resilient Floor Coverings,” should be consulted for a defined set of instru
45、ctions addressed to the task of removing allresilient floor covering structures.S1.2 Lead Paint CautionCertain paints may contain lead. Exposure to excessive amounts of lead dust presents a health hazard.Refer to applicable federal, state, and local laws and, “Lead-Based Paint: Interim Guidelines fo
46、r Hazard Identification andAbatement in Public and Indian Housing,” (September 1990) or subsequent editions published by the U.S. Department of Housingand Urban Development regarding: (1)Appropriate methods for identifying lead-based paint and removing such paint; and (2) anylicensing, certification
47、, and training requirements for persons performing lead abatement work.S1.3 Adhesive Remover CautionThere are a number of commercial adhesive removers on the market that will properly removeadhesive residue from a subfloor, however, there are concerns that these products can adversely affect the bon
48、ding of the new floorcovering. The Resilient Floor Covering Institute (RFCI) document, “Recommended Work Practices for Removal of Resilient FloorCoverings,” and the resilient flooring manufacturers written instructions should be consulted for a defined set of instructions whichshould be followed if
49、existing adhesives must be removed (see S1.1).S1.4 Residual Asphalt Adhesive(Also see S1.1 and S1.3.) Many resilient floorings may not be installed when residual asphaltadhesive residue is present. Consult the Resilient Flooring Manufacturers written recommendations concerning use of resilientflooring products in these situations.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the
