1、Designation: G209 12Standard Practice forDetecting mu-phase in Wrought Nickel-Rich, Chromium,Molybdenum-Bearing Alloys1This standard is issued under the fixed designation G209; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the ye
2、ar of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice incorporates etching and metallographicexamination of Wrought Nickel-Rich, Chromium,Molybdenum-Bea
3、ring Alloys such as, but not limited to, UNSN06686 and UNS N10276.1.2 Microstructures have a strong influence on propertiesand successful application of metals and alloys. The presenceof mu-phase in the microstructure may significantly reduce thecorrosion resistance of Wrought Nickel-Rich, Chromium,
4、 andMolybdenum-Bearing Alloys.1.3 This practice may be used to determine the presence ofmu-phase in Wrought Nickel-Rich, Chromium, andMolybdenum-Bearing Alloys through comparison of micro-structure observed for etched metallographic specimens to aglossary of photomicrographs displaying the presence
5、andabsence of mu-phase in the microstructure.1.4 The values stated in SI units are to be regarded as thestandard. Other units are given in parentheses for informationonly.1.5 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility
6、 of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D1193 Specification for Reagent WaterE3 Guide for Preparation of Metallographic SpecimensE7 Terminolo
7、gy Relating to MetallographyE1245 Practice for Determining the Inclusion or Second-Phase Constituent Content of Metals by Automatic ImageAnalysisE1268 Practice for Assessing the Degree of Banding orOrientation of MicrostructuresG193 Terminology and Acronyms Relating to Corrosion3. Terminology3.1 Def
8、initions:3.1.1 The terminology used herein, if not specifically de-fined otherwise, shall be in accordance with TerminologyG193. Definitions provided herein and not given in Terminol-ogy G193 are limited only to this practice.3.1.2 For metallographic definitions used in this practice,refer to Termin
9、ology E7.3.1.3 For evaluation of inclusions, secondary phases andbanding, if desired, refer to Practices E1245 and E1268.3.2 Definitions of Terms Specific to This Standard:3.2.1 mu-phase (), nrhomohedral phase which may oc-cur in Nickel-Rich, Chromium, Molybdenum-Bearing Alloysand may occur as coars
10、e, irregular platelets, which form at hightemperature.4. Significance and Use4.1 These test methods describe laboratory tests to deter-mine the presence of mu-phase in Wrought Nickel-Rich,Chromium, and Molybdenum-Bearing Alloys through com-parison of microstructure observed for etched metallographic
11、specimens to a glossary of photomicrographs displaying thepresence and absence of mu-phase in the microstructure. Thepresence of mu-phase in the microstructure may significantlyreduce the corrosion resistance, strength, toughness and duc-tility of Wrought Nickel-Rich, Chromium, and Molybdenum-Bearin
12、g Alloys.5. Sample Preparation and Etching35.1 Sectioning:5.1.1 The selection of test specimens for metallographicexamination is extremely important because, if their interpre-tation is to be of value, the specimens must be representative ofthe material that is being studied and shall be per locatio
13、n E(longitudinal section perpendicular to rolled surface) for plate1This test method is under the jurisdiction of ASTM Committee G01 onCorrosion of Metals and is the direct responsibility of Subcommittee G01.05 onLaboratory Corrosion Tests.Current edition approved May 1, 2012. Published May 2012. DO
14、I: 10.1520/G020912.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Manning, Paul E., Ph.D., Metallographic P
15、reparation of 686 Etching Speci-mens, Haynes International, Inc., Kokomo, IN, 2011.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1and sheet and per location G (radial longitudinal section) forrod and bar per Fig. 1 (Guide E3). The in
16、tent or purpose of themetallographic examination will usually dictate the location ofthe specimens to be studied. For rod and bar test specimensspecifically, samples are taken from -diameter per location Gas seen in Fig. 1. Triplicate test specimens shall be evaluatedfor determination of the presenc
17、e of mu-phase.5.1.2 Cut the specimen to a convenient size using any ofvarious types of silicon carbide, diamond, boron carbide orother carbide cutoff blades. Deformation damage can beminimized by using thin cutoff wheels 0.78 mm (132 in.) thickas opposed to 1.58 mm (116 in.). Never cut dry. Use of a
18、dequatewater coolant is desired to reduce the amount of disturbedmetal created, in part, from frictional heat during this phase ofpreparation. The original microstructure of a specimen mayalso be radically altered, (at least superficially, on the cutsurface) due to metallurgical changes if an excess
19、ive amount offrictional heat is generated.5.2 Coarse GrindingUse a 120 grit silicon carbide (SiC)wet-belt or disk grinder and light contact pressure to obtain aplane surface free from deep grooves. In addition to producinga flat surface, this procedure removes burred edges or othermechanical damage
20、which may have occurred during section-ing.5.3 MountingTo ensure flatness, and facilitate handling, itis recommended that specimens be mounted in phenolic,acrylic or cold-setting epoxy resins. Epoxy resins involve theblending of a liquid or powder resin in a suitable hardener toinitiate an exothermi
21、c reaction to promote hardening andcuring at room temperature. This usually requires an overnightoperation. However, an advantage of epoxy is that the mount issemitransparent and permits observation of all sides of thespecimen during each phase of the preparation. (The advan-tages and use of acrylic
22、 mounting resin are similar to epoxy.)Compression molding techniques may be used with phenolicpowders to produce the standard 31.7-mm (1-in.) diametermounts. Phenolic mounts are convenient when time constraintsdo not permit an overnight cold-setting operation.5.4 Fine Grinding and PolishingRotating
23、discs flushedwith running water are recommended with successively finergrit papers of 220, 320, 400, and 600 grit SiC. (A light tomedium amount of pressure is exerted on the specimen tominimize the depth of deformation). Best results are obtainedon the 600 SiC paper by grinding the specimen twice.Sp
24、ecimens shall be rotated 90 degrees after each step until theabrasive scratches from the preceding grit have been removed.In each step, the grinding time shall be increased to twice aslong as that required to remove previous scratches. Thisensures removal of disturbed metal from the previous step.Co
25、nsiderable care shall be used in the fine grinding stage toprevent the formation of artifacts. See Guide E3 for automatedmethod.5.5 Rough PolishingThe specimen shall be washed and,preferably, ultrasonically cleaned to ensure the complete re-moval of silicon carbide carryover from the fine grinding s
26、tage.Anapless type cloth shall be charged with 9-m diamond paste,and water may be used as the lubricant.The specimen is movedcounter to the direction of the rotating polishing wheel from thecenter to the outer periphery around the entire lapping surface.Heavy pressure is used with diamond abrasive t
27、echniques togain the maximum cutting rate.At the conclusion of this stage,the specimen shall again be cleaned to remove any diamondpolishing residue remaining in pinholes, cracks, and cavities.5.6 Vibrator Polishing:5.6.1 Semi-final and final polishing operations on a majorportion of metallographic
28、specimens may be completed onvibratory polishing units.Anylon polishing cloth using a slurryof 30 g of 0.3 m alumina polishing abrasive and 500 mL ofdistilled or deionized water are recommended for this opera-tion.Additional weight in the form of a stainless steel cap mustbe placed on the specimen.
29、The suggested weight to achieve asatisfactory polish in 30-60 min on a 31.7 mm (1-in.)diameter mount is 350 g.5.6.2 Other methods of final polishing may be utilized, forexample using a manual or automatic polishing wheel with fine(#3 m) abrasive polishing compound.NOTE 1For a more extensive descript
30、ion of various metallographictechniques, refer to Samuels, Petzow, and VanderVoort.45.6.3 Samples shall be cleaned with a cotton swab underrunning water to remove the alumina particle film, placed on ashort nap micro-cloth with a slurry of 30 g of 0.05 m aluminaabrasive and 500 mL of distilled water
31、, and polished until ascratch-free surface is obtained. Again a 350-g weight is usedto augment polishing. Specimens usually require 25 to 30 minto produce a satisfactory final polish. The specimen can usuallybe polished an additional 10 to 15 min without producingharmful over-polishing effects, but
32、too much time may createrelief on samples which are narrow across the polished surface.4Samuels, L. E., Metallographic Polishing by Mechanical Methods, AmericanSociety for Metals (ASM), Metals Park, OH, 3rd Ed., 1982; Petzow, G., Metallo-graphic Etching, ASM, 1978; and VanderVoort, G., Metallography
33、: Principles andPractice, McGraw Hill, NY, 2nd Ed., 1999.FIG. 1 Method of Designing Location of Area Shown in Photomi-crograph (Guide E3)G209 1225.7 Surface Preparation:5.7.1 The surface, prior to etching, shall:5.7.1.1 Be free from scratches, stains, and other imperfec-tions which mar the surface,5
34、.7.1.2 Retain all non-metallic inclusions intact, and5.7.1.3 Not exhibit any appreciable relief effect betweenmicro-constituents.5.8 Electrolytic Etching Procedures:5.8.1 Structural components of an alloy are revealed duringetching by a preferential attack or staining of the variousconstituents by t
35、he reagents. This is due to differences in thechemical composition of the phases and attending rates ofsolution. Immediately prior to etching, specimens shall belightly polished (using 0.05 m or equivalent substitute) andswabbed with cotton under running water to remove anyair-formed oxide film, to
36、reduce chances of staining.5.8.2 Place the specimen immersed face up in the etchingreagent. The cathode is placed approximately one inch fromthe specimen, and the anode is put in contact with the sample.During etching, the cathode is moved to assure a uniformaction of the etching reagent on the spec
37、imen. The sample isthen washed and repolished lightly, if needed, to remove anytraces of disturbed metal on the surface, and then re-etched.5.8.3 Etchant:5.8.3.1 Option A10 % chromic acid in SpecificationD1193 water.5.8.3.2 Option B5 g oxalic acid mixed with 95 mL HCl(reagent grade).5.8.4 Etching Pa
38、rameters:5.8.4.1 Electrolytic6 volts DC.5.8.4.2 Cathode, Carbon or Stainless Steel may be used.5.8.4.3 Stainless anode probe.5.8.5 Etching Time:5.8.5.1 Option A1 to 5 s, depending on heat treatedcondition and size of sample.5.8.5.2 Option B20 to 25 s, depending on heat treatedcondition and size of s
39、ample.5.8.6 Sample Polishing:5.8.6.1 The sample must have a fresh polish. If the surfacehas been dry, even for a few seconds, give the sample 6 to 10laps on soft nylon-type cloth with 0.05 m alumina finalpolishing compound, then place directly under running waterand swab with a cotton pad. The sampl
40、e surface must be keptwet.5.8.6.2 Place sample face up in etchant.With good overheadlight to visually see sample surface: make contact at end orcorner of sample with anode probe or wire lead tacked to theback of the specimen, dip carbon cathode into etchant, watch tosee any surface change, and break
41、 contact when finished.Before removing sample from etchant, agitate it to remove anyfilm on surface. Pull sample and put it under running water.Rinse with methanol, then place sample under forced hot airdryer until it is thoroughly dry.5.8.6.3 If etch is too light and needs to be heavier, do nottake
42、 sample back to running water and then into etchant.Instead, it must go back to the final cloth for 6 to 10 lapsmaking sure that no part of surface dries; failure to do this can,and most likely will, result in staining. If the sample does staindo not try to remove stain on final cloth. Rather, go ba
43、ck to thepapers (at least to the 400 and 600 grit), then 5 to 9 mdiamond and then to 0.05 m alumina, again, keeping samplesurface wet. Repeat as described before.NOTE 2The use of either 3 m diamond or 0.3 m alumina in thepolishing procedure in 5.8.6.3 may result in scratches remaining on thepolished
44、 surface of the mounted specimen.5.9 Immersion Etching:5.9.1 The preferred etchant for this family of alloys ischrome-regia (1 part chromic acid to 3 parts reagent gradeHCl). Stock chromic acid is made by mixing 300 g chromicacid with 300 mL of hot (32 to 60C (90 to 140F) Specifi-cation D1193 water.
45、5.9.2 For immersion etching, it is equally important to workwith a wet, freshly polished surface (that is, follow step 5.8.3.1above for electrolytic etching). The wet sample is then im-mersed face up into the chrome regia for 1 to 3 s, depending onheat treated condition and sample size. Then pull sa
46、mple, putunder running water, rinse with methanol, and blow dry. If etchis too light, follow procedure described in step 5.8.6.3 above.6. Examination and Evaluation6.1 A visual examination and photographic reproduction ofspecimen surface is compared to photomicrographs in Fig. 2 (ato n) and Fig. 3 (
47、atoj) for microstructures exhibiting theabsence and presence, respectively, of significant mu phase. Amagnification of 200 shall be used for metallographic evalu-ation. If any of the evaluated triplicate test specimens areconsidered rejectable for the presence of mu phase, the testedmaterial shall b
48、e considered rejectable.6.2 Microstructures shown in Fig. 2 (aton) are consideredAcceptable, reflecting the absence of significant mu phase.6.3 Microstructures shown in Fig. 3 (atoj) are consideredRejectable, reflecting the presence of significant mu phase.7. Report7.1 The specimen size, source, and
49、 identification.7.2 The test sample orientation per Fig. 1.7.3 The etching procedure: Electrochemical (OptionAor B)or Immersion Etching.7.4 The 200 magnification used for metallographic evalu-ation.7.5 Identify deviations from this practice.7.6 The photomicrograph(s) in Fig. 2 or Fig. 3, which mostclosely represent the evaluated test specimen.7.7 Acceptable or Rejectable microstructure, based on com-parison to photomicrographs in Fig. 2 or Fig. 3.8. Glossary of Acceptable and RejectableMicrostructures8.1 See Fig. 2 and Fig. 3.G209 1239. Keywords9.1
