1、BRITISH STANDARD BS EN 165000-4:1996 Harmonized system of quality assessment for electronic components Film and hybrid integrated circuits Part 4: Customer information, product assessment level schedules and blank detail specification The European Standard EN 165000-4:1996 has the status of a Britis
2、h Standard ICS 31.200BSEN165000-4:1996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes intoeffect on 15 October 1996 BSI 11-1998 The following BSI references relate to the work on
3、 this standard: Committee reference EPL/47/1 Draft for comment 92/216401 DC ISBN 0 580 26180 8 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated c
4、ircuits, upon which the following bodies were represented: Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate (BSI Product Certification) Amendments issued since publication Amd. No. Date CommentsBSEN 165000-4:1996 BSI 11-1998 i Contents Page Committees resp
5、onsible Inside front cover National foreword ii Foreword 2 Text of EN 165000-4 3 List of references Inside back coverBSEN 165000-4:1996 ii BSI 11-1998 National foreword This British Standard has been prepared by Subcommittee EPL/47/1 and is the English language version of EN 165000-4:1996 Film and h
6、ybrid integrated circuits Part 4: Customer information, product assessment level schedules and blank detail specification, published by the European Committee for Electrotechnical Standardization (CENELEC). A British Standard does not purport to include all the necessary provisions of a contract. Us
7、ers of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Corresponding British Standard BSEN165000 Film and hybrid integrated circuits EN 165000-1:199
8、6 BS EN 165000-1:1996 Generic specification. Capability approval procedure EN 165000-2:1996 BS EN 165000-2:1996 Internal visual inspection and special tests EN 165000-3:1996 BS EN 165000-3:1996 Self-audit checklist and report for film and hybrid integrated circuit manufacturers Summary of pages This
9、 document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 42, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside f
10、ront cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN165000-4 April1996 ICS31.200 Descriptors: Quality, generic specification, hybrid circuits Englishversion Film and hybrid integrated circuits Part 4: Customer information, product assessment level schedules and blank detail specification
11、This European Standard was approved by CENELEC on 1996-03-05. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
12、references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENE
13、LEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway
14、, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved
15、 to CENELEC members Ref. No. EN 165000-4:1996 EEN 165000-4:1996 BSI 11-1998 2 Foreword This European Standard was prepared by CLC/TC CECC SC 47AX (former CECC/WG 21), Film and hybrid integrated circuits. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENEL
16、EC as EN 165000-4 on 1996-03-05. The following dates were fixed: The present standard, EN165000-4, Film and hybrid integrated circuits Part 4: Customer information, product assessment level schedules and blank detail specification, is intended to be read in conjunction with the other parts of EN1650
17、00, which are: Part 1: Generic specification Capability approval procedure; Part 2: Internal visual inspection and special tests; Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers. Part 3 is primarily intended as a pro-forma for the manufacturer and is not
18、considered essential for a customer in this form. Part 4 is considered an essential document for all users; in particular it includes a helpful introductory section which is aimed at potential customers and seeks to explain the underlying philosophy upon which the whole standard is based. Contents P
19、age Foreword 2 1 Introduction 3 1.1 How EN 165000 works 3 1.2 Customer/manufacturer interface 3 1.3 The product assessment level schedules 4 1.3.1 Derivation of the product assessment level schedules 4 1.3.2 Indication of applications for the product assessment level schedules 5 1.4 Test requirement
20、s of the PALS and their applicability to real life application 8 1.4.1 The origin of the inspection requirements 8 1.4.2 Electrical tests 8 1.4.3 Other screening tests 9 1.4.4 Device sample testing 10 1.4.5 Design evaluation testing 11 1.4.6 AQLs, inspection levels and sampling plans 13 2 Product as
21、sessment level schedules and detail specifications 13 PALS 1-11 14 to 32 3 Blank detail specification requirements 33 Front page for standard catalogue circuits 34 Front page for customer circuits 35 Section 1 general data 36 Section 2 inspection requirements 37 Example of a customer detail specific
22、ation 38 to 45 Annex 1 46 Figure 1 40 Figure 2 40 Figure 3 41 Table 1 PALS for solder or chip carry out an audit and comply with the detailed technical process requirements of the checklist shown in EN 165000-3; test a representative product against the requirements of one of the Product Assessment
23、Level Schedules (PALSs) detailed herein. Having completed the approval, the manufacturer can release customer circuits for that particular technology against a PALS for which he is approved. 1.2 Customer/Manufacturer Interface A customer, when entering into negotiation with a potential supplier of h
24、ybrid circuits released to EN165000 needs to be aware of the various manufacturer/customer interfaces. At the design and layout stage, the two parties need to agree whether the manufacturer will be responsible for the complete design against an electrical, mechanical and environmental specification
25、and whether the customer may contribute to the layout. In this latter case, the manufacturer has to ensure that the layout complies with his design rules. Although the test requirements of each PALS is clearly defined, the customer and manufacturer have a responsibility to ensure that the Customer D
26、etail Specification clearly reflects the requirements of the customer without exceeding the capabilities of the manufacturer. In particular, any test or test sequence which allow a choice shall have that choice agreed and documented. The Customer Detail Specification requires physical dimensions of
27、the hybrid to be stated. Some of these dimensions are essential for interchangeability requirements. These need to be agreed and toleranced since the manufacturer will inspect the finished product to these requirements. The Customer Detail Specification also requires information on the performance a
28、nd design of the circuit, conditions under which it can be used and derating data, all of which needs to be agreed between customer and manufacturer. Further mutually agreed information in the Customer Detail Specification can include circuit diagrams, curves, drawings and explanatory notes.EN 16500
29、0-4:1996 4 BSI 11-1998 Electrical testing needs very careful specification and agreement between customer and manufacturer. This minimises incorrect testing, tests which damage the circuit, tests being omitted and redundant testing. The PALSs refer to “those tests which define circuit functionality”
30、 and the remainder. The tests defining circuit functionality are those which prove that the device performs its prime function. These tests tend to be part of screening and are also used as post-test end-points. The remainder are more peripheral and, either for reasons of cost of test or perceived l
31、ack of importance, tend to be examined on a sampling basis. The customer and manufacturer need to agree which electrical tests are required and which are considered to “define circuit functionality”. Where testing is performed at T minand T maxor where burn-in and electrical endurance are concerned
32、the manufacturer and the customer need to be aware that some devices dissipate heat during operation and this may raise the junction temperature much higher than that of the ambient. The control and definition of temperature and its reference point (eg. T amb , T case ) can cause problems and needs
33、to be discussed by the manufacturer and the customer in advance of the detail specification being agreed. Further agreement needs to be reached over testing and structural similarity considerations. Where structural similarity is applicable, Design Evaluation Testing can be omitted since the manufac
34、turer has already demonstrated assurance at his initial approval stage. Such omissions can only be permitted if both customer and manufacturer are confident of the correctness of such a decision. For the first delivery, the customers circuit has to be tested against all aspects of the PALS (Device S
35、creening, Device Sample Testing and Design Evaluation) as well as any other requirements which are mutually agreed between manufacturer and customer. For subsequent deliveries circuits are tested against the requirements of Device Screening, Device Sample Testing and those tests from Design Evaluati
36、on which are mutually agreed. The circuits may have all, some or more of the Design Evaluation tests performed under any mutually agreed sampling plan, together with any other agreed testing. Tests additional to those specified in the PALS do not change release to the Product Assessment Level Schedu
37、le number. The full requirements are agreed between customer and manufacturer and documented in the Customer Detail Specification. 1.3 The Product Assessment Level Schedules 1.3.1 Derivation of the Product Assessment Level Schedules Every hybrid manufacturer specialises in a number of technologies w
38、ith respect to substrate type, metallisation, method of add-on component attachment and encapsulation. Dependent upon the market for which this product is designed (high volume, high reliability, military, consumer etc.) the manufacturer will offer a number of tests which may be adopted 100%, used o
39、n a sampling basis or performed once only purely as a means of design evaluation. These variants may be classified as a series of Product Assessment Level Schedules. Table 1 shows 5 PALSs based on solder-attached or chip or wire components which are either unencapsulated or non-hermetically encapsul
40、ated. It can be seen that as the PALS number increases so does the amount of testing done on the hybrid. Similarly Table 2 shows 6 PALSs based on hermetic assembly. Once again, the amount of testing increases as the PALS number increases. A manufacturer who has completed an assessment against a PALS
41、 can release product of that same technology to customers. The manufacturer who is approved to a PALS may offer that PALS or a lower one in the same technology series. Customers who purchase hybrid circuits may require them for a wide variety of uses. They may be for military or aerospace applicatio
42、ns, medical or safety, telecommunications, automotive, commercial, professional or consumer. Each of these applications is driven by a diversity of requirements, such as cost, quality, reliability, ability to withstand extremes of temperature, mechanical or humidity environment etc. By examining the
43、 PALSs as displayed in Table 1 and Table 2, the customer is able to choose the PALS which most equates to his requirements and is thus able to choose a manufacturer who can release to this particular PALS. Where there is a requirement for testing in excess of that stipulated by a particular PALS, th
44、e customer and manufacturer may agree to this but release is still to that PALS. Purely as guidance, the eleven PALSs against which a manufacturer can release may be used in the following applications.EN165000-4:1996 BSI 11-1998 5 1.3.2 Indication of Applications for the Product Assessment Level Sch
45、edules Each of the PALS is characterised by a different assessment level, but not necessarily by a different application level. A device procured against PALS 1 or PALS 2 is not tested for its ability to withstand acceleration, although it may well withstand the test. The difference between the same
46、 device procured against PALS 1 and an identical device tested to PALS 4 or 5 is that in the latter case the ability to meet, amongst other requirements, acceleration is demonstrated and, importantly, it is paid for. A hybrid used in consumer applications, such as toys or audio-visual applications m
47、ay need to be cheap and thus have less testing demonstrated. An overall quality of product is, nevertheless, implicit as a result of the enhanced processing requirements, which is ensured by compliance with the audit against the checklist of EN 165000-3. It is impossible to give any firm guidance on
48、 which PALS is required for a specific application, except to advise that the cost of procurement rises from PALS 1 through to PALS 5 (which are essentially solder-attached components without hermetic encapsulation) and from PALS 6 through to PALS11 (which are hermetic cavity devices, probably conta
49、ining bare die). PALS 1 contains no mechanical, thermal or climatic testing and is thus assessed for benign mechanical and temperature environments. It is the cheapest schedule to perform and this would probably be suitable for commercial or consumer applications. PALS 2 is identical except that Design Evaluation requires electrical endurance to be performed for1000 hours, this giving some confidence of the life time capability of the device. The applications would be similar to those suggested for PALS 1. PALS 3 contains damp heat testing, temperatu
