1、Environmental testingPart 3-13: Supporting documentation and guidance on Test T SolderingBS EN 60068-3-13:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 60068-3-13:2016. It isidentical to IEC
2、60068-3-13:2016. It supersedes BS EN 60068-2-44:1995which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication
3、 does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 76627 5ICS 19.040Compliance with a British Standard cannot confer immunity fromlegal
4、 obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 September 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60068-3-13:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60068-3-13
5、 September 2016 ICS 19.040 Supersedes EN 60068-2-44:1995 English Version Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (IEC 60068-3-13:2016) Essais denvironnement - Partie 3-13: Documentation daccompagnement et guide sur les essais T - Brasage (IEC 60
6、068-3-13:2016) Umweltprfungen - Teil 3-13: Ergnzende Unterlagen und Anleitung zur Prfung T: Lten (IEC 60068-3-13:2016) This European Standard was approved by CENELEC on 2016-06-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
7、 this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three of
8、ficial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrote
9、chnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania
10、, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2
11、016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60068-3-13:2016 E BS EN 60068-3-13:2016EN 60068-3-13:2016 2 European foreword The text of document 91/1345/FDIS, future edition 1 of IEC 60068-3-13, prepared by IEC/TC 91 “Electron
12、ics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60068-3-13:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 201
13、7-03-17 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-06-17 This document supersedes EN 60068-2-44:1995. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CE
14、N shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60068-3-13:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to
15、 be added for the standards indicated: IEC 60068-2 Series NOTE Harmonized as EN 60068-2 Series. IEC 60749-20 NOTE Harmonized as EN 60749-20. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61191 Series NOTE Harmonized as EN 61191 Series. IEC 61192 Series NOTE Harmonized as EN 61192 Series. IEC 61
16、760-4 NOTE Harmonized as EN 61760-4. BS EN 60068-3-13:2016EN 60068-3-13:2016 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indi
17、spensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the r
18、elevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and res
19、istance to soldering heat of devices with leads EN 60068-2-20 2008 IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 - IEC 60068-2-69 -
20、Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method EN 60068-2-69 - IEC 60068-2-83 - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for sur
21、face mounting devices (SMD) by the wetting balance method using solder paste EN 60068-2-83 - IEC 61760-1 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 - IEC 62137-3 - Electronics assembly technology - Part 3: Selection
22、guidance of environmental and endurance test methods for solder joints EN 62137-3 - BS EN 60068-3-13:2016 2 IEC 60068-3-13:2016 IEC 2016 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references. 6 3 Terms, definitions and abbreviations 6 3.1 Terms and definitions 6 3.2 Abbreviations 7 4 Overview . 7 4
23、.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) 7 4.2 Physics of surface wetting . 8 4.3 Quality and reliability of solder joints . 10 5 Component soldering Processes . 10 5.1 General considerations 10 5.1.1 Components ability to be soldered . 10 5.1.2
24、Soldering processes . 12 5.1.3 Soldering defects . 12 5.1.4 Geometrical factors which may influence the soldering result 12 5.1.5 Process factors 12 5.1.6 Material factors 12 5.2 Solder . 13 5.3 Grouping of soldering conditions . 13 5.4 Ability to be soldered . 13 5.5 Moisture sensitivity of compone
25、nts 13 5.6 Relation between storage time/storage conditions and solderability 14 5.6.1 Natural and accelerated ageing 14 5.6.2 Oxidation . 14 5.6.3 Growth of intermetallic layers . 14 5.6.4 Effect of ageing to wetting characteristics . 14 5.6.5 Test conditions for accelerated ageing 15 5.7 Place of
26、soldering tests in testing 16 6 Soldering tests 17 6.1 General . 17 6.2 Solder . 18 6.3 Fluxes . 18 6.4 Test equipment . 18 6.5 Evaluation methods . 18 6.5.1 Criteria for visual inspection . 18 6.5.2 Criteria for quantitative evaluation of the wetting characteristic . 19 6.5.3 Special cases 19 6.6 A
27、cceptance criteria . 19 7 Soldering tests Methods 19 7.1 General principles . 19 7.2 Survey of test methods 19 7.3 Bath test . 22 7.4 Reflow test 23 7.4.1 With/without solder land . 23 BS EN 60068-3-13:2016IEC 60068-3-13:2016 IEC 2016 3 7.4.2 Selection of solder paste (flux system and activity grade
28、) 23 7.5 Soldering iron test . 23 7.6 Resistance to dissolution of metallization and soldering heat 23 7.6.1 General . 23 7.6.2 Limitations . 23 7.6.3 Choice of severity 24 7.7 Wetting balance test 24 7.7.1 General . 24 7.7.2 Test methods available 25 7.7.3 Limitations . 25 8 Requirements and statis
29、tical character of results 25 Bibliography . 27 Figure 1 Sessile drop of solder on oxidised copper . 8 Figure 2 Sessile drop of solder plus flux on clean copper 9 Figure 3 Sessile drop equilibrium forces . 9 Figure 4 Typical soldering processes 12 Figure 5 Soldering tests for devices with leads . 21
30、 Figure 6 Soldering tests for SMDs 22 Table 1 Solder process groups . 13 BS EN 60068-3-13:2016 4 IEC 60068-3-13:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance on Test T Soldering FOREWORD 1) The International Electrote
31、chnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To t
32、his end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Nationa
33、l Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO)
34、 in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation fro
35、m all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be he
36、ld responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any d
37、ivergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to I
38、EC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual
39、experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this I
40、EC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this I
41、EC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-3-13 has been prepared by IEC technical committee 91: Electronics assembly technology. This first edition cancels and replaces IEC 600
42、68-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: information for lead-free solders are added; technical update and restructuring. BS EN 60068-3-13:2016IEC 60068-3-13:2016 IEC 2016 5 The text of
43、this standard is based on the following documents: FDIS Report on voting 91/1345/FDIS 91/1356/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Direc
44、tives, Part 2. A list of all parts in the IEC 60068 series, published under the general title Environmental testing, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “ht
45、tp:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 60068-3-13:2016 6 IEC 60068-3-13:2016 IEC 2016 ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance o
46、n Test T Soldering 1 Scope This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-
47、1, which defines requirements to the specification of surface mounting components. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For und
48、ated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-58, Environmental testing Part 2-58: T
49、ests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-69, Environmental testing Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method1IEC 60068-2-83, Environmental testing Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devi
