BS IEC 60748-23-5-2004 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification.pdf
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1、BRITISH STANDARD BS IEC 60748-23-5: 2003 Incorporating Corrigendum No. 1 Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval ICS 31.200 BS IEC 60748-23-5:2003 This British Standard w
2、as published under the authority of the Standards Policy and Strategy Committee on 31 March 2004 BSI 28 April 2004 ISBN 0 580 43614 4 National foreword This British Standard reproduces verbatim IEC 60748-23-5:2003 and implements it as the UK national standard. The UK participation in its preparation
3、 was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cross-references The British Standards w
4、hich implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publi
5、cation does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible European co
6、mmittee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the IEC title page, pages 2
7、to 29 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date Comments 15162 Corrigendum No. 1 28 April 2004 Correction of identifiersINTERNATIONAL STANDARD IEC 60748-23-5 QC 165000-5 First e
8、dition 2003-10 Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval Dispositifs semiconducteurs Circuits intgrs Partie 23-5: Circuits intgrs hybrides et structures par films Certifica
9、tion de la ligne de fabrication Procdure dhomologation Reference number IEC 60748-23-5:2003(E) BSIEC60748235:2003 2 60748-23-5 IEC:2003(E) CONTENTS OFWERODR 3 1 Scope 3 2 Normative references. 3 3 Terms and definitions. 3 4 Qualification approval procedures 3 4.1 General 3 4.2 Marking 3 4.3 Validity
10、 of release for delivery 4 4.4 Application for qualification approval . 4 4.5 Structural similarity . 4 4.6 Materials, piece-parts and added components. 4 4.7 Initial qualification approval. 4 4.8 Granting of qualification approval 5 4.9 Maintenance of qualification approval 5 4.10 Procedure in the
11、event of a failure in a periodic test 6 4.11 Withdrawal of qualification approval 6 5 Qualification-product assessment level schedules 7 6 Blank detail specification.26 6.1 General .26 6.2 FRONT PAGE FOR COMPONENTS ASSESSED BY QUALIFICATION APPROVAL27 6.3 GENERAL DATA28 6.4 Inspection requirements.2
12、9 BSIEC60748235:2003 1 BSIEC60748235:2003 1 EN60748235:2003SB 2 BS3002:53294706CEIBSIEC60748235:2003260748-23-5 IEC:2003(E) 5 SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval 1 Sc
13、ope This part of IEC 60748-23 applies to high quality hybrids (with films) incorporating special customer quality and reliability requirements whose quality is assessed on the basis of Qualification Approval. NOTE 1 Hybrid integrated circuits may be fully or part completed. Part completed devices ar
14、e those that may be supplied to customers for further processing. NOTE 2 Test methods are selected from IEC 60748-23-1. A blank detail specification (BDS) is included to assist manufacturers and users in the preparation of detail specifications. 2 Normative references The following referenced docume
15、nts are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60748-23-1:2002, Semiconductor devices Integrated circuits Part 23-1: Hybrid
16、 integrated circuits and film structures Manufacturing line certification Generic specification IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electronic devices from electro- static phenomena General requirements QC 001002-3:1998, IEC Quality Assessment System for Electronic Components
17、(IECQ) Rules of Procedure Part 3: Approval procedures 3 Terms and definitions For the purposes of this part of IEC 60748, related documents, preferred ratings and characteristics, and terminology are given in IEC 60748-23-1. 4 Qualification approval procedures 4.1 General The procedures in QC 001002
18、-3 shall apply. Subclause 6.1 of IEC 60748-23-1 applies with the exceptions given in 4.2 to 4.11 of this standard. 4.2 Marking Clause 5 of IEC 60748-23-1 applies. BSIEC60748235:20032 BSIEC60748235:20032 3002:53284706BSEN3 94706CEISB235:2003BSIEC60748235:20033 6 60748-23-5 IEC:2003(E) 4.3 Validity of
19、 release for delivery Circuits may be released under qualification approval subject to the following conditions: a) the circuits conform with the requirements of the detail specification; b) the circuits, their added components, piece parts and materials are traceable to original manufacturers lot n
20、umbers. 4.4 Application for qualification approval Application shall be made to the NSI in accordance with QC 001002-3. In addition, the manufacturer shall: a) conform with the eligibility requirements of 6.1.1 of IEC 60748-23-1; b) conform with the relevant detail specification based on the blank d
21、etail specification (see Clause 6) and the Qualification product assessment level schedules (Q-PALS) (see Clause 5) contained in this standard. 4.5 Structural similarity For the purposes of assessment testing, structural similarity can be used if the testing of one representative type of circuit giv
22、es at least the same quality level for the rest of the types which are grouped together. The designated management representative (DMR) shall declare to the satisfaction of the NSI the method of operating the structural similarity plan within the manufacturing facilities and agree the representative
23、 type(s) from each structurally similar group. For the qualification approval procedure, two or more circuits can be considered structurally similar, and thus the required numbers of specimens for a test shall be selected from the combined production, when they have the same function type, use the s
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