1、BRITISH STANDARD BS QC 760101:1997 IEC 60748-21-1: 1997 Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval proce
2、dures ICS 31.200BSQC 760101:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15August1997 BSI 10-1999 ISBN 0 580 28004 7 National foreword This British Standard re
3、produces verbatim IEC60748-21-1:1997 and implements it as the UK national standard. It supersedes BSQC760101:1992 which is withdrawn. This standard is a harmonized specification within the IEC system of quality assessment for electronic components (IECQ). The UK participation in its preparation was
4、entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals
5、 for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. The standard is to be used in conjunction with BSQC760000 and
6、BSQC760100. The British Standard which implements the IECQ Rules of Procedure is BS9000 General Requirements for a system for electronic components of assessed quality Part 3:1996 Specification for the national implementation of the IECQ system. From 1 January 1997, all IEC publications have the num
7、ber 60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both system. Cross-references The British Standards which implement international
8、or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the
9、necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, the
10、IEC title page, page ii, pages1to12 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSQC 760101:1997 BSI
11、10-1999 i Contents Page National foreword Inside front cover Text of IEC 60748-21-1 1ii blankBSQC 760101:1997 ii BSI 10-1999 Contents Page Introduction 1 1 Characteristics and conditions of use 4 2 Recommended methods of mounting 4 3 Marking 4 4 Ordering information 4 5 Certified records of released
12、 lots 4 6 Additional information 4 7 Additional or increased severities or requirements to those specified in the generic and/or sectional specification 5 8 Inspection requirements (see Table 2 and Table 3 or Table 4 and Table 5) 5 9 Supplement Tables of method B 9 Table 1 3 Table 2 Method A Groups
13、A and B Lot-by-lot 6 Table 3a Method A Group C Periodic tests 7 Table 3b Method A Group D Periodic tests 8 Table 4a Method B Group A Lot-by-lot 9 Table 4b Method B Group B Lot-by-lot 10 Table 5a Method B Group C Periodic tests 11 Table 5b Method B Group D Periodic tests 12BSQC 760101:1997 BSI 10-199
14、9 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electronic components released by one par
15、ticipating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. In the preparation of detail specifications, the content of3.5 of the generic specification and of2.3 and3.2 of the
16、sectional specification is taken into account. The blank detail specification is one of a series of blank detail specifications for semiconductor devices and is used with the following publications: IEC 60748-20/QC 760000, Semiconductor devices Integrated circuits Part20: Generic specification for f
17、ilm integrated circuits and hybrid film integrated circuits. IEC 60748-20-1/QC 763000, Semiconductor devices Integrated circuits Part20: Generic specification for film integrated circuits and hybrid film integrated circuits Section 1: Requirements for internal visual examination. IEC 60748-21/QC 760
18、100, Semiconductor devices Integrated circuits Part21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures. a) For catalogue circuits, the detail specifications are published, and their format and minimum content
19、shall conform with Table 2 Table 4. b) For custom circuits, the detail specifications are not published, and their format and content are optional. However, the customers requirements in relation to form, fit and function are to be verified, either by the routine tests in maintenance of qualificatio
20、n approval, or as specified in the detail specification, or by both in combination. c) For CQCs, the detail specifications are not published; their format and content are to be conform with Table 2 Table 4. When a circuit is sold uncompleted for completion by another party, the completed product doe
21、s not qualify for release under the IEC system unless all processes are carried out by one or more approved manufacturers.BSQC 760101:1997 2 BSI 10-1999 Required information Numbers shown in brackets on this page and the following pages correspond to the following items of required information, whic
22、h should be entered in the spaces provided on the next page of this specification. Identification of the detail specification 1 The IEC or National Standards Organization under whose authority the detail specification is issued. 2 The IECQ number of the detail specification, data of issue and any fu
23、rther information required by the national system. 3 The IEC or national number and issue number of the generic and sectional specifications. 4 The national number of the detail specification, if different from IECQ number. Identification of film integrated circuits and hybrid film integrated circui
24、ts 5 A short description of the technique and the type or function of the circuit. 6 Information on typical construction (where applicable). 7 An outline drawing with main dimensions which are of importance for interchangeability and/or reference to the national or international documents for outlin
25、es. Alternatively, this drawing may be given in an appendix to the detail specification. 8 Assessment level and for circuits the suffix “N”, if “non-qualified” added components are used. 9 Reference data on the most important properties, to allow comparison between the various circuit types when a r
26、ange of types is connected. NOTEFor test procedures two alternatives are available: Method A or method B. However, it is not permitted to change the methods between tests. In general, method A is more suitable for passive component based film integrated circuits, whereas method B is more applicable
27、to semiconductor integrated circuit technology based film integrated circuits. The clauses given in square brackets on the next page of this standard, which forms the front page of the detail specification, are intended for guidance to the specification writer and shall not be included in the detail
28、 specification. When confusion may arise as to whether the paragraph is only instruction to the writer or not, the paragraph shall be enclosed in brackets.BSQC 760101:1997 BSI 10-1999 3 NOTE 1The non-dimensioned details do not affect the performance of the circuit. NOTE 2The terminations are (not) s
29、uitable for soldering. NOTE 3The terminations are (not) suitable for printed wiring applications. Table 1 Name (address) of responsible NAI (and possibly of body from which specification is available). 1 Number of IECQ detail specification, plus issue number and/or date. QC 760101 . 2 ELECTRONIC COM
30、PONENT OF ASSESSED QUALITY IN ACCORDANCE WITH: 3 National number of detail specification. This box need not be used if national number repeats IECQ number. 4 Generic specifications: IEC 60748-20/QC 760000 and IEC 60748-20-1/QC 763000 Sectional specification: IEC 60748-21/QC 760100 and national refer
31、ences if different. DETAIL SPECIFICATION FOR: FILM INTEGRATED CIRCUITS ANDHYBRIDFILMINTEGRATED CIRCUITS 5 Type number(s) of the relevant device(s). Ordering information: see clause4 of this standard. Mechanical description 7 Short description 6 Outline references: Substrate material: Alumina IEC 601
32、91-2 . mandatory if available and/or national if there is no IEC outline. Encapsulation: cavity or non-cavity. Outline drawing: (see Table 1) may be transferred to or given with more details in clause 6 of this standard. Terminal identification: Drawing showing pin assignments, including graphical s
33、ymbols. Categories of assessed quality 8 Marking: letters and figures From 3.4 of the generic specification. The detail specification shall prescribe the information to be marked on the above if any. See 2.6 of the generic specification and/or clause 3 of this standard. Reference data 9 Information
34、about manufacturers who have components qualified to this detail specification is available in the current qualified products list. Where a range of circuits has the same basic function and is made in the same technology and envelope, this table will be used to detail the differences in characterist
35、ics.BSQC 760101:1997 4 BSI 10-1999 1 Characteristics and conditions of use The detail specification shall give all the information needed to adequately describe: 1.1 The performance and design of the circuit a) Schematic circuit diagram b) Resistor and capacitor values, tolerances, matching, trackin
36、g, power dissipation, temperature coefficient of resistors and capacitors, where applicable c) Limitations on resistance of conductors, where applicable d) Test circuit or method and performance limits e) Added components (see 3.6.2 of the generic specification) 1.2 Limiting conditions of use Exampl
37、es: Package dimensions Operating temperature range Storage temperature range Vibration, shock, bump, severities Climatic category Maximum voltage NOTEAny significant interaction between the details specified in1.1 and1.2 should be stated. 1.3 Derating See 2.2 of the sectional specification. (Where a
38、pplicable, the derating curve shall be included in the detail specification.) 2 Recommended methods of mounting In accordance with2.3.2 of the sectional specification. 3 Marking The marking of the circuit and primary package shall be in accordance with the requirements of2.6 of the generic specifica
39、tion. NOTEThe details of the marking of the circuit and primary package are given in full in the detail specification. 4 Ordering information Orders for circuits covered by this specification shall contain the following information: a) film integrated circuits and hybrid film integrated circuits; b)
40、 number and issue of the detail specification with style reference and assessment level, if appropriate; c) function of the circuit, if appropriate; d) basic functional characteristics with tolerance, if appropriate. 5 Certified records of released lots 5.1 Catalogue circuits Certified records of re
41、leased lots shall conform to3.7.3.1 of the generic specification. 5.2 Custom-built circuits The detail specification shall define the requirements for certified records of released lots; customers are advised to refer to3.7.3.2 of the generic specification. 6 Additional information The detail specif
42、ication may include information (which is not normally required to be verified by the inspection procedure) such as circuit diagrams, curves, drawings and notes for the clarification of the detail specification.BSQC 760101:1997 BSI 10-1999 5 7 Additional or increased severities or requirements to th
43、ose specified in the generic and/or sectional specification NOTEAdditions or increased requirements should be specified only when essential. 8 Inspection requirements (see Table 2 and Table 3 or Table 4 and Table 5) For qualification approval the procedure shall be in accordance with the sectional s
44、pecification. For quality conformance inspection, the test schedule includes sampling, periodicity, severities and requirements. In the following tables: Subclause numbers of tests and performance requirements refer to the generic specification. Inspection levels (ILs) and AQLs, LTPDs, fixed sample
45、size and periodicity, given in Table 3 or Table 7 of the sectional specification, are to be inserted in the detail specification. p = periodicity (in months) n = sample size c = acceptance-criterion (permitted number of defectives) D = destructive ND = non-destructive IL = inspection level IEC 60410
46、 AQL = acceptable quality level LTPD= lot tolerance percentage defective. BSQC 760101:1997 6 BSI 10-1999 Table 2 Method A Groups A and B Lot-by-lot Subclause numbers, tests and test sequences D or ND Test conditions Sample size and criterion of acceptability Performance requirements Screening ND See
47、 Table 4 of sectional specification 4.3.1 a) Precap visual inspection Initial measurements Required/Not required 4.5.14 b) Enduranceh as burn-in Final measurements Group A IL AQL Inspection to be conducted on a sampling basis, lot-by-lot Subgroup A1 ND 4.3.2 External visual examination and marking e
48、xamination Subgroup A2 ND 4.4.11 Major static and dynamic electrical characteristics at room temperature a Subgroup A3 ND 4.4.11 Major static and dynamic electrical characteristics at extreme operating temperatures Group B Inspection to be conducted on a sampling basis, lot-by-lot Subgroup B1 4.5.10
49、 Solderability bc Subgroup B2 ND 4.3.3 Dimensions a Not mandatory if 100 % screened. b Use of electrical rejects permitted. c This test is destructive except where the lead finish is not materially altered by the test or when the customer is prepared to accept the solderability test sample. 168 +0 8BSQC 760101:1997 BSI 10-1999 7 Table 3a Method A Group C Periodic tests Subclause numbers, tests and test sequence
