1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Expand vendors resistance range. Add pure tin prohibition paragraph. Editorial changes throughout. 22 MAR 06 M. Radecki B Add manufacturer eligibility, and high power pulse paragraphs. Editorial changes throughout. 10 MAR 11 M. Radecki DRAFT Prepared in acc
2、ordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV B B B B B B B B PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Dennis L. Cross DESIGN ACTIVITY: DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 28 June 2004 CHECKED BY Andrew R. Ernst TITLE RESISTOR, CHIP, FIX
3、ED, FILM, LOW VALUES, HIGH POWER, 1.5 WATTS, STYLE 2512 APPROVED BY Kendall A. Cottongim SIZE A CODE IDENT. NO. 037Z3 DWG NO. 04032 REV B PAGE 1 OF 8 AMSC N/A 5905-E752 CURRENT DESIGN ACTIVI Y CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot fo
4、r ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 04032 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, film, chip resistor, style 2512. 1.2 Part or Ide
5、ntifying Number (PIN) The complete PIN is as follows: 04032 - K 10D0 | | | | | | Drawing Characteristic Resistance and number (see 3.3.6) resistance tolerance (see 3.3.1) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, s
6、tandards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliabilit
7、y, Established Reliability, Space Level, General Specification For DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Method Standard Electronic and Electrical Component Parts. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for
8、Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phil
9、adelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however,
10、 supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified herein. 3.2 Interface and physical dimensions. The interface and physical dim
11、ensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 04032 REV B PAGE 3 Configuration A Configurat
12、ion B A B C D E 0.259 +0.009 -0.015 0.124 0.005 0.015/0.033 0.020 0.005 0.020 0.005 Inches mm 0.005 0.13 0.009 0.23 0.015 0.38 0.020 0.51 0.033 0.84 0.124 3.15 0.259 6.58 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The pictorial view is repres
13、entative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspect of the device are acceptable. FIGURE 1. Chip resistor. 3.3 Electrical characteristics. 3.3.1 Resistance and resistance tolerance. The nomina
14、l resistance expressed in ohms is identified by four characters consisting of three digits and a letter. The letter is used simultaneously as a decimal point, multiplier, and resistance tolerance designator in accordance with MIL-PRF-55342 and herein (see table I). Minimum and maximum resistance val
15、ues shall be as specified in 3.3.2, 3.3.6, and 6.7. Resistance values not listed in the “10 to 100“ decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to this drawing. The standard values for every decade shall follow the sequence demonstrate
16、d for the “10 to 100“ decade table specified in MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 04032 REV B PAGE 4 3.3.2 Resistance range. The resistanc
17、e range shall be from 1 ohm to 15 megohms as specified (see 3.3.6). 3.3.3 Resistance tolerance. The resistance tolerance for chip resistors shall be 0.1 percent, 1 percent, and 5 percent in accordance with MIL-PRF-55342 and table I herein. TABLE I. Designator of resistance values for resistance tole
18、rances. Designator for 0.1 percent tolerance Resistance (ohms) 1A00 to 9A88 inclusive 1.00 to 9.88 inclusive 10A0 to 98A8 inclusive 10.0 to 98.8 inclusive 100A to 988A inclusive 100 to 988 inclusive 1B00 to 9B88 inclusive 1,000 to 9880 inclusive 10B0 to 98B8 inclusive 10,000 to 98800 inclusive 100B
19、to 988B inclusive 100,000 to 988,000 inclusive 1C00 to 9C88 inclusive 1,000,000 to 9,880,000 inclusive 10C0 to 10,000,000 to Designator for 1.0 percent tolerance Resistance (ohms) 1D00 to 9D88 inclusive 1.00 to 9.76 inclusive 10D0 to 98D8 inclusive 10.0 to 97.6 inclusive 100D to 988D inclusive 100 t
20、o 976 inclusive 1E00 to 9E88 inclusive 1,000 to 9760 inclusive 10E0 to 98E8 inclusive 10,000 to 97600 inclusive 100E to 988E inclusive 100,000 to 976,000 inclusive 1F00 to 9F88 inclusive 1,000,000 to 9,760,000 inclusive 10F0 to 10,000,000 to Designator for 5.0 percent tolerance Resistance (ohms) 1J0
21、0 to 9J88 inclusive 1.00 to 9.10 inclusive 10J0 to 98J8 inclusive 10.0 to 91.0 inclusive 100J to 988J inclusive 100 to 910 inclusive 1K00 to 9K88 inclusive 1,000 to 9100 inclusive 10K0 to 98K8 inclusive 10,000 to 91000 inclusive 100K to 988K inclusive 100,000 to 910,000 inclusive 1L00 to 9L88 inclus
22、ive 1,000,000 to 9,100,000 inclusive 10L0 to 10,000,000 to 3.3.4 Power rating. The power rating shall be 1.5 watts at +70C derated to zero power at +150C (see figure 2). 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 200 volts. 3.3.6 Resistance temperature coefficient.
23、 The resistance temperature coefficient shall be in accordance with MIL-PRF-55342 and not exceed the values specified below: Characteristic Resistance range Resistance tolerance E and H 100 ohms thru 5.62 Megohms 0.1 percent E and H 10 ohms thru 5.62 Megohms 1.0 percent K and M 1.0 ohm thru 15 Megoh
24、ms 1.0 percent K and M 1.0 ohm thru 15 Megohms 5.0 percent Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 04032 REV B PAGE 5 3.3.7 Termination. Termination material s
25、hall be in accordance with MIL-PRF-55342, code letter B. 3.3.7.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
26、percent lead, by mass (see 6.3). 3.3.8 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.9 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damag
27、e. 3.3.10 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed (0.5 percent 0.01 ohm). 3.3.11 Solderability. When resistors are tested as specified in 4.9,
28、they shall meet the criteria for surface mount leadless components in the test method. FIGURE 2. Derating curve. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (
29、see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the materia
30、l meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.6 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Products List for at lea
31、st one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. * 3.6.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3
32、.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO.
33、 037Z3 DWG NO. 04032 REV B PAGE 6 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this
34、 document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1
35、 Group A inspection. Group A inspection shall consist of the inspections specified in table II, and shall be made on the same set of sample units, in the order shown. 4.4.1.1.1 Subgroup 1. Subgroup I tests shall be performed on a production lot basis on 100 percent of the product supplied under this
36、 document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change li
37、mit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be r
38、andomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342. TABLE II. Group A inspection. Inspection Requirement Method Sam
39、pling procedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.8 3.3.9 3.3.10 3.3.8 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual inspection 3.2, 3.4, 3.7 4.5 13 samples, 0 failures Subgroup 3 Solderability 3.3.11 4.9 See 4.4.1.1.3 4.4.2 Group B inspection. Group B inspe
40、ction shall be in accordance with MIL-PRF-55342. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to ve
41、rify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS
42、, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 04032 REV B PAGE 7 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with met
43、hod 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resistor sample units shall be mounted on a test fixture. b. Test temperature: +70C 5C. c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at
44、 +25C. d. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied intermittently, 1.5 hours “on”, and 0.5 hour “off”, for the applicable number of hours and applicable test temperature. “On time“ shall be three quarters of the total elaps
45、ed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. e. Duration: 100 hours 4 hours. f. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 minutes and
46、stabilized prior to final resistance measurement. g. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requireme
47、nts shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite requirements. Packaging requirements are maintained by the In
48、ventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services System Command. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the
49、responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Resistors are also for use in surface mount applications. 6.2 Ordering data. The contract or p
