1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new vendor. Editorial changes throughout. 20 APR 10 M. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV A A A A A A A A PAGES 1 2 3 4 5 6 7 8 Original date of drawing: PREPARED BY Andrew R. Ernst DEFENSE SU
2、PPLY CENTER, COLUMBUS COLUMBUS, OH 11 February 2009 CHECKED BY Andrew R. Ernst TITLE RESISTOR, CHIP, FIXED, FILM, STYLE 0201 APPROVED BY Michael Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 07009 REV A PAGE 1 OF 8 AMSC N/A 5905-E715 Provided by IHSNot for ResaleNo reproduction or networking permitte
3、d without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07009 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a 0.020 x 0.010 chip resistor. 1.2 Part or Identifying Number (PIN). The complete PIN is shown in the f
4、ollowing example: 07009 K 1001 F B P Drawing number Characteristic (see 3.3.1) Resistance value (see 3.3.2) Tolerance (see 3.3.4) Termination material (see 3.3.5) Screening level (see 3.3.6) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifica
5、tions and standards form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, E
6、stablished Reliability Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electric
7、al, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise n
8、oted herein or in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption
9、 has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified herein. 3.2 Interface and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-55342 and herei
10、n (see figure 1). 3.3 Electrical characteristics. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07009 REV A PAGE 3 3.3.1 Resistance temperature characteristic. The r
11、esistance temperature characteristic shall not exceed the values specified below: Characteristic Resistance range K (100 ppm/C) 47 ohms to 1 megohms L (200 ppm/C) 10 ohms to 47 ohms A B C D E 0.6 0.05 0.3 0.05 0.23 0.05 0.15 0.07 0.15 +0.05 -0.10 NOTES: 1. Dimensions are in millimeters. 2. Inch equi
12、valents are given for general information only. 3. The pictorial view of the style above does not depict the actual size and is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspe
13、cts of the device are acceptable. FIGURE 1. Chip resistor. 3.3.2 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less th
14、an 100 ohms, or when fractional values of an ohm are required, the letter “R“ shall be substituted for one of the significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in 3.3.3. Resistance values not listed in the “10
15、 to 100“ decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to the specification. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100“ decade table specified in MIL-PRF-55342. mm Inches 0.05 0.002 0.
16、07 0.003 0.10 0.004 0.15 0.006 0.23 0.009 0.30 0.012 0.60 0.024 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07009 REV A PAGE 4 TABLE I. Resistance value designatio
17、ns. Designation Resistance ohms 10R0 to 98R8 incl. 1000 to 9880 incl. 1001 to 9881 incl. 1002 to 9882 incl. 1003 to 9883 incl. 1004 10.0 to 98.8 incl. 100.0 to 988.0 incl. 1,000.0 to 9,880.0 incl. 10,000.0 to 98,800.0 incl. 100,000.0 to 98,800.0 incl. 1,000,000.0 3.3.3 Resistance range. The resistan
18、ce range shall be from 10 ohms to 1 megohms (see 3.3.1). 3.3.4 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II. TABLE II. Resistance tolerance. Symbol Resistance tolerance percent F J 1.0 5.0 3.3.5 Termination. Termination material shall be in accordan
19、ce with MIL-PRF-55342 code letter B. 3.3.5.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mas
20、s (see 6.3). 3.3.6 Screening level. Resistors are available screened (S) or partially screened (P) as specified in 4.4.1.1.1.1, 4.4.1.1.1.2, and table III herein. 3.3.7 Power rating. The power rating for chip resistors shall be 0.05 watts at +70C derated to zero power at +150C (see figure 2). FIGURE
21、 2. Derating curve. 3.3.8 Voltage rating. The maximum continuous working voltage shall not exceed 30 volts. 3.3.9 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. Provided by IHSNot for ResaleNo reprodu
22、ction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07009 REV A PAGE 5 3.3.10 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage. 3.3.11 Power conditio
23、ning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed (0.5 percent +0.01 ohm). 3.3.12 Solderability. The requirement for solderability shall be as specified in MIL-PRF-553
24、42 and 4.4.1.1.3 herein. 3.4 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes
25、 economically advantageous life cycle costs. 3.5 Marking. Marking is not required on the resistor; however, each unit package shall be marked with the PIN assigned herein (see 1.2), manufacturers identification code and date and lot codes. 3.6 Manufacturer eligibility. To be eligible for listing as
26、an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DSCC-VA. 3.6.1 Certificate of compliance. A certificate of
27、compliance shall be required from manufacturers requesting to be listed as an approved source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product a
28、ssurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Failure rate qualification. The failure rate qualification specified in MIL-PRF
29、-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table III, and
30、 shall be made on the same set of sample units, in the order shown. Part per million testing and verification as specified in MIL-PRF-55342 is not applicable to this document. 4.4.1.1.1 Subgroup I. 4.4.1.1.1.1 Screened (S). Screened (S) tests shall be performed on a production lot basis on 100 perce
31、nt of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the spe
32、cified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.1.2 Partially screened (P). Partially screened tests shall be as specified in 4.4.1.1.1.1 except only the 100 percent dc resistance test shall be performed (see 6.2d). Provided by IHSNot for ResaleNo reproduction o
33、r networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07009 REV A PAGE 6 4.4.1.1.2 Subgroup II. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected, if one or
34、 more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against this document. 4.4.1.1.3 Subgroup III. A sample of f
35、ive parts shall be randomly selected, if one or more defects are found, the lot shall be rejected/rescreened in accordance with MIL-PRF-55342. TABLE III. Group A inspection. Inspection Requirement paragraph Method paragraph Sampling procedure Subgroup I DC resistance Thermal shock Power conditioning
36、 DC resistance 3.3.9 3.3.10 3.3.11 3.3.9 4.6 4.7 4.8 4.6 100 percent Subgroup II Visual inspection 3.2, 3.4, 3.5 4.5 13 samples 0 failures Subgroup III Solderability 3.3.12 4.9 5 samples 0 failures 4.4.1.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342 except that t
37、he force applied for Subgroup 2, solder mounting integrity shall be .5 kilogram. 4.4.1.3 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. R
38、esistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Ther
39、mal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resistors sample units shall be loaded on a test fixture. b. Test
40、temperature: +70C 5C. c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDEN
41、T NO. 037Z3 DWG NO. 07009 REV A PAGE 7 d. Operating conditions: Rated dc continuous working voltage or filtered, nonfiltered full-wave rectified ac voltage shall be applied intermittently, 1 hour and 30 minutes “on”, and 30 minutes “off”, for the applicable number of hours and applicable test temper
42、ature. “On time“ shall be three quarters of the total elapsed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. e. Duration: 100 hours 4 hours. f. Stabilization and final dc resistance measurement: Resistors shal
43、l be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. g. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342 and 4.4.1.1.3 herei
44、n. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to a
45、scertain requisite requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services System Command. Packaging data retrieval is available from the managing Military Departments or D
46、efense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature, which may be helpful; but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick
47、or thin film circuits where microcircuitry is intended, also, for use in surfacing mounting applications. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or certificat
48、e of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Packaging requirements. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements (see 4.4.1.3). 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal co
