1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added new paragraph for resistance. Editorial changes throughout. 13 JUL 89 D. Moore B Change voltage rating from 40 V. to 50 V. Add new characteristic and specify resistance ranges. Allow fixtures to be used for power condition. Add new vendor part number.
2、 Editorial changes throughout. 27 FEB 92 D. Moore C Added new resistance tolerances, values, and characteristics. Revise to present DoD policy requirements. Editorial changes throughout. 12 JUL 00 Kendall A. Cottongim D Extend resistance range of source of supply. Update to present DoD policy requir
3、ements. 28 FEB 05 Kendall A. Cottongim E Add pure tin paragraph. Add new source of supply. Editorial changes throughout. 22 JAN 07 Michael Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with AS
4、ME Y14.100 Selected item drawing REV STATUS OF PAGES REV E E E E E E E E E PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Allan R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date of drawing 30 March 1988 CHECKED BY David W. Withrow TITLE RESISTOR, CHIP, FIX
5、ED, FILM, .200 WATT, STYLE 0705 APPROVED BY David W. Withrow SIZE A CODE IDENT. NO. 14933 DWG NO. 88018 REV E PAGE 1 OF 9 AMSC N/A 5905-E601 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDE
6、NT NO. 14933 DWG NO. 88018 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, film, .200 watt, .075 X .050 chip resistor. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: 88018 - * * Drawing number Characteristic (see 3.3.6) Resistance and resis
7、tance tolerance (see 3.3.1) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents
8、are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic a
9、nd Electrical Component Parts. MIL-STD-790 - Established Reliability and High Reliability Qualified Product List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online
10、at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein
11、, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specifi
12、ed herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SI
13、ZE A CODE IDENT NO. 14933 DWG NO. 88018 REV E PAGE 3 A B C D E 0.080 0.006 .050 .005 .015/.033 .016 .008 .015 .005 Inches mm .005 0.13 .006 0.15 .008 0.20 .015 0.38 .016 0.41 .033 0.84 .050 1.27 .080 2.03 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information onl
14、y. 3. The pictorial view is representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspect of the device are acceptable. FIGURE 1. Chip resistor. Provided by IHSNot for ResaleNo reproduction or net
15、working permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88018 REV E PAGE 4 3.3 Electrical characteristics. 3.3.1 Resistance and resistance tolerance. The nominal resistance expressed in ohms is identified by four characters con
16、sisting of three digits and a letter. The letter is used simultaneously as a decimal point, multiplier, and resistance tolerance designator in accordance with MIL-PRF-55342 and herein (see table I). Minimum and maximum resistance values available shall be as specified in 3.3.2, 3.3.6, and 6.6. Resis
17、tance values not listed in the “10 to 100“ decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to this drawing. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100“ decade table specified in MIL-PRF-5
18、5342. TABLE I. Designator of resistance values for resistance tolerances. Designator for 0.1 percent tolerance Resistance (ohms) 1A00 to 9A88 inclusive 1.00 to 9.88 inclusive 10A0 to 98A8 inclusive 10.0 to 98.8 inclusive 100A to 988A inclusive 100 to 988 inclusive 1B00 to 9B88 inclusive 1,000 to 988
19、0 inclusive 10B0 to 98B8 inclusive 10,000 to 98800 inclusive 100B to 988B inclusive 100,000 to 988,000 inclusive 1C00 to 9C88 inclusive 1,000,000 to 9,880,000 inclusive 10C0 10,000,000Designator for 1.0 percent tolerance Resistance (ohms) 1D00 to 9D88 inclusive 1.00 to 9.76 inclusive 10D0 to 98D8 in
20、clusive 10.0 to 97.6 inclusive 100D to 988D inclusive 100 to 976 inclusive 1E00 to 9E88 inclusive 1,000 to 9760 inclusive 10E0 to 98E8 inclusive 10,000 to 97600 inclusive 100E to 988E inclusive 100,000 to 976,000 inclusive 1F00 to 9F88 inclusive 1,000,000 to 9,760,000 inclusive 10F0 10,000,000Design
21、ator for 5.0 percent tolerance Resistance (ohms) 1J00 to 9J88 inclusive 1.00 to 9.10 inclusive 10J0 to 98J8 inclusive 10.0 to 91.0 inclusive 100J to 988J inclusive 100 to 910 inclusive 1K00 to 9K88 inclusive 1,000 to 9100 inclusive 10K0 to 98K8 inclusive 10,000 to 91000 inclusive 100K to 988K inclus
22、ive 100,000 to 910,000 inclusive 1L00 to 9L88 inclusive 1,000,000 to 9,100,000 inclusive 10L0 10,000,0003.3.2 Resistance range. The resistance range shall be from 1 ohm to 10 megohms. 3.3.3 Resistance tolerances. The resistance tolerances for chip resistors shall be 0.1 percent, 1 percent, and 5 per
23、cent in accordance with MIL-PRF-55342 and table I herein. 3.3.4 Power rating. The power rating for chip resistors shall be 0.200 watt at +70C derated to zero power at +150C (see figure 2). 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 50 volts. Provided by IHSNot for
24、ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88018 REV E PAGE 5 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be in accordance with MIL-PRF-55342 a
25、nd not exceed the values specified below: Characteristic Resistance range Resistance tolerance E and H 100 ohms thru 1.5 megohms 0.1 percent E and H 10 ohms thru 1.5 megohms 1.0 percent K and M 1 ohm thru 10 megohms 1.0 percent K and M 1 ohm thru 10 megohms 5.0 percent 3.3.7 Termination. Termination
26、 material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.7.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a mi
27、nimum of 3 percent lead, by mass (see 6.4). 3.3.8 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.9 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mecha
28、nical damage. 3.3.10 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed (0.5 percent 0.01 ohm). 3.3.11 Solderability. When resistors are tested as specifi
29、ed in 4.9, they shall meet the criteria for surface mount leadless components in the test method. FIGURE 2. Derating curve. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specifi
30、ed herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88018 R
31、EV E PAGE 6 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically
32、 advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or ap
33、pearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product l
34、evel qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1 Group A inspection. Gro
35、up A inspection shall consist of the inspections specified in table II, and shall be made on the same set of sample units, in the order shown. 4.4.1.1.1 Subgroup 1. Subgroup I tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors tha
36、t are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnish
37、ed on contracts. 4.4.1.1.2 Subgroup 2. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one
38、 or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342. 4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342.
39、 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, p
40、hysical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88018
41、REV E PAGE 7 TABLE II. Group A inspection. Inspection Requirement Method Sampling procedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.8 3.3.9 3.3.10 3.3.8 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual inspection 3.2, 3.4, 3.7 4.5 13 samples, 0 failures Subgroup 3 So
42、lderability 3.3.11 4.9 See 4.4.1.1.3 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. T
43、he following details and exceptions shall apply: a. Method of mounting: Chip resistor sample units shall be mounted on a test fixture. b. Test temperature: +70C 5C. c. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied intermittently
44、, 1.5 hours “on”, and 0.5 hour “off”, for the applicable number of hours and applicable test temperature. “On time“ shall be three quarters of the total elapsed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. d
45、. Duration: 100 hours 4 hours. e. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. f. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.
46、9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor pers
47、onnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Pa
48、ckaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELE
49、CTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88018 REV E PAGE 8 6. NOTES (This section contains information of a general or explanatory nature, which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircui
